Page 1
查询HIN241供应商
TM
HIN231, HIN232, HIN236, HIN237,
HIN238, HIN239, HIN240, HIN241
Data Sh eet August 2001
+5V Powered RS-232
Transmitters/Receivers
The HIN231-HIN241 family ofRS-232 transmitters/receivers
interface ci rcui tsmeet allElA RS-232E and V.28 specifications,
and areparticularly suited for t hoseapplications where ±12V is
not available. They require asingle +5V power supply (except
HIN231 and HIN239)and feature onboard charge pump
voltage converters which generate +10V and -10V supplies
from t he5V supply. The f amilyof devicesoffer a wide variety of
RS-232transmitter/receivercombinationsto accommodate
various applications (see Selection Table).
The drivers feature true TTL/CMOS input compatibility,slewrate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V,and have a 3kΩ to 7kΩ
input i mpedance. The receivers also feature hysteresis to
greatly improve noise rejection.
File Number 3138.10
Features
• Meets All RS-232E and V.28 Specifications
• Requires Only Single +5V Power Supply
- (+5V and +12V - HIN231 and HIN239)
• HighDataRate...........................120kbps
• HIN233 and HIN235 Require No External Capacitors
• Onboard Voltage Doubler/Inverter
• Low Power Consumption
• Low Power Shutdown Function
• Three-State TTL/CMOS Receiver Outputs
•MultipleDrivers
- ±10V Output Swing for 5V lnput
-300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
-30V/µs Maximum Slew Rate
• Multiple Receivers
- ±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5VHysteresis to Improve Noise Rejection
Applications
• Any System Requiring RS-232 Communication Ports
- Computer- Portable,Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Selection Table
PART
NUMBER
HIN231 +5V and +7.5V to 13.2V 2 2 2 Capacitors NO/NO 16
HIN232 +5V 2 2 4 Capacitors NO/NO 16
HIN236 +5V 4 3 4Capacitors YES/YES 24
HIN237 +5V 5 3 4 Capacitors NO/NO 24
HIN238 +5V 4 4 4 Capacitors NO/NO 24
HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors NO/YES 24
HIN240 +5V 5 5 4Capacitors YES/YES 44
HIN241 +5V 4 5 4Capacitors YES/YES 28
POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
EXTERNAL
COMPONENTS
LOW POWER
SHUTDOWN/TTL
THREE-STAT E
NUMBER OF
LEADS
1
1-888-INTERSIL or 321-724-7143 | Intersil and Designisatrademarkof IntersilAmericas Inc. | Copyright © Intersil Americas Inc. 2001
CAUTION: These devices aresensitiveto electrostatic discharge;followproper IC Handling Procedures.
Page 2
HIN231 thru HIN241
Ordering Information
PART
NUMBER
HIN231IB -40 to 85 16 Ld SOIC M16.3
HIN232CP 0to70 16LdPDIP E16.3
HIN232CB 0to70 16LdSOIC M16.3
HIN232IP -40to85 16LdPDIP E16.3
HIN232IB -40 to 85 16 Ld SOIC M16.3
HIN236CP 0to70 24LdPDIP E24.3
HIN236CB 0to70 24LdSOIC M24.3
HIN236IB -40 to 85 24 Ld SOIC M24.3
HIN237CB 0to70 24LdSOIC M24.3
HIN238CP 0to70 24LdPDIP E24.3
TEMP.
RANGE (
o
C) PACKAGE PKG. NO.
Ordering Information (Continued)
PART
NUMBER
HIN238CB 0to70 24LdSOIC M24.3
HIN238IB -40to85 24LdSOIC M24.3
HIN239CB 0to70 24LdSOIC M24.3
HIN239CP 0to70 24LdPDIP E24.3
HIN239IB -40to85 24LdSOIC M24.3
HIN240CN 0to70 44LdMQFP Q44.10X10
HIN241CB 0to70 28LdSOIC M28.3
HIN241IB -40to85 28LdSOIC M28.3
HIN241CA 0to70 28LdSSOP M28.209
NOTE: Many of thesurfacemountdevicesareavailableon tapeand
reel;add -T to suffix.
