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HI-SINCERITY
MICROELECTRONICS CORP.
HM882
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM882 is suited for the output stage of 0.75W audio, voltage
regulator, and relay driver.
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2003.01.10
Page No. : 1/4
Absolute Maximum Ratings
SOT-89
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................ 0.6 W
Total Power Dissipation (Ta=25°C)............................................................................... 2 W
Total Power Dissipation (Tc=25°C)............................................................................ 1.3 W
Total Power Dissipation (Tc=25°C)............................................................................ 3.4 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 70 V
VCEO Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current............................................................................................................... 3 A
Thermal Characteristic
Characteristic Symbol Max. Unit
Thermal Resistance, junction to ambient
Thermal Resistance, junction to ambient
Thermal Resistance, junction to case
Thermal Resistance, junction to case
(Note1)
(Note2)
(Note1)
(Note2)
Rθja
Rθja
Rθjc
Rθjc
208
62.5
86
36.8
o
C/W
o
C/W
o
C/W
o
C/W
(Note1)
(Note2)
(Note1)
(Note2)
Note1: When tested in free air condition, without heat sinking.
Note2: When mounted on a 40X40X1mm ceramic board.
HM882 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 40 - - V IC=100uA, IE=0
BVCEO 30 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=10uA, IC=0
ICBO - - 1 uA VCB=30V, IE=0
IEBO - - 1 uA VEB=3V, IB=0
*VCE(sat) - - 0.5 V IC=2A, IB=0.2A
*VBE(sat) - - 2 V IC=2A, IB=0.2A
*hFE1 30 - - VCE=2V, IC=20mA
*hFE2 100 - 500 VCE=2V, IC=1A
fT - 90 - MHz VCE=5V, IC=0.1A, f=100MHz
Cob - 45 - pF IE=0,VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2003.01.10
Page No. : 2/4
Classification Of hFE2
Rank Q P E
Range 100-200 160-320 250-500
HM882 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2003.01.10
Page No. : 3/4
1000
hFE
VCE=2V
100
0.01 0.1 1 10 100 1000 10000
Collector Current ( m A )
Capacita nce & Rev erse-Bia sed Voltage
100
Current Gain & Collector Current
10
Sat uration Voltage & Collector Current
1
BE(sat)
V
0.1
Saturation Voltage (mV)
0.01
0.1 1 10 100 1000 10000
1000
Cutoff Frequency & Coll ect or Current
Collector Current ( m A )
@ IC=10I
B
CE(sat)
V
@ IC=10I
B
Capacitan ce (pF)
Cob
10
0.1 1 10 100
Rev e r se- Biased Voltage (V)
Safe Operating Area
10000
PT=1ms
(mA)
C
Collector Current-I
1000
100
PT=100ms
PT=1s
10
1 10 100
Forwar d Vol t a ge- VCE (V)
Cutoff Frequency (MHz)
VCE=5V
100
1 10 100 1000
Collector Current (m A)
HM882 HSMC Product Specification
Page 4
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : HE9514
Issued Date : 1997.06.05
Revised Date : 2003.01.10
Page No. : 4/4
Marking:
C
B
D
321
E
H
Date Code
8HM82
Laser Marking
Style: Pin 1.Base 2.Collector 3.Emitter
I
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM882 HSMC Product Specification
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