Datasheet HRB0502A Datasheet (HIT)

Page 1
HRB0502A
Silicon Schottky Barrier Diode for Rectifying
ADE-208-609(Z)
Features
• Low forward voltage drop and suitable for high efficincy rectifying.
• CMPAK Package is suitable for high density surface mounting and high speed assembly.
Type No. Laser Mark Package Code
HRB0502A E3 CMPAK
Rev 0
Mar. 1998
Outline
3
2
(Top View)
1
1 NC 2 Anode 3 Cathode
Page 2
HRB0502A
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Value Unit
Repetitive peak reverse
V
RRM
voltage Average rectified current I Non-Repetitive peak forward
*1
O
*2
I
FSM
surge current Junction temperature Tj 125 °C Storage temperature Tstg –55 to +125 °C
Notes 1. See from Fig.4 to Fig.6 Notes 2. 10msec sine wave 1 pulse
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Condition
Forward voltage V Reverse current I
F
R
Capacitance C — 120 — pF VR = 0V, f = 1 MHz Thermal resistance R
th(j-a)
Notes 1. Polyimide board
— — 0.4 V IF = 500 mA — — 200 µAVR = 20V
— 450 — °C/W Polyimide board
20 V
500 mA 5A
*1
3.0
1.5
1.5
20hx15wx0.8t
0.8
2.0
Unit: mm
2
Page 3
Main Characteristic
HRB0502A
10
Pulse test
1.0 Ta=75°C
(A)
F
-1
10
Ta=25°C
10
-2
Forward current I
-3
10
-4
10
0 0.2 0.4
Forward voltage V
0.6 0.8
F
Fig.1 Forward current Vs. Forward voltage
2
10
f=1MHz Pulse test
(V)
1.0
-1
10
Pulse test
-2
10
(A)
R
-3
10
-4
10
Reverse current I
-5
10
-6
10
Ta=75°C
Ta=25°C
0510
15 20
Reverse voltage V R (V)
Fig.2 Reverse current Vs. Reverse voltage
25
10
Capacitance C (pF)
1.0
1.0 Reverse voltage V R (V)
Fig.3 Capacitance Vs. Reverse voltage
4010
3
Page 4
HRB0502A
Main Characteristic
0.4
0
(W)
d
0.3
tp T
Tj =25°C
0.2
0.1
Forward power dissipation P
0
0
0.1
Forward current
Fig4. F
orward power dissipation Vs. Forward current
VR=3V
0.6
Tj =125°C
(A)
Rth(j-a)=450°C/W
0.5
@Io
0.4
0.3 D=1/6
0.2
2.5
2.0
1.5
0
VR
Tj =125°C
tp
tp
D=
T
T
D=5/6
D=2/3
D=1/2
Io
tp
D=
T
D=1/6
D=1/3
(W)
d
Sin wave D=1/2 DC
1.0 Sin wave
0.5
Reverse power dissipation P
0.2
@@
0.5
0.40.3
I
@(A)
F
Fig5.
010
Reverse voltage
@@
V
Reverse power dissipation Vs. Reverse voltage
20515
@(V)
R
25
0
DC
D=1/2 Sin wave D=1/3
0.1
Average rectified current
0
0
050
-25
10025 75
Ambient temperature Ta ( °C)
Fig.6 Average rectified current Vs. Ambient temperature
4
125
0
Io
tp
tp
D=
T
T
Page 5
Package Dimensions
Laser Mark
+ 0.1
0.3
– 0.05
0.65
2.0 ± 0.2
3
E 3
2
1.3 ± 0.2
HRB0502A
Unit : mm
+ 0.1
0.3
– 0.05
1
0.3
+ 0.1 – 0.05
0.65
0.425
1.25 ± 0.1
0.425
2.1 ± 0.3
0.16
0 - 0.1
+ 0.1 – 0.06
1 NC 2 Anode 3 Cathode
0.2
0.9 ± 0.1
Hitachi Code JEDEC Code
EIAJ Code
Weight (g)
CMPAK
—
SC-70
0.006
5
Page 6
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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