Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9506-B
Issued Date : 1996.04.09
Revised Date : 2000.10.01
Page No. : 1/3
HM3906
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HM3906 is designed for general purpose switching and
amplifier applicati ons.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)...................................................................................... 1 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltag e....................................................................................... -40 V
VCEO Collector to Emitter Voltage .................................................................................... -40 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -200 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO -40 - - V IC=-100uA
BVCEO -40 - - V IC=-1mA
BVEBO -5 - - V IE=-10uA
ICEX - - -50 nA VCE=-30V, VBE=-3V
*VCE(sat)1 - - -250 mV IC=-10mA, IB=-1mA
*VCE(sat)2 - - -400 mV IC=-50mA, IB=-5mA
*VBE(sat)1 -650 - -850 mV IC=-10mA, IB=-1mA
*VBE(sat)2 - - -950 mV IC=-50mA, IB=-5mA
*hFE1 60 - - VCE=-1V, IC=-100uA
*hFE2 80 - - VCE=-1V, IC=-1mA
*hFE3 100 - 300 VCE=-1V, IC=-10mA
*hFE4 60 - - VCE=-1V, IC=-50mA
*hFE5 30 - - VCE=-1V, IC=-100mA
fT 250 - - MHz VCE=-20V, IC=-10mA, f=100MHz
Cob - - 4.5 pF VCB=-5V, f=1MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9506-B
Issued Date : 1996.04.09
Revised Date : 2000.10.01
Page No. : 2/3
1000
100
hFE
10
0.1 1 10 100 1000
10000
Current Gain & Collector Current
hFE @ VCE=1V
Collector Current (mA)
Saturation Voltage & Co llector Curren t
1000
100
CE(s at)
V
Saturation Voltage (mV)
10
1 10 100 1000
Collector Current (mA)
@ IC=10I
B
Cutoff Frequency & Collector Current
1000
fT @ VCE=20V
Saturation Voltage & Co l lector Current
1000
BE(sat)
V
Saturation Voltage (mV)
100
1 10 100 1000
100
10
Capacitance (Pf)
Capacitance & Reverse-Biased Voltage
Collector Current (mA)
@ IC=10I
B
Cob
100
Cutoff Frequency (MHz)
10
1 10 100 1000
10000
1000
100
10
1
Collector Current (A)
0.1
Collector Curren t (m A )
Safe Operatin g Area
PT=1ms
PT=100ms
PT=1s
1
0.1 1 10 100
Reverse Biased Voltage (V)
0.01
1 10 100
Forward Voltage (V)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Spec. No. : HE9506-B
Issued Date : 1996.04.09
Revised Date : 2000.10.01
Page No. : 3/3
Marking :
C
B
D
321
E
H
HSMC Logo
Date Code
Part Number
Style : Pin 1.Base 2.Emitter 3.Collector
Package Code
I
F
G
A
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code : M
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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