Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 1/4
HMPSA94
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMPSA94 is designed for application that requires high voltage.
Features
• High Breakdown Voltage: 400V(Min.) at IC=1mA
• High Current: IC=300mA at 25°C
• Complementary to HMPSA44
Absolute Maximum Ratings
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................................ +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................................. 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage.................................................................................................. -400 V
VCEO Collector to Emitter Voltage.............................................................................................. -400 V
VEBO Emitter to Base Voltage......................................................................................................... -6 V
IC Collector Current ................................................................................................................. -500 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -400 - - V IC=-100uA, IE=0
BVCEO -400 - - V IC=-1mA, IB=0
BVEBO -6 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-400V, IE=0
IEBO - - -100 nA VEB=-4V, IC=0
ICES - - -500 nA VCE=- 400V, VBE= 0
*VCE(sat)1 - - -350 mV IC=-1mA, IB=-0.1mA
*VCE(sat)2 - - -500 mV IC=-20mA, IB=-2mA
*VCE(sat)3 - - -750 mV IC=-50mA, IB=-5mA
*VBE(sat) - - -750 mV I C= - 10mA, IB=-1mA
*hFE1 40 - - VCE=-10V, IC=-1mA
*hFE2 50 - 300 VCE=-10V, IC=-10mA
*hFE3 45 - - VCE=-10V, IC=-50mA
*hFE4 40 - - VCE=-10V, IC=-100mA
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2
Rank NSS NS SD N
hFE@VCE=-3V, IC=-100mA
hFE2@VCE=-10V, IC=-10mA 70-200 70-300 70- 200 50-300
VCE(sat)@IC=-20mA, IB=-2mA <200mV <500mV <200mV <500mV
>50 >50
--
HMPSA94 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 2/4
1000
Cur ren t Ga in & C ollector Cu rrent
125oC
100
25oC
hFE
10
hFE @ VCE=3V
1
0.1 1 10 100 1000
100000
10000
Sat urati on Voltage & C ollector Cu rrent
Collector Current I
75oC
C
(mA)
75oC
1000
Cur ren t Ga in & C ollector Cu rrent
75oC125oC
100
25oC
hFE
10
hFE @ VCE=10V
1
0.1 1 10 100 1000
10000
Sat urati on Voltage & Collector Current
Collector Current IC (mA)
1000
125oC
Saturat ion Volta ge ( m V)
100
CE(sat)
V
10
1 10 100 1000
Collector Current IC (mA)
Capacitance & Reverase-Bi ased Volt age
100
Cob
10
Capacitance (pF)
25oC
@ IC=10I
75oC
1000
Saturat ion Volta ge ( m V)
B
100
1 10 100 1000
10000
1000
(mA)
C
100
Collect or Curre nt-I
10
25oC
125oC
V
Collector Current IC (mA)
Safe Operating Area
BE(sat)
@ IC=10I
PT=1m s
PT=100ms
PT=1s
B
1
0.1 1 10 100
Reverse- Biased Vol t a ge ( V)
1
1 10 100 1000
Forwar d Biase d Vol t age-VCE (V)
HMPSA94 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 3/4
700
600
500
400
300
200
Power Dis s ip ation-PD(mW)
100
0
0 20 40 60 80 100 120 140 160
Ambient Temperat ure-Ta(oC)
PD-Ta
HMPSA94 HSMC Product Specification
Page 4
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6355
Issued Date : 1993.01.15
Revised Date : 2002.04.29
Page No. : 4/4
A
α2
B
31
2
Marking:
HS
PM
9A4
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
F
DIM
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
α1
α2
α3
Min. Max. Min. Max.
-
-
-
*5°
*2°
*2°
-
-
-
*: Typical
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPSA94 HSMC Product Specification
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