Datasheet HM628512BFP-5, HM628512BFP-7 Datasheet (HIT)

Page 1
HM628512BFP Series
4 M SRAM (512-kword × 8-bit)
ADE-203-1078B (Z)
Rev. 2.0
Nov. 23, 1999
Description
The Hitachi HM628512BFP is a 4-Mbit static RAM organized 512-kword × 8-bit. It realizes higher density, higher performance and low power consumption by employing Hi-CMOS process technology. It is packaged in standard 32-pin SOP.
Features
Single 5 V supply
Access time: 55/70 ns (max)
Power dissipationActive: 50 mW/MHz (typ)Standby: 2 mW (max)
Completely static memory. No clock or timing strobe required
Equal access and cycle times
Common data input and output: Three state output
Directly TTL compatible: All inputs and outputs
Ordering Information
Type No. Access time Package
HM628512BFP-5 HM628512BFP-7
55 ns 70 ns
525-mil 32-pin plastic SOP (FP-32D)
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HM628512BFP Series
Pin Arrangement
32-pin SOP
A18 A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 V
SS
Pin Description
Pin name Function
A0 to A18 Address input I/O0 to I/O7 Data input/output
CS Chip select OE Output enable WE Write enable
V
CC
V
SS
Power supply Ground
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
(Top view)
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
V
CC
A15 A17
WE
A13 A8 A9 A11
OE
A10
CS
I/O7 I/O6 I/O5 I/O4 I/O3
2
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Block Diagram
A18 A16
A1 A0
A2 A12 A14
A3
A7
A6
Row Decoder
HM628512BFP Series
V
CC
V
SS
Memory Matrix
×
1,024 4,096
I/O0
I/O7
CS
WE
OE
Input Data Control
Timing Pulse Generator
Read/Write Control
Column I/O
Column Decoder
A17
A13
A15
A9
A8
A10A11
A4
A5
3
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HM628512BFP Series
Function Table
WE CS OE Mode VCC current Dout pin Ref. cycle
× H × Not selected I H L H Output disable I H L L Read I L L H Write I L L L Write I
, I
SB
SB1
CC
CC
CC
CC
Note: ×: H or L
Absolute Maximum Ratings
Parameter Symbol Value Unit
Power supply voltage V Voltage on any pin relative to V
SS
Power dissipation P
CC
V
T
T
Operating temperature Topr –20 to +70 °C Storage temperature Tstg –55 to +125 °C Storage temperature under bias Tbias –20 to +85 °C
Notes: 1. –3.0 V for pulse half-width 30 ns
2. Maximum voltage is 7.0 V
–0.5 to +7.0 V –0.5*1 to VCC + 0.3*
1.0 W
High-Z — High-Z — Dout Read cycle Din Write cycle (1) Din Write cycle (2)
2
V
Recommended DC Operating Conditions (Ta = –20 to +70°C)
Parameter Symbol Min Typ Max Unit
Supply voltage V
Input high voltage V Input low voltage V
CC
V
SS
IH
IL
Note: 1. –3.0 V for pulse half-width 30 ns
4
4.5 5.0 5.5 V 000V
2.2 VCC + 0.3 V
*1
–0.3
0.8 V
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HM628512BFP Series
DC Characteristics (Ta = –20 to +70°C, VCC = 5 V ±10% , VSS = 0 V)
Parameter Symbol Min Typ*1Max Unit Test conditions
Input leakage current |I Output leakage current |ILO|——1µA CS = VIH or OE = VIH or
Operating power supply current: DC I
Operating power supply current I
Operating power supply current I
Standby power supply current: DC I Standby power supply current (1): DC I Output low voltage V Output high voltage V
Note: 1. Typical values are at VCC = 5.0 V, Ta = +25°C and specified loading, and not guaranteed.
|—1µA Vin = VSS to V
LI
WE = V
CC
8 15 mA CS = VIL,
IL
others = V
CC1
CC2
40 60 mA Min cycle, duty = 100%
CS = V I
I/O
, others = VIH/V
IL
= 0 mA
10 20 mA Cycle time = 1 µs,
duty = 100% I
= 0 mA, CS 0.2 V
I/O
V
VCC – 0.2 V, VIL 0.2 V
IH
SB
SB1
OL
OH
—1 3 mACS = V
IH
300 400 µA Vin 0 V, CS VCC – 0.2 V — 0.4 V IOL = 2.1 mA
2.4 V IOH = –1.0 mA
, V
I/O
IH/VIL
CC
= VSS to V
, I
= 0 mA
I/O
CC
IL
Capacitance (Ta = +25°C, f = 1 MHz)
Parameter Symbol Typ Max Unit Test conditions
Input capacitance*
1
Input/output capacitance*1C Note: 1. This parameter is sampled and not 100% tested.
Cin 8 pF Vin = 0 V
I/O
—10pFV
= 0 V
I/O
5
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HM628512BFP Series
AC Characteristics (Ta = –20 to +70°C, VCC = 5 V ± 10%, unless otherwise noted.)
