Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HM5551
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HM5551 is designed for general purpose applications requiring
high breakdown voltages.
Spec. No. : HE9507
Issued Date : 1996.04.09
Revised Date : 2002.02.20
Page No. : 1/3
Features
• High collector-emitter breakdown voltage. VCEO>160V(@IC=1mA)
• Complements to PNP type HM5401
SOT-89
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C).................................................................................... 1.2 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage....................................................................................... 180 V
VCES Collector to Emitter Voltage .................................................................................... 160 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current ....................................................................................................... 600 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 180 - - V IC=100uA
BVCEO 160 - - V IC=1mA
BVEBO 6 - - V IE=10uA
ICBO - - 50 nA VCB=120V
IEBO - - 50 nA VEB=4V
*VCE(sat)1 - - 150 mV IC=10mA, IB=1mA
*VCE(sat)2 - - 200 mV IC=50mA, IB=5mA
*VBE(sat)1 - - 1 V IC=10mA, IB=1mA
*VBE(sat)2 - - 1 V IC=50mA, IB=5mA
*hFE1 80 - - VCE=5V, IC=1mA
*hFE2 80 - 250 VCE=5V, IC=10mA
*hFE3 30 - - VCE=5V, IC=50mA
fT 100 - 300 MHz VCE=10V, IC=10mA, f=100MHz
Cob - - 6 pF VCB=10V, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HM5551 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9507
Issued Date : 1996.04.09
Revised Date : 2002.02.20
Page No. : 2/3
1000
125oC
100
hFE
10
1
25oC
75oC
hFE @ VCE=5V
1 10 100 1000
Collect o r Current- IC (mA)
Sat urati on Voltage & Coll ector Cu rrent
1000
25oC
Cur rent G ain & C o llector Current
100000
Sat uration Voltage & Collector Current
CE(sat)
V
10000
1000
Saturation Voltage (mV)
100
10
0.1 1 10 100 1000
100
Capacitance & Rev erse-Biased Volta ge
B
@ IC=10I
125oC
Collect o r Current- IC (mA)
75oC
25oC
75oC
125oC
Saturation Voltage (mV)
100
0.1 1 10 100 1000
Collector Current- IC (mA)
BE(sat)
V
@ IC=10I
Cut off Fr equency & Collector Current
1000
100
Cutoff Frequency (MHz)...
VCE=10V
10
Capacitance (pF)
B
Cob
1
0.1 1 10 100 1000
10000
1000
(mA)
C
100
10
Collect o r Curr e n t-I
Reverse Biased Volt a ge ( V)
Safe Operating Area
PT=1ms
PT=100ms
PT=1s
10
1 10 100
Collector Current (mA)
1
1 10 100 1000
Forwar d Biased Vol tage-V
CE
(V)
HM5551 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : HE9507
Issued Date : 1996.04.09
Revised Date : 2002.02.20
Page No. : 3/3
Marking:
C
B
D
321
E
H
Date Code
1
5HM55
Laser Marking
Style: Pin 1.Base 2.Collector 3.Emitter
I
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax : 886-3-5982931
HM5551 HSMC Product Specification
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