HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6358
Issued Date : 1993.01.15
Revised Date : 2002.04.16
Page No. : 1/3
HMPSA44
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HMPSA44 is designed for application that requires high voltage.
Features
• High Breakdown Voltage: 400(Min) at IC=1mA
• High Current Gain: IC=300mA at 25°C
• Complementary to HMPSA94
Absolute Maximum Ratings
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................................ +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................................. 625 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage.................................................................................................... 400 V
VCEO Collector to Emitter Voltage ................................................................................................ 400 V
VCBO Emitter to Base Voltage......................................................................................................... 6 V
IC Collector Current .................................................................................................................... 300mA
TO-92
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 400 - - V IC=100uA, IE=0
BVCEO 400 - - V IC=1mA, IB=0
BVEBO 6 - - V IE=10uA, IC=0
ICBO - - 100 nA VCB=400V, IE=0
IEBO - - 100 nA VEB=4V, I C=0
ICES - - 500 nA VCE=400V, VBE=0
*VCE(sat)1 - - 350 mV IC=1mA, IB=0.1 mA
*VCE(sat)2 - - 350 mV IC=20mA, IB=2mA
*VCE(sat)3 - - 750 mV IC=50mA, IB=5mA
*VBE(sat) - - 750 mV IC=10mA, IB=1mA
*hFE1 40 - - IC=1mA, VCE=10V
*hFE2 50 - 300 IC=10mA, VCE=10V
*hFE3 45 - - IC=50mA, VCE=10V
*hFE4 40 - - IC=100mA, VCE=10V
Cob - - 6 pF VCB=20V, f=1MHz, IE=0
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2
Rank N SD SUM
Range 50-300 70-210 120-300
HMPSA44 HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6358
Issued Date : 1993.01.15
Revised Date : 2002.04.16
Page No. : 2/3
1000
Cur rent G ain & C o llector Current
hFE @ VCE=10V
125oC
100
hFE
25oC
10
0.1 1 10 100 1000
1000
Sat urati on Voltage & Collector Curren t
Collector Current- IC (mA)
25oC
75oC
1000
CE(sat)
V
100
Satur ation Voltage ( m V)
10
1 10 100 1000
B
@ IC=10I
75oC
Collector Current- IC (mA)
125oC
25oC
Capacitance & Rev erse-Biased Voltage
100
Sat urati on Voltage & Collector Cu rrent
75oC
125oC
Saturat ion Volta ge ( m V)
100
0.1 1 10 100 1000
Collector Current- IC (mA)
CE(sat)
V
@ IC=10I
Safe Oper ating Area
10000
PT=1ms
PT=100ms
PT=1s
(mA)
C
Collector Curr ent - I
1000
100
10
10
B
Capacitance (p F)
1
0.1 1 10 100
Cob
Reverse-Biased Vol tage (V)
PD-Ta
700
600
500
400
300
200
Power Dissipation-PD (mW)
100
1
1 10 100 1000
Forwar d Voltage-VCE (V)
0
0 50 100 150 200
Ambient Temperature- Ta (oC)
HMPSA44 HSMC Product Specification
HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6358
Issued Date : 1993.01.15
Revised Date : 2002.04.16
Page No. : 3/3
A
α2
B
31
2
Marking:
HS
PM
4A4
Date Code Control Code
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
F
DIM
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
α1
α2
α3
*: Typical
Min. Max. Min. Max.
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMPSA44 HSMC Product Specification
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