Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HJ3055
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HJ3055 is designed for general purpose of amplifier and
switching applications.
Spec. No. : HE6004-B
Issued Date : 1994.10.04
Revised Date : 2000.11.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 20 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage...................................................................................... 70 V
BVCEO Collector to Emitter Voltage................................................................................... 60 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current ........................................................................................................... 10 A
IB Base Current.................................................................................................................... 6 A
Characteristics
Symbol Min. Typ. Max. Unit Test Co nditions
BVCBO 70 - - V IC=30mA, IE=0
BVCEO 60 - - V IC=1mA, IB=0
BVEBO 5 - - V IE=1mA, IC=0
ICBO - - 20 uA VCB=70V, IE=0
ICEX - - 20 uA VCE=70V, VEB(off)=1.5V
ICEO - - 50 uA VCE=30V, IB=0
IEBO - - 0.5 mA VEB=5V, IC=0
*VCE(sat)1 - - 1.1 V IC=4A, IB=400mA
*VCE(sat)2 - - 8 V IC=10A, IB=3.3A
*VBE(on) - - 1.8 V VCE=4V, IC=4A
*hFE1 20 - 100 VCE=4V, IC=4A
*hFE2 5 - - VCE=4V, IC=10A
fT 2 - - MHz VCE=10V, IC=500mA, f=1MHz
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6004-B
Issued Date : 1994.10.04
Revised Date : 2000.11.01
Page No. : 2/3
100
Current Gain & Collector Current
hFE @ VCE=4V
hFE
10
1 10 100 1000 10000
Collector Current (mA)
On Vol t age & Coll ect or Current
10000
10000
1000
100
Saturation Voltage (mV)
10
Saturation Voltage & Collect or Cu rr ent
BE(sat)
V
CE(sat)
V
1 10 100 1000 10000
Collector Current (mA)
@ IC=10I
@ IC=10I
B
B
Switching Time & Collector Current
10
1
Tstg
1000
On Voltage (mV)
100
1 10 100 1000 10000
1000
100
Capac itance (pF)
Capacit ance & Reverse- Bia sed Voltage
BE(on)
V
@ VCE=4V
Collector Curren t ( mA)
Cob
Ton
0.1
Switchin g T imes ( us)
Tf
0.01
0.1 1.0 10.0
Collector Current (A)
10
0.1 1 10 100
Reverse- Biased Vol tage (V)
HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6004-B
Issued Date : 1994.10.04
Revised Date : 2000.11.01
Page No. : 3/3
A
B
L
F
G
C
D
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Ink Mark
Style : Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code : J
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
Loading...