Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 1/3
HM965
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM965 is designed for use as AF output ampli fier an d gl ash unit.
Features
• Low VCE(sat)
• High performance at low supply voltage
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
SOT-89
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C).................................................................................... 1.2 W
• Maximum Voltages and Currents (Ta=25°C)
BVCBO Collector to Base Voltage....................................................................................... 40 V
BVCEO Collector to Emitter Voltage.................................................................................... 20 V
BVEBO Emitter to Base Voltage............................................................................................ 7 V
IC Collector Current (Continuous)......................................................................................... 5 A
IC Collector Current (Peak PT=10mS).................................................................................. 8 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA
BVCEO 20 - - V IC=1mA
BVEBO 7 - - V IE=10uA
ICBO - - 0.1 uA VCB=10V
IEBO - - 0.1 uA VEB=7V
*VCE(sat) - 0.35 1 V IC=3A, IB=0.1A
*hFE1 340 - 800 VCE=2V, IC=0.5A
*hFE2 150 - - VCE=2V, IC=2A
fT - 150 - MHz VCE=6V, IE=50mA
Cob - - 50 pF VCB=20V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classifications Of hFE1
Rank R S
Range 340-600 560-800
HM965 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 2/3
10000
1000
HFE
100
10
125oC
25oC
75oC
hFE @ VCE=2V
10 100 1000 10000
Collector Current-IC (mA)
Capacitance & R everse- Biased Volta ge
100
Current Gain & Collector Current
1000
CE(sat)
V
100
Saturation Voltage (mV)
10
1 10 100 1000 10000
125oC
B
@ IC=30I
75oC
Collector Current-IC (mA)
25oC
Cutoff Frequency & Collector Current
1000
Sat urati on Voltage & Col lector Current
Capacitance (pF)
10
0.1 1 10 100
Reverse- Biased Vol t ag e ( V)
Cob
Safe Operating Area
100000
10000
(mA)
C
Collect or Curren t-I
1000
100
PT=1ms
PT=100ms
PT=1s
100
Cutoff Frequency (MHz)...
10
1 10 100 1000
VCE=6V
Collector Current (m A)
10
1 10 100
Forwar d Biased Voltage-VCE (V)
HM965 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : HE9511
Issued Date : 1996.04.12
Revised Date : 2002.10.01
Page No. : 3/3
Marking:
C
B
D
321
E
H
Date Code
9HM65
Laser Marking
Style: Pin 1.Base 2.Collector 3.Emitter
I
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM965 HSMC Product Specification
Loading...