Subminiature High
Performance TS AlGaAs Red
LED Lamps
Technical Data
H
HLMP-P106/P156
HLMP-Q10X/Q15X
Features
• Subminiature Flat Top
Package
Ideal for Backlighting and
Light Piping Applications
• Subminiature Dome
Package
Diffused Dome for Wide
Viewing Angle
Non-diffused Dome for High
Brightness
• Wide Range of Drive
Currents
500 µA to 50 mA
• Ideal for Space Limited
Applications
• Axial Leads
• Available with lead
configurations for Surface
Mount and Through Hole
PC Board Mounting
Description
Flat Top Package
The HLMP-PXXX Series flat top
lamps use an untinted, nondiffused, truncated lens to
provide a wide radiation pattern
that is necessary for use in
backlighting applications. The
flat top lamps are also ideal for
use as emitters in light pipe
applications.
Dome Packages
The HLMP-QXXX Series dome
lamps, for use as indicators, use
a tinted, diffused lens to provide
a wide viewing angle with high
on-off contrast ratio. High
brightness lamps use an
untinted, nondiffused lens to
provide a high luminous intensity within a narrow radiation
pattern.
Lead Configurations
All of these devices are made by
encapsulating LED chips on
axial lead frames to form
molded epoxy subminiature
lamp packages. A variety of
package configuration options is
available. These include special
surface mount lead configurations, gull wing, yoke lead, or Zbend. Right angle lead bends at
2.54 mm (0.100 inch) and 5.08
mm (0.200 inch) center spacing
are available for through hole
mounting. For more information
refer to Standard SMT and
Through Hole Lead Bend
Options for Subminiature LED
Lamps data sheet.
Technology
These subminiature solid state
lamps utilize a highly optimized
LED material technology,
transparent substrate
aluminum gallium arsenide (TS
AlGaAs). This LED technology
has a very high luminous
efficiency, capable of producing
high light output over a wide
range of drive currents (500 µA
to 50 mA). The color is deep red
at a dominant wavelength of
644 nm deep red. TS AlGaAs is
a flip-chip LED technology, die
attached to the anode lead and
wire bonded to the cathode lead.
Available viewing angles are
75°, 35°, and 15°.
1-168
5964-9365E
Device Selection Guide
Viewing AngleDeep RedTypical IvTypical IvPackage
Package Description2 θ
1/2
Domed, Diffused Tinted,35HLMP-Q102160B
Standard Current
Domed, Diffused Tinted,35HLMP-Q1522B
Low Current
Domed, Nondiffused15HLMP-Q106530B
Untinted, Standard Current
Domed, Nondiffused15HLMP-Q1567B
Untinted, Low Current
Flat Top, Nondiffused,75HLMP-P106130A
Untinted, Standard Current
Flat Top, Nondiffused75HLMP-P1562A
Untinted, Low Current
Rd = 644 nmI
= 500 µaI
f
= 20 mAOutline
f
Package Dimensions
A) Flat Top Lamps
1.14
(0.045)
1.40
(0.055)
1.91
(0.075)
2.41
(0.095)
0.76 (0.030) MAX.
CATHODE
STRIPE
(0.082)
2.08
(0.092)
2.34
B) Diffused and Nondiffused Dome Lamps
0.76
(0.030)
(0.035)
R.
0.89
NOTE 3
0.94
1.24
(0.037)
(0.049)
2.92 (0.115)
MAX.
0.18
0.23
(0.007)
(0.009)
0.18
0.23
(0.007)
(0.009)
2.03 (0.080)
1.78 (0.070)
1.91
2.16
(0.075)
(0.085)
0.58
0.43
(0.023)
(0.017)
1.40
(0.055)
1.65
(0.460)
(0.420)
DIA.
(0.065)
0.25 (0.010) MAX.*
NOTE 2
0.50 (0.020) REF.
11.68
10.67
BOTH SIDES
CATHODE
1.65
(0.065)
1.91
(0.075)
0.20 (0.008) MAX.
* REFER TO FIGURE 1 FOR DESIGN CONCERNS.
NOTE 3
ANODE
0.46
0.56
(0.018)
(0.022)
CATHODE
STRIPE
2.08
(0.082)
2.34
(0.092)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).
2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.
3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE
LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.
NOTE 3
0.79 (0.031)
0.53 (0.021)
1.91
2.16
(0.075)
(0.085)
0.63
0.38
(0.025)
(0.015)
1-169
ANODE
TAB
NO. CATHODE DOWN.
Figure 1. Proper Right Angle Mounting to a PC Board to Prevent
Protruding Anode Tab from Shorting to Cathode Connection.
Absolute Maximum Ratings at T
Peak Forward Current
Average Forward Current (@ I
DC Forward Current
[2]
......................................................... 300 mA
[3]
.............................................................. 50 mA
PEAK
YES. ANODE DOWN.
A
= 300 mA)
= 25°C
[1,2]
.................... 30 mA
Power Dissipation ....................................................................100 mW
Reverse Voltage (IR = 100 µA) .........................................................5 V
Transient Forward Current (10 µs Pulse)
[4]
........................... 500 mA
Operating Temperature Range ..................................... -55 to +100°C
Storage Temperature Range ..........................................-55 to +100°C
LED Junction Temperature ....................................................... 110°C
Lead Soldering Temperature
[1.6 mm (0.063 in.) from body ...........................260°C for 5 seconds
Reflow Soldering Temperatures
Convective IR.................. 235°C Peak, above 183°C for 90 seconds
Vapor Phase..................................................... 215°C for 3 minutes
Notes:
1. Maximum I
2. Refer to Figure 7 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 6.
4. The transient peak current is the maximum non-recurring peak current the
device can withstand without damaging the LED die and wire bonds. It is not
recommended that the device be operated at peak currents above the Absolute
Maximum Peak Forward Current.
1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation
pattern may not be aligned with this axis.
2. φv is the total luminous flux output as measured with an integrating sphere.
3. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.
4. θ1/2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity.
5. Radiant intensity, Iv, in watts/steradian, may be calculated from the equation Iv = Iv/ηv, where Iv is the luminous intensity in
candelas and ηv is the luminous efficacy in lumens/watt.