Test Conditions
Input pulse levels: 0.8 V to 2.4 V
Input rise and fall time: 5 ns
Input and output timing reference levels: 1.5 V
Output load: 1 TTL Gate + CL (50 pF) (HM628512BFP-5) (Including scope & jig)
1 TTL Gate + CL (100 pF) (HM628512BFP-7) (Including scope & jig)
Read Cycle
HM628512BFP
-5 -7
Parameter Symbol Min Max Min Max Unit Notes
Read cycle time t Address access time t Chip select access time t Output enable to output valid t Chip selection to output in low-Z t Output enable to output in low-Z t Chip deselection to output in high-Z t Output disable to output in high-Z t Output hold from address change t
RC
AA
CO
OE
LZ
OLZ
HZ
OHZ
OH
55 70 ns — 55 70 ns — 55 70 ns — 25 35 ns 10 10 ns 2 5 5 ns 2 0 20 0 25 ns 1, 2 0 20 0 25 ns 1, 2 10 10 ns
6
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HM628512BFP Series
Write Cycle
HM628512BFP
-5 -7
Parameter Symbol Min Max Min Max Unit Notes
Write cycle time t Chip selection to end of write t Address setup time t Address valid to end of write t Write pulse width t Write recovery time t WE to output in high-Z t Data to write time overlap t Data hold from write time t Output active from output in high-Z t Output disable to output in high-Z t
Notes: 1. tHZ, t
OHZ
and t
are defined as the time at which the outputs achieve the open circuit conditions and
WHZ
are not referred to output voltage levels.
2. This parameter is sampled and not 100% tested.
3. A write occurs during the overlap (t transition of CS going low or WE going low. A write ends at the earlier transition of CS going high or WE going high. t
4. t
is measured from CS going low to the end of write.
CW
5. t
is measured from the address valid to the beginning of write.
AS
6. t
is measured from the earlier of WE or CS going high to the end of write cycle.
WR
is measured from the beginning of write to the end of write.
WP
7. During this period, I/O pins are in the output state so that the input signals of the opposite phase to the outputs must not be applied.
8. If the CS low transition occurs simultaneously with the WE low transition or after the WE transition, the output remain in a high impedance state.
9. Dout is the same phase of the write data of this write cycle.
10.Dout is the read data of next address.
11.If CS is low during this period, I/O pins are in the output state. Therefore, the input signals of the opposite phase to the outputs must not be applied to them.
12.In the write cycle with OE low fixed, t data bus contention. t
tDW min + t
WP
WC
CW
AS
AW
WP
WR
WHZ
DW
DH
OW
OHZ
55 70 ns 50 60 ns 4 0 0 ns 5 50 60 ns 40 50 ns 3, 12 0 0 ns 6 0 20 0 25 ns 1, 2, 7 25 30 ns 0—0—ns 5 5 ns 2 0 20 0 25 ns 1, 2, 7
) of a low CS and a low WE. A write begins at the later
WP
must satisfy the following equation to avoid a problem of
WP
max
WHZ
7
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HM628512BFP Series
Timing Waveforms
Read Timing Waveform (WE = VIH)
Address
CS
OE
t
RC
t
AA
t
CO
t
LZ
t
OE
t
OLZ
t
HZ
t
OHZ
Dout
Valid Data
t
OH
8
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Write Timing Waveform (1) (OE Clock)
Address
t
HM628512BFP Series
WC
OE
CS
WE
Dout
Din
t
AW
t
CW
*8
t
AS
t
OHZ
t
WP
t
DW
t
WR
t
DH
Valid Data
9
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HM628512BFP Series
Write Timing Waveform (2) (OE Low Fixed)
Address
t
WC
CS
WE
Dout
Din
t
CW
*8
t
AW
t
WP
t
AS
t
WHZ
t
DW
t
t
DH
WR
t
OW
t
OH
*9
*11
*10
Valid Data
10
Page 11
Package Dimensions
HM628512BFP Series (FP-32D)
20.45
20.95 Max
32
HM628512BFP Series
Unit: mm
17
11.30
1
1.00 Max
0.15
0.10
M
1.27
*0.40 ± 0.08
0.38 ± 0.06
*Dimension including the plating thickness
Base material dimension
16
+ 0.12
– 0.10
0.15
3.00 Max
0.20 ± 0.04
*0.22 ± 0.05
Hitachi Code JEDEC EIAJ Weight
(reference value)
14.14 ± 0.30
1.42
0° – 8°
0.80 ± 0.20
FP-32D Conforms —
1.3 g
11
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HM628512BFP Series
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
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Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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HM628512BFP Series
Revision Record
Rev. Date Contents of Modification Drawn by Approved by
1.0 Jun. 29, 1999 Initial issue S. Kunito K. Imato
2.0 Nov. 23, 1999 Addition of HM628512BFP-5 Series
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