TEMP.
RANGE (
o
C) PACKAGE PKG. NO.
Pin Descriptions
PIN FUNCTION
V
CC
V+ Internally generatedpositive supply (+10V nominal), HIN231 and HIN239require+7.5V to +13.2V.
V- Internallygenerated negative supply(-10V nominal).
GND Groundlead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead.
T
IN
T
OUT
R
IN
R
OUT
EN
SHUTDOWN Shutdown Input. With SHUTDOWN = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state
NC No Connect. No connectionsare made to these leads.
Power Supply Input 5V ±10%.
Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCCis connected to each lead.
TransmitterOutputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the outputs are placedin a high
impedance state.
and the transmitters are shut off.
2
Page 3
Pinouts
HIN231 (SOIC)
TOP VIEW
16
15
14
13
12
11
10
R2
T2
OUT
R2
OUT
T2
C+
NC
1
2
C-
3
V-
4
5
IN
6
7
IN
8
NOTE:
1. Pin numbers in parentheses are for PDIP Package.
+5V
15
V
CC
1
C
+
1
1µF
(NOTE 2)
T1
IN
T2
IN
R1
OUT
R2
OUT
+
2
C
+5V
10
+5V
7
+12V TO -12V
VOLTAGE INVERTER
-
1
400kΩ
400kΩ
T1
T2
R1
R2
14
(NOTE 1)
V+
(14)
(13)
V
CC
GND
(12)
T1
(11)
OUT
(10)
R1
IN
(9)
R1
OUT
(8)
T1
IN
9
NC
+7.5VTO+13.2V(NOTE2)
16
V+
3
V-
13
4
1211
5kΩ
56
5kΩ
HIN231 thru HIN241
NOTE 3
1µF
+
T1
OUT
T2
OUT
R1
IN
R2
IN
NOTE 3
R1
R2
T1
T2
OUT
OUT
HIN232 (PDIP, SOIC)
TOP VIEW
5kΩ
5kΩ
16
V
CC
15
GND
14
T1
OUT
13
R1
IN
12
R1
OUT
11
T1
IN
10
T2
IN
9
R2
OUT
NOTE 3
+
2
V+
6
V-
NOTE 3
+
14
7
1312
89
T1
T2
R1
R2
OUT
OUT
IN
IN
1
C1+
2
V+
3
C1-
4
C2+
5
C2-
6
V-
7
T2
OUT
8
R2
IN
+5V
+
1µF
1
C1+
+
3
4
+
5
11
IN
10
IN
VOLTAGE DOUBLER
C1C2+
VOLTAGE INVERTER
C2-
+5V
400kΩ
+5V
400kΩ
16
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
R1
R2
OTE:
2. For V+ > 11V, use C
≤ 0.1µF.
1
15
NOTE:
3. Either 0.1µFor1µF capacitors may be used. The V+ capacitor
maybeterminatedtoV
or to GND.
