Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 1/3
HSA1015
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HSA1015 is designed for use in driver stage of AF amplifier and
general purpose amplification.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)............................................................................... 400 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e....................................................................................... -50 V
VCEO Collector to Emitter Voltage .................................................................................... -50 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -150 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -50 - - V IC=-100uA, IE=0
BVCEO -50 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-50V, IE=0
IEBO - - -100 nA VEB=-5V, IC=0
*VCE(sat) - - -300 mV IC=-100mA, IB=-10mA
*VBE(sat) - - -1.1 V IC=-100mA, IB=-10mA
*hFE1 120 - 700 VCE=-6V, IC=-2mA
*hFE2 25 - - VCE=-6V, IC=-150mA
fT 80 - - MHz VCE=-10V, IC=-1mA, f=100MHz
Cob - - 7 pF VCB=-10V, f=1MHz, IE=0
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank Y GR BL
Range 120-240 200-400 350-700
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 2/3
1000.0
100.0
hFE
10.0
1.0
0.1 1 10 100 1000
10.00
Current Gai n & Collector Current
VCE=6V
Collector Curren t (m A )
Capacitance & Reverse-Biased Voltage
Cob
1
0.1
Saturation Voltage (V)
0.01
1000
100
Saturation Volt age & Coll ector Cu rrent
BE(sat)
V
CE(sat)
V
0.01 0.1 1 10 100 1000
Collector Current (mA)
@ IC=10I
@ IC=10I
B
B
Cut off Fr equency & Collector Cu rrent
VCE=10V
Capac itanc e (pF)
1.00
0.1 1 10 100
10000
1000
(mA)
C
100
Cpllector Curren t-I
10
1
1 10 100
Reverse-Biased Vol t ag e ( V)
Safe Operating Area
PT=1ms
PT=100ms
PT=1s
Forwar d Biased Vol tage-VCE (V)
10
Cutoff Frequency (MHz)
1
1 10 100 1000
Collector Current (mA)
PD-Ta
450
400
350
300
250
200
150
Power Dissipation-PD(mW)
100
50
0
0 50 100 150 200
Ambient Temper atur e- Ta(oC)
HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6512-B
Issued Date : 1992.11.25
Revised Date : 2000.09.15
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H C 0.5000 - 12.70 - I D 0.0142 0.0220 0.36 0.56
E-*0.0500 -
1.27
*
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
1
α
2
α
3
α
-
-
-
0.1000 -
*
0.0500 -
*
5
°
*
2
°
*
2
°
*
-
-
-
*:Typical
2.54
*
1.27
*
5
°
*
2
°
*
2
°
*
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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