Datasheet HLB123T Datasheet (HSMC)

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 1993.05.15 Revised Date : 2001.02.14 Page No. : 1/3
HLB123T
Description
The HLB123T is designed for high voltage. High speed switching inductive circuits and amplifier applications.
Features
High Speed Switching
Low Saturation Voltage
High Reliability
(Ta=25°C)
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature....................................................................................................... -50 ~ +150 °C
Junction Temperature ............................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ............................................................................................... 3.5 W
Total Power Dissipation (Tc=25°C)................................................................................................. 30 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ................................................................................................ 600 V
BVCEO Collector to Emitter Voltage ............................................................................................. 400 V
BVEBO Emitter to Base Voltage ....................................................................................................... 8 V
IC Collector Current (DC).................................................................................................................. 1 A
IC Collector Current (Pulse).............................................................................................................. 2 A
(Ta=25°C)
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions BVCBO 600 - - V IC=1mA, IE=0 BVCEO 400 - - V IC=10mA, IB=0 BVEBO 8 - - V IE=1mA, IC=0
ICBO - - 10 uA VCB=600V, IE=0
IEBO - - 10 uA VBE=9V, IC=0 *VCE(sat)1 - - 0.8 V IC=0.1A, IB=10mA *VCE(sat)2 - - 0.9 V IC=0.3A, IB=30mA *VBE(sat)1 - - 1.2 V IC=0.1A, IB=10mA *VBE(sat)2 - - 1.8 V IC=0.3A, IB=30mA
*hFE1 10 - 50 IC=0.3A, VCE=5V *hFE2 10 - - IC=0.5A, VCE=5V *hFE3 6 - - IC=1A, VCE=5V
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank B1 B2 B3 B4 B5 B6 B7 B8
Range 10-17 13-22 18-27 23-32 28-37 33-42 38-47 43-50
HLB123T HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : Preliminary Data Issued Date : 1993.05.15 Revised Date : 2001.02.14 Page No. : 2/3
100
Current Gain & Collector Current
hFE
10
1 10 100 1000
1000
Collector Curren t ( mA)
On Vol t age & Coll ect or Cur ren t
hFE @ VCE=5V
BE(on)
V
@ VCE=5V
1000
100
10
Satu r ation Voltage ( m V)
1
Saturation Voltage & C ollect or Current
BE(sat)
V
CE(sat)
V
1 10 100 1000
Collector Curren t ( mA)
@ IC=10I
@ IC=10I
B
B
Capa citan ce & Rev er se- Biased Vol t age
100
On Voltage (mV)
100
1 10 100 1000
Collector Curren t ( mA)
Switching Time & Collector Current
10.0 VCC=100V, IC=5IB1=-5I
1.0
Switching Time ( us)
B2
Tstg
Tf
Ton
10
Capac itance (pF)
1
0.1 1 10 100
Reverse- Biased Vol tage (V)
Cob
Safe Operating Area
10000
1000
PT=1ms
100
Collector Curren t ( mA)
PT=100ms PT=1s
0.1
0.1 1.0
Collector Curren t ( A)
10
1 10 100 1000
Forwar d Vol tage (V)
HLB123T HSMC Product Specification
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126 Dimension
Spec. No. : Preliminary Data Issued Date : 1993.05.15 Revised Date : 2001.02.14 Page No. : 3/3
I
KJ
M
α
3
α
4
L
3-Lead TO-126 Plastic Package
HSMC Packa
° ° ° °
-
-
-
-
e Code : T
*3
°
*3
°
*3
°
*3
°
Marking :
DIM
HSMC Logo
Part Number
Date Code
Style : Pin 1.Emitter 2.Collector 3.Base
Min. Max. Min. Max.
Product Series
Rank
Ink Marking
F 0.0280 0.0319 0.71 0.81 G 0.0480 0.0520 1.22 1.32 H 0.1709 0.1890 4.34 4.80
I 0.0950 0.1050 2.41 2.66
DIM
1
α
2
α
3
α
4
α
D
E
A
B
2
1
3
G
C
F
H
α
1
α
2
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
-
-
-
-
*3 *3 *3
*3 A 0.1500 0.1539 3.81 3.91 J 0.0450 0.0550 1.14 1.39 B 0.2752 0.2791 6.99 7.09 K 0.0450 0.0550 1.14 1.39
C 0.5315 0.6102 13.50 15.50 L - *0.0217 - *0.55 D 0.2854 0.3039 7.52 7.72 M 0.1378 0.1520 3.50 3.86
E 0.0374 0.0413 0.95 1.05
Notes :
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
HLB123T HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Loading...