Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HMBT4401
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT4401 is designed for general purpose switching and
amplifier applicati ons.
Spec. No. : HE6815
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 1/4
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperatur e........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 60 V
VCEO Collector to Emitter Voltage...................................................................................... 40 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current........................................................................................................ 600 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO 60 - - V IC=100uA
BVCEO 40 - - V IC=1mA
BVEBO 6 - - V IE=10uA
ICEX - - 100 nA VCE=35V, VBE=-0.4V
*VCE(sat)1 - - 0.4 V IC=150mA, IB=15mA
*VCE(sat)2 - - 750 mV IC=500mA, IB=50mA
*VBE(sat)1 - - 950 mV IC=150mA, IB=15mA
*VBE(sat)2 - - 1.2 V IC=500mA, IB=50mA
*hFE1 20 - - VCE=1V, IC=0.1mA
*hFE2 40 - - VCE=1V, IC=1mA
*hFE3 80 - - VCE=1V, IC=10mA
*hFE4 100 - 300 VCE=1V, IC=150mA
*hFE5 40 - - VCE=2V, IC=500mA
fT 250 - - MHz VCE=10V, IC=20mA, f=100MHz
Cob - - 6.5 PF VCB=5V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT4401 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6815
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 2/4
1000
Current Gain & Collector Current
125oC
100
hFE
1000
10
25oC
75oC
hFE @ VCE=1V
1 10 100 1000
Collector Current-IC (mA)
Sat urati on Voltage & C ol lector Current
@ IC=10I
B
CE(sat)
V
1000
hFE @ VCE=2V
125oC
100
hFE
10
1 10 100 1000
25oC
75oC
Collector Current-IC (mA)
Sat uration Voltage & Collect or Current
1000
25oC
75oC
Cur rent Ga in & C o llector Current
100
Saturat ion Volta ge ( m V)
10
0.1 1 10 100 1000
125oC
Collector Current-IC (mA)
75oC
25oC
Capacitance & Reverse- Biased Vol tage
100
10
Capacitance (pF)
Cob
125oC
BE(sat)
V
Saturation Voltage (mV)
100
0.1 1 10 100 1000
1000
100
Cutoff Fr equen cy ( M Hz)...
Cut off Fr equency & Collector Current
Collector Current-IC (mA)
VCE=10V
@ IC=10I
B
1
0.1 1 10 100
Reverse Biased Vol t ag e ( V)
10
1 10 100 1000
Collector Curren t (mA)
HMBT4401 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6815
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 3/4
10
PT=1ms
(mA)
1
C
Collector Cu r rent-I
0.01
PT=100ms
PT=1s
0.1
1 10 100
Safe Operating Area
Forwar d Biased Vol tage-VCE (V)
HMBT4401 HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6815
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 4/4
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
2 X
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT4401 HSMC Product Specification
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