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HI-SINCERITY
MICROELECTRONICS CORP.
HLB120A
NPN Triple Diffused Planar Type High Voltage Transistors
Description
The HLB120A is a medium power transistor designed for use in
switching applications.
Spec. No. : HE6412
Issued Date : 1998.12.01
Revised Date : 2002.01.31
Page No. : 1/3
Features
• High Breakdown Voltage
• Low Collector Saturation Voltage
• Fast Switching Speed
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 625 mW
Total Power Dissipation (Tc=25°C)....................................................................................... 7 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage....................................................................................... 600 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 6 V
IC Collector Current (DC)............................................................................................... 100 mA
IC Collector Current (Pulse) ........................................................................................... 200 mA
IB Base Current (DC)....................................................................................................... 20 mA
IB Base Current (Pulse).................................................................................................... 40 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max Unit Test Conditions
BVCBO 600 - - V IC=100uA, IE=0
BVCEO 400 - - V IC=10mA, IB=0
BVEBO 6 - - V IE=10uA,, IC=0
ICBO - - 10 uA VCB=550V
ICEO - - 10 uA VCE=400V, IB=0
IEBO - - 10 uA VEB=6V, IC=0
*VCE(sat)1 - - 400 mV IC=50mA, IB=10mA
*VCE(sat)2 - - 750 mV IC=100mA, IB=20mA
*VBE(sat) - - 1 V IC=50mA, IB=10mA
*hFE1 8 - - VCE=10V, IC=10mA
*hFE2 10 - 36 VCE=10V, IC=50mA
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HLB120A HSMC Product Specification
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HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6412
Issued Date : 1998.12.01
Revised Date : 2002.01.31
Page No. : 2/3
100
Current Gain & Collector Current
VCE=10V
10
hFE
1
1 10 100 1000
10000
Sat urati on Voltage & Col lector Current
Collector Current (m A)
10000
1000
100
Saturat ion Volt age ( m V)
10
1 10 100 1000
Collector Current (mA)
CE(sat)
V
@ IC=5I
B
Capacitan ce & R everse- Biased Volta ge
10
Saturat ion Voltage & Coll ector Curr ent
1000
BE(sat)
V
Saturat ion Voltag e ( m V)
100
1 10 100 1000
Collector Current (m A)
Switch ing time & Collector Current
10.00
Tstg
1.00
Tf
Ton
0.10
Switching Time (us)...
VCC=125V, IC=5I
0.01
10 100
B
Collector Current (mA)
@ IC=5I
B
Capacitance (Pf )
1
1 10 100
Reverse Biased Voltage ( V)
Cob
Safe Operati ng Area
1
0.1
PT=1ms
PT=100ms
0.01
Collector Current (mA
0.001
1 10 100 1000
PT=1s
Forwar d Voltage ( V)
HLB120A HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6412
Issued Date : 1998.12.01
Revised Date : 2002.01.31
Page No. : 3/3
C
A
α2
B
31
2
α3
D
H
I
α1
G
Marking:
HSMC Logo
Part Number
Date Code
HSMC Logo
Part Number
Style: Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HLB120A HSMC Product Specification
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