HI-SINCERITY
MICROELECTRONICS CORP.
HMPSA92
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMPSA92 is designed for application as a video output to drive
color CRT, or as a dialer circuit in electronics telephone.
Spec. No. : HE6352
Issued Date : 1992.12.15
Revised Date : 2002.04.15
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage...................................................................................... -300 V
VCEO Collector to Emitter Voltage................................................................................... -300 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current ...................................................................................................... -500 mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -300 - - V IC=-100uA, IE=0
BVCEO -300 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-10uA, IC=0
ICBO - - -100 nA VCB=-200V, IE=0
IEBO - - -100 nA VEB=-3V, IC=0
*VCE(sat) - - -350 mV IC=-20mA, IB=-2mA
*VBE(sat) - - -900 mV IC=- 20mA, IB= - 2mA
*hFE1 25 - - IC=-1mA, VCE=-10V
*hFE2 40 - - IC=-10mA, VCE=-10V
*hFE3 40 - - IC=-30mA, VCE=-10V
*hFE4 - 100 - IC=-80mA, VCE=-10V
fT 50 - - MHz IC=-10mA, VCE=-20V, f=100MHz
Cob - - 6 pF VCB=-20V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2 & VCE(sat)
Rank hFE1 hFE2 hFE3 hFE4 VCE(sat)
NS >60 >80 >80 >80 <200mV
N >25 >40 >40 - <350mV
HMPSA92 HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6352
Issued Date : 1992.12.15
Revised Date : 2002.04.15
Page No. : 2/4
1000
Current Gain & Collector Current
125oC
100
hFE
10
hFE @ VCE=10V
1
0.1 1 10 100 1000
1000
25oC
75oC
Collector Current-IC (mA)
Sat urati on Voltage & Col lector Current
25oC
10000
Sat urati on Voltage & C ollector Cu rrent
CE(sat)
V
1000
100
Satur ation Voltag e (mV)
10
0.1 1 10 100 1000
100
Capacitance & Reverse-Biased Volt age
B
@ IC=10I
75oC
125oC
Collector Current-IC (mA)
25oC
125oC
Saturat ion Voltag e ( m V)
100
0.1 1 10 100 1000
100
10
Cutoff Fr equ ency ( M Hz)...
Cutoff Frequency & Col lector C urrent
Collector Current-IC (mA)
75oC
CE(sat)
V
VCE=20V
@ IC=10I
10
B
Capacitance (pF)
1
0.1 1 10 100
10000
PT=1ms
PT=100ms
1000
PT=1s
(mA)
C
100
Collector Curr ent -I
10
Cob
Reverse- Biased Voltage ( V)
Safe Operati ng Area
1
1 10 100
Collector Current-IC (mA)
1
1 10 100 1000
Forwar d Voltage- VCE (V)
HMPSA92 HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6352
Issued Date : 1992.12.15
Revised Date : 2002.04.15
Page No. : 3/4
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
0
0 50 100 150 200
Ambient Temper atu re-Ta (oC)
PD-Ta
HMPSA92 HSMC Product Specification
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6352
Issued Date : 1992.12.15
Revised Date : 2002.04.15
Page No. : 4/4
A
α2
B
31
2
Marking:
HS
P
M
9A2
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPSA92 HSMC Product Specification
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