Datasheet HJ32C Datasheet (HSMC)

Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HJ32C
Description
The HJ32C is designed for use in general purpose amplifier and low speed switching applications.
Spec. No. : HE6002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 15 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage.................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................. -100 V
BVEBO Emitter to Base Voltage........................................................................................... -5 V
IC Collector Current.............................................................................................................. -3 A
TO-252
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -100 - - V IC=-1mA, IE=0 BVCEO -100 - - V IC=-30mA, IB=0
ICES - - -20 uA VCE=-100V, VEB=0 ICEO - - -50 uA VCE=-60V, IB=0 IEBO - - -1 mA VEB=-5V, IC=0
*VCE(sat) - - -1.2 V IC=-3A, IB=-375mA
*VBE(on) - - -1.8 V VCE=-4V, IC=-3A
*hFE1 25 - - VCE=-4V, IC=-1A *hFE2 10 - 50 VCE=-4V, IC=-3A
fT 3 - - MHz VCE=-10V, IC=-500mA, f=1MHz
*Pulse T est: Pulse Width 380us, Duty Cycle≤2%
HJ32C HSMC Product Specification
Page 2
HI-SINCERITY
)
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 2/3
100
75oC125oC
hFE
10
25oC
hFE @ VCE=4V
1 10 100 1000 10000
Collec tor Current IC (mA)
ON Voltage & Collector Current
10000
Current Gain & Collector Current
1000
75oC
125oC
Satur ation Voltag e (mV)
100
1 10 100 1000 10000
25oC
Collec tor Current IC (mA)
CE(sat)
V
@ IC=8I
Switching Time & Collector Current
Sat urat ion Vol tage & Collect or Cu rrent
10.00 VCC=30V, IC=10IB1=-10I
1.00
B2
B
1000
ON Voltage (mV)
100
1 10 100 1000 10000
25oC
75oC125oC
Collec tor Current IC (mA)
BE(ON)
V
@ VCE=4V
Capacitance & Reverse- Biased Voltage
1000
100
Capacitance (pF)
Cob
Ton Tstg
0.10
Switching Times (us)..
0.01
0.1 1.0 10.0
10000
1000
100
Collector Current (mA
10
Collector Current (A)
Safe Operati ng Area
Tf
PT=1ms
PT=100ms PT=1s
10
0.1 1 10 100
Rev e r se- Biased Voltage ( V)
1
1 10 100 1000
Forwar d Vol t a ge ( V)
HJ32C HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6002 Issued Date : 1994.03.02 Revised Date : 2002.01.17 Page No. : 3/3
A
B
L
F
G
C
D
Marking:
Date Code
HJ
23C
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
*: Typical
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max. A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80 B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30 C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90 D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80 E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50 F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ32C HSMC Product Specification
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