Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
HJ127
PNP EPITAXIAL PLANAR TRANSISTOR
Description
• High DC current gain
• Built-in a damper diode at E-C
Spec. No. : HE6017
Issued Date : 1996.04.12
Revised Date : 2003.01.17
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stora ge Temperature........................................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................................................ +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)................................................................................................. 20 W
• Maximum Voltages and Currents
BVCBO Collector to Base Voltage............................................................................................... -100 V
BVCEO Collector to Emitter Voltage............................................................................................ -100 V
BVEBO Emitter to Base Voltage...................................................................................................... -5 V
IC Collector Current......................................................................................................................... -5 A
TO-252
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -100 - - V IC=-1mA, IE=0
BVCEO -100 - - V IC=-30mA, IB=0
BVEBO -5 - - V IE=-1mA, IC=0
ICBO - - -10 uA VCB=-100V, IE=0
IEBO - - -2 mA VEB=-5V, IC=0
ICEX - - -10 uA VCE=-100V, VBE(off)=-1.5V
*VCE(sat)1 - - -2 V IC=-4A, IB=-16 mA
*VCE(sat)2 - - -4 V IC=-8A, IB=-80 mA
*VBE(sat) - - -4.5 V IC=-8A, IB=-80mA
*VBE(on) - - -2.8 V VCE=-4V, IC=-4A
*hFE1 1 - 12 K VCE= - 4 V, IC=-4A
*hFE2 100 - - VCE=-4V, IC=-8A
Cob - - 300 pF VCB=-10V, f=0.1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Darlington Schematic
C
B
R2R1
E
HJ127 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6017
Issued Date : 1996.04.12
Revised Date : 2003.01.17
Page No. : 2/3
10000
1000
hFE @ VCE=4V
100
hFE
10
1
1 10 100 1000 10000
Collector Current (mA)
On Voltage & Coll ector Current
10000
Curren t Ga in & C ollector Cu rrent
10000
BE(sat)
V
CE(sat)
V
@ IC=100I
@ IC=100I
1000
Satu r ation Vol tage (m V)
100
10 100 1000 10000
Collector Current (m A)
B
B
Switchin g Time & Col lector Current
Sat urat ion Vol tage & Collect or Cu rrent
10
VCC=30V, IC=250IB1=-250I
B2
1000
On Vo ltag e ( mV)
100
1 10 100 1000 10000
Collector Current (mA)
BE(on)
V
@ VCE=4V
Capa citance & Rev er se- B i ased Voltage
1000
100
Capacitan c e ( pF)
Cob
Tstg
1
Tf
Switching T imes ( us)
0.1
110
Ton
Collector Current (A)
Safe Operating Ar ea
100000
PT=1ms
10000
(mA)
C
1000
Collector Current-I
100
10
PT=100ms
PT=1s
10
0.1 1 10 100
Reverse- Biased Vol t a ge ( V)
1
1 10 100
Forwar d Voltage- VCE (V)
HJ127 HSMC Product Specification
Page 3
HI-SINCERITY
MICROELECTRONICS CORP.
TO-252 Dimension
Spec. No. : HE6017
Issued Date : 1996.04.12
Revised Date : 2003.01.17
Page No. : 3/3
A
B
L
F
G
C
D
Marking:
Date Code
HJ
217
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
3
H
E
K
2
I
1
J
3-Lead TO-252 Plastic Surface Mount Package
HSMC Package Code: J
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.0866 0.1102 2.20 2.80
B 0.0650 0.0768 1.65 1.95 H - *0.0906 - *2.30
C 0.0354 0.0591 0.90 1.50 I - 0.0354 - 0.90
D 0.0177 0.0236 0.45 0.60 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2125 0.2283 5.40 5.80 L 0.0551 0.0630 1.40 1.60
Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
*: Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
•
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HJ127 HSMC Product Specification
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