Datasheet HRF502A Datasheet (HIT)

Page 1
HRF502A
Silicon Schottky Barrier Diode for Rectifying
ADE-208-245C(Z)
Features
• Low forward voltage drop and suitable for high effifiency rectifying.
• DO-214 is suitable for high density surface mounting and high speed assembly.
Type No. Laser Mark Package Code
HRF502A 502A DO-214
Rev 3
Sep. 1997
Outline
Cathode mark
Mark
502A
12
Lot No.
1. Cathode
2. Anode
Page 2
HRF502A
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Value Unit
Repetitive peak reverse
*1
V
RRM
voltage Average rectified current I Non-Repetitive peak
*1
o
*2
I
FSM
forward surge current Junction temperature Tj 125 °C Storage temperature Tstg -40 to +125 °C
Note: 1. See from Fig.4 to Fig.7 Note: 2. 10msec half sine wave 1 pulse
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
Forward voltage V Reverse current I
F
R
ESD-Capability — 250 — — V C=200pF , R=0Ω , Both forward and reverse
Thermal resistance Rth(j-a) — 90 — °C/W Glass epoxy board
Rth(j-c) — 42 — Tc=25°C
Note: 1. Glass epoxy board
— — 0.40 V IF = 5A — — 1.0 mA VR = 20V
20 V
5A 100 A
direction 1 pulse.
*1
6.8
Land size
2.0
3.5
Unit: mm
2
Page 3
Main Characteristic
HRF502A
2
10
Pulse test
10
F
1.0
-1
10
Ta=75°C
Ta=25°C
Forward current I (A)
-2
10
-3
10
0 0.2
Forward voltage V (V)
0.4
F
Fig.1 Forward current Vs. Forward voltage
3
10
f=1MHz Pulse test
-2
10
Pulse test
Ta=75°C
-3
10
R
10
-4
Ta=25°C
Reverse current I (A)
-5
10
-6
0.60.1 0.50.3
10
10
5
0
Reverse voltage V (V)
15
20
R
25
Fig.2 Reverse current Vs. Reverse voltage
2
10
Capacitance C (pF)
10
1.0 Reverse voltage V (V)
Fig.3 Capacitance
R
Vs. Reverse voltage
4010
3
Page 4
HRF502A
Main Characteristic
5
0A
(W)
d
t
4
Tj =25°C
3
t
\
D=
T
T
D=1/6
Sin
D=1/3 D=1/2
2
1
Forward power dissipation P
0
0
2
1
Forward current I
3
F
(A)
DC
6
54
Fig.4 Forward p ower dissipation Vs. Forward current
6
VR=V
RRM
Tj =125°C
/2
5
DC
(A)
O
4
Sin
D=1/2
3
D=1/3
12
0V
D=5/6
D=2/3
D=1/2
(W)
d
10
8
6
T
Tj =125°C
t
t
\
D=
T
Sin
4
Reverse power dissipation P
2
0
0
Reverse voltage V
5
1510
(V)
R
20
Fig.5 Reverse power dissipation Vs. Reverse voltage
6
(A)
VR=V Tj =125°C
5
O
DC
4
Glass epoxy PCB
RRM
/2
3
2
Average forward current I
D=1/6
1
0
-25
25 500
Case temperature
75
Tc (°C)
100
Fig.6 Average forward current Vs. Case temperature
4
125
2
Average forward current I
1
Sin
D=1/2
0
-25
25 500
Ambient temperature
Fig.7 Average forward current Vs. Ambient temperature
75
Ta (°C)
100
125
Page 5
Package Dimensions
HRF502A
Unit : mm
Cathode Mark
502A
7.0 ± 0.2
8.0 ± 0.3
1.2 ± 0.3
21
3.0 ± 0.2
4.0 ± 0.2
Lot No.
0.25
2.1 ± 0.2
Hitachi Code JEDEC Code
EIAJ Code Weight (g)
1 Cathode 2 Anode
DO-214 DO-214
—
0.16
5
Page 6
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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