Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HMBD2003\C\S
Description
The HMBD2003\C\S are general purpose diodes fabricated in planar
technology, and encapsulated in small plastic SMD SOT-23 package.
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 1/2
Features
SOT-23
• Small plastic SMD package
• Switching speed: max. 50 nS
• General application:
Continuous reverse voltage: Max. 200 V
Repetitive peak reverse voltage: Max. 250 V
Repetitive peak forward current: Max. 625 mA
Absolute Maximum Ratings (Ta=25°C)
Characteristic Symbol Value Unit
HMBD2003 Repetitive Peak Reverse Voltage 250
HMBD2003C Repetitive Peak Reverse Voltage 250
HMBD2003S Repetitive Peak Reverse Voltage
HMBD2003 Continuous reverse voltage 200
HMBD2003C Continuous reverse voltage 200
HMBD2003S Continuous reverse voltage
Forward Continuous Current at Ta=25°C
Repetitive Peak Forward Current at Ta=25°C
Surge Forward Current at t =1mS, Ta=25°C
Power Dissipation PD 250 Max mV
Junction Temperature Tj 150
Storage Temperature Range Tstg -65~+150
VRRM
250
VR
200
lF 225 mA
IFRM 625 mA
IFSM 1 A
V
V
°C
°C
Characteristics (Ta=25°C)
Characteristic Symbol Condition Mi n Max Unit
Forward Voltage
HMBD2003 Reverse Current VR=200V - 100
HMBD2003C Reverse Current VR=200V - 100
HMBD2003S Reverse Current
Total Capacitance CT VR=0V, f=1MHz 5 - pF
Reverse Recovery Time Trr
BV
R
HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification
VF(1) IF=100mA - 1
VF(2) IF=200mA - 1.25
IR
VR=200V - 100
IF=30mA to IR=30mA
50 - nS
BV
RL=100Ω measured at
IR=3mA
IR=100uA 250 - V
R
nA
V
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 2/2
A
L
3
B
S
21
12
HMBD2003C
GV
3
21
HMBD2003
3
3
12
HMBD2003S
3-Lead SOT-23 Plastic Surface Mounted Package
Diagram:
Marking:
A82
HMBD2003
C3C C3S
HMBD2003C21HMBD2003S
HSMC Package Code: N
C
D
H
JK
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. M ax. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD2003, HMBD2003C, HMBD2003S HSMC Product Specification
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