Datasheet HMPSA92M Datasheet (HSMC)

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6354
Issued Date : 1993.01.15
Revised Date : 2001.05.01
Page No. : 1/3

HMPSA92M

PNP EPITAXIAL PLANAR TRANSIST OR

Description

The HMPSA92M is designed for applicatio n as a video out put to driv e
color CRT, or as a dialer circuit in electronics telephone.

Absolute Maximum Ratings

Maximum Temperatures

•

Storage Temperature............................................................................................ -55 ~ +150 °C

Junction Temperature................................................................................... +150 °C Maximum

Maximum Power Dissipation

•

Total Power Dissipation (Ta=25°C)............................................................................... 625 mW

Maximum Voltages and Currents (Ta=25°C)

•

VCBO Collector to Base Voltage ..................................................................................... -300 V

VCEO Collector to Emitter Voltage .................................................................................. -300 V

VEBO Emitter to Base Voltage ............................................................................................ -5 V

IC Collector Current ..................................................................................................... -800 mA

Characteristics

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO -300 - - V IC=-100uA, IE=0
BVCEO -300 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA , IC=0

ICEO - - -5 uA VCE=-300V, IB=0

IEBO - - -100 nA VEB=-3V, IC=0
*VCE(sat)1 - -150 - mV IC=-30mA, IB=-1mA
*VCE(sat)2 - - -700 mV IC=-100mA, IB=-10mA
*VBE(sat)1 - - -900 mV IC=-20mA, IB=-2mA
*VBE(sat)2 - - -1 V IC=-100mA, IB=-10mA

*hFE1 80 - - IC=-10mA, VCE=-10V
*hFE2 80 - - IC=-100mA, VCE=-10V
*hFE3 40 - - IC=-200mA, VCE=-10V

fT 50 - - MHz IC=-10mA, VCE=-20V, f=100MHz

Classification Of V

Rank SIN N

(Ta=25°C)

*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

CE(sat)1

Range <200mV Typ. : 220mV

HMPSA92M HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

Characteristics Curve

Spec. No. : HE6354
Issued Date : 1993.01.15
Revised Date : 2001.05.01
Page No. : 2/3

1000

100

hFE

10

0.001 0.01 0.1 1 10 100 1000

100

Current Gai n & Collector Current

VCE=10V

Collector Curren t (m A )

Capacitance & Reverse-Biased Voltage

Saturation Volt age & Coll ector Cu rrent

10

CE(sat)

V

@ IC=30I

1

BE(sat)

Saturation Voltage (V)

0.1

V

0.01 0.1 1 10 100 1000

B

@ IC=10I

Collector Current (mA)

CE(sat)

V

@ IC=10I

Cut off Fr equency & Collector Cu rrent

1000

B

B

Cob

10

Capac itanc e (pF)

1

0.1 1 10 100

Reverse-Biased Vol t ag e ( V)

Safe Operating Area

10000

PT=1ms
PT=100ms

PT=1s

(mA)

C

Collector Curren t-I

1000

100

10

100

VCE=20V

Cutoff Frequency (MHz)

10

1 10 100 1000

Collector Current (mA)

PD-Ta

700

600

500

400

300

200

Power Dissipation-PD(mW)

100

1

1 10 100 1000

Forwar d Vol tage-VCE (V)

0

0 20 40 60 80 100 120 140 160

Ambient Temper atur e- Ta(oC)

HMPSA92M HSMC Product Specification

HI-SINCERITY

g

MICROELECTRONICS CORP.

TO-92 Dimension

A

Spec. No. : HE6354
Issued Date : 1993.01.15
Revised Date : 2001.05.01
Page No. : 3/3

α

2

Marking :

C

B

31

2

α

3

HSMC Logo

Part Number

Date Code

HSMC Logo

D

Part Number

H

α

I

1

G

Style : Pin 1.Emitter 2.Base 3.Collec tor

Product Series

Rank

Laser Mark

Product Series

Ink Mark

E

DIM

F

Inches Millimeters Inches M illimeters

Min. Max. Min. Max.

3-Lead TO-92 Plastic Package

HSMC Packa

e Code : A

DIM

Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54

C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56

E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76

Notes :

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.

1

α

2

α

3

α

-

-

-

*5
*2
*2

°
°
°

-

-

-

*:Typical

*5

°

*2

°

*2

°

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

•

Factory 2 :

Tel : [phone] Fax : [phone]

HMPSA92M HSMC Product Specification

(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C