HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 1/3
HMPSA93
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HMPSA93 is designed for application as a video output to drive color
CRT, or as a dialer circuit in electronics telephone.
Features
High Collector-Emitter Breakdown Voltage
•
Low Collector-Emitter Saturation Voltage
•
For Complementary Use with NPN Type HMPSA43
•
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature....................................................................................................... -55 ~ +150 °C
Junction Temperature ............................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)............................................................................................ 625 mW
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage.................................................................................................. -200 V
VCEO Collector to Emitter Voltage ............................................................................................... -200 V
VEBO Emitter to Base Voltage......................................................................................................... -5 V
IC Collector Current ................................................................................................................. -500 mA
(Ta=25°C)
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -200 - - V IC=-100uA, IE=0
BVCEO -200 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-160V, IE=0
IEBO - - -100 nA VEB=-3V, IC=0
*VCE(sat) - - -350 mV IC=-20mA, IB=-2mA
*VBE(sat) - - -900 mV IC=-20mA, IB=-2mA
*hFE1 25 - - IC=-1mA, VCE=-10V
*hFE2 40 - - IC=-10mA, VCE=-10V
*hFE3 40 - - IC=-30mA, VCE=-10V
*hFE4 - 100 - IC=-80mA, VCE=-10V
fT 50 - - MHz IC=-10mA, VCE=-20V, f=100MHZ
Cob - - 8 pF VCB=-20V, f=1MHz, IE=0
Classification Of hFE2 & V
Rank hFE1 hFE2 hFE3 hFE4 VCE(sat)
NS >60 >80 >80 >80 <200mV
N >25 >40 >40 - <350mV
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
CE(sat)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 2/3
1000
Current Gai n & Collector Current
100
hFE @ VCE=10V
hFE
10
1
0.1 1 10 100 1000
Collector Curren t (m A )
Cutoff Frequency & Collector Current
1000
100000
10000
1000
BE(sat)
V
Satu r ation Voltage (mV)
100
CE(sat)
V
10
0.1 1 10 100 1000
Collector Current (mA)
@ IC=10I
@ IC=10I
B
B
Capa cita n ce & Reverse-Bi ased Voltage
100
Saturation Volt age & Collector Curr ent
100
VCE=20V
Cutoff Frequencey (MHz )
10
1 10 100
Collector Curren t (m A )
Safe Operating Area
10000
PT=1ms
PT=100ms
1000
(mA)
C
Collector Current -I
PT=1s
100
10
10
Capac itanc e (pF)
1
0.1 1 10 100
Cob
Reverse-Biased Voltage (V)
PD-Ta
700
600
500
400
300
200
Power Dissipation-PD(mW)
100
1
1 10 100 1000
Forwar d Voltage-VCE (V)
0
0 20 40 60 80 100 120 140 160
Ambient Temper atur e- Ta(oC)
HSMC Product Specification
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Base 3.Collec tor
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
F
DIM
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
1
α
2
α
3
α
Min. Max. Min. Max.
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O. C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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