Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 1/3
HSA1538
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HSA1538 is designed for high-definition CRT display video output,
wide-band amplifier.
Features
High fT: fT=500MHz
•
High breakdown voltage: BVCEO=120Vmin
•
Small reverse transfer capacitance
•
(Ta=25°C)
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature....................................................................................................... -50 ~ +150 °C
Junction Temperature ............................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C) ............................................................................................... 1.3 W
Total Power Dissipation (Tc=25°C)................................................................................................... 8 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage ............................................................................................... -120 V
BVCEO Collector to Emitter Voltage ............................................................................................ -120 V
BVEBO Emitter to Base Voltage ...................................................................................................... -3 V
IC Collector Current.................................................................................................................. -200 mA
Icp Peak Collector Current (Pulse)............................................................................................ -400 mA
Electrical Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -120 - - V IC=-10uA
BVCEO -120 - - V IC=-1mA
BVEBO -3 - - V IE=-100uA
ICBO - - -0.1 uA VCB=-80V, IE=0
IEBO - - -0.1 uA VBE=-2V, IC=0
*VCE(sat) - - -1 V IC=-30mA, IB=-3mA
*VBE(sat) - - -1 V IC=-30mA, I B=-3mA
*hFE1 60 160 320 IC=-10mA, VCE=-10V
*hFE2 40 - - IC=-100mA, VCE=-10V
fT - 400 - MHz VCE=-10V, IC=-50mA
Cob - 2.8 - pF VCB=-30V, f=-1MHz
Cre - 2.2 - pF VCB=-30V, f=-1MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank D E F
Range 60-120 100-200 160-320
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 2/3
1000
Current Gai n & Collector Current
100
hFE
10
1
1 10 100 1000
10000
Saturation Volt age & Coll ector Cu rren t
VCE=10V
Collector Curren t (m A )
10000
1000
100
Saturation Voltage (mV)
100
10
Saturation Volt age & Coll ector Cu rrent
CE(sat)
V
@ IC=10I
1
10 100 1000
Collector Cur rent (mA)
Capacitance & Reverse-Biased Volt age
B
1000
BE(sat)
V
Satu r ation Voltage (mV)
100
1 10 100 1000
Collector Curren t (m A )
@ IC=10I
B
Cut off Fr equency & IC
1000
fT
100
Cutoff Frequency (MHz)
10
Capacitan ce (Pf)
Cob
1
1 10 100
Reverse Biased Volt a ge ( V)
Safe Operating Area
1
0.1
PT=1 ms
Collector Curren t (A)
PT=100 ms
PT=1 s
10
1 10 100 1000
Collector Curren t (mA)
0.01
1 10 100 1000
Forwar d Voltage (V)
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126ML Dimension
Spec. No. : HE6601-C
Issued Date : 1993.03.15
Revised Date : 2000.10.01
Page No. : 3/3
Marking :
A
D
C
N
M L K
E
F
3
2
1
O
H
G
J
B
I
HSMC Logo
Part Number
Date Code
Ink Marking
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
3-Lead TO-126ML Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : D
DIM
Min. Max. Min. Max.
A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56
B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84
C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00
D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62
E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12
G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14
H 0.0462 0.0562 1.17 1.42
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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