CC
3
Page 4
Pinouts (Continued)
HIN236 (PDIP, SOIC)
TOP VIEW
HIN231 thru HIN241
HIN237 (PDIP, SOIC)
TOP VIEW
R1
R2
R3
1
T3
OUT
2
T1
OUT
3
T2
OUT
4
R1
IN
OUT
T2
T1
GND
V
CC
C1+
V+
C1-
5
6
IN
7
IN
8
9
10
11
12
R1
+5V
10
C1+
+
1µF
12
C1-
13
C2+
+
1µF
14
C2-
+5V
400kΩ
T1
T2
T3
T4
OUT
7
IN
+5V
400kΩ
6
IN
+5V
400kΩ
18 1
IN
+5V
400kΩ
19 24
IN
V
CC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1
T2
T3
T4
R1
OUT
R2
OUT
EN
20
R3
24
T4
23
R2
22
R2
21
SHUTDOWN
20
EN
19
T4
18
T3
17
R3
16
R3
15
V-
14
C2-
13
C2+
OUT
IN
OUT
IN
IN
OUT
IN
T3
T1
T2
R1
OUT
OUT
OUT
R1
OUT
T2
T1
GND
V
CC
C1+
V+
C1-
1
2
3
4
IN
5
6
IN
7
IN
8
9
10
11
12
24
T4
OUT
R2
23
IN
R2
22
OUT
T5
21
IN
T5
20
OUT
T4
19
IN
T3
18
IN
R3
17
OUT
R3
16
IN
V-
15
14
C2-
13
C2+
+5V
9
V+
V-
1µF
+
11
15
1µF
+
2
3
T1
OUT
T2
OUT
T3
OUT
T4
R1
OUT
IN
45
5kΩ
2322
R2
IN
R1
10
C1+
+
1µF
12
C1-
13
+
1µF
14
T1
T2
T3
T4
T5
OUT
7
IN
6
IN
18 1
IN
19 24
IN
21 20
IN
VOLTAGE DOUBLER
C2+
VOLTAGE INVERTER
C2-
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
+5V
400kΩ
5kΩ
R2
R3
OUT
OUT
5kΩ
1617
21
SHUTDOWN
R3
IN
8
9
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
T5
R1
R2
R3
5kΩ
5kΩ
5kΩ
V+
1µF
+
11
15
V-
1µF
+
2
3
45
2322
1617
T1
T2
T3
T4
T5
R1
R2
R3
OUT
OUT
OUT
OUT
OUT
IN
IN
IN
8
4
Page 5
Pinouts (Continued)
HIN238 (PDIP, SOIC)
TOP VIEW
HIN231 thru HIN241
HIN239 (SOIC)
TOP VIEW
R1
R2
R3
R4
T2
1
OUT
T1
2
OUT
R2
3
IN
R2
4
OUT
T1
5
IN
R1
6
OUT
R1
7
IN
GND
8
V
9
CC
C1+
10
V+
11
C1-
12
+5V
10
C1+
+
1µF
12
C1-
13
C2+
+
1µF
14
C2-
+5V
400kΩ
T1
T2
T3
T4
OUT
5
IN
+5V
400kΩ
18
IN
+5V
400kΩ
19 24
IN
+5V
400kΩ
21 20
IN
V
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLT AGE INVERTER
T1
T2
T3
T4
R1
OUT
R2
OUT
R3
OUT
R4
CC
T3
24
OUT
R3
23
IN
R3
22
OUT
T4
21
IN
T4
20
OUT
T3
19
IN
T2
18
IN
R4
17
OUT
R4
16
IN
V-
15
C2-
14
C2+
13
9
V+
1µF
+
11
(NOTE)
15
V-
1µF
+
2
1
76
T1
T2
T3
T4
R1
OUT
OUT
OUT
OUT
IN
R1
R2
T1
T2
T3
OUT
OUT
5kΩ
34
R2
IN
R3
OUT
5kΩ
2322
R3
IN
R4
OUT
5kΩ
1617
R4
IN
R5
OUT
5kΩ
R1
1
OUT
R1
2
IN
3
GND
V
4
CC
5
V+
6
C1+
7
C1-
8
V-
9
R5
IN
R5
10
OUT
R4
11
OUT
R4
12
IN
+5V
6
C1+
+
1µF
7
C1-
+5V
400kΩ
24
IN
+5V
400kΩ
23
IN
+5V
400kΩ
16 13
IN
V
CC
+10V TO -10V
VOLT AGE INVERTER
T1
T2
T3
1
R1
R2
R3
R4
R5
EN
14
T1
24
IN
T2
23
IN
R2
22
OUT
R2
21
IN
T2
20
OUT
T1
19
OUT
R3
18
IN
R3
17
OUT
T3
16
IN
15
NC
14
EN
T3
13
OUT
+7.5V TO +13.2V (NOTE)
4
V+
V-
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
5
8
1µF
+
19
20
2
2122
1817
1211
910
T1
T2
T3
R1
R2
R3
R4
R5
OUT
OUT
OUT
IN
IN
IN
IN
IN
8
3
NOTE: For V+ > 11V, u s e C1≤ 0.1µF.
5
Page 6
Pinouts (Continued)
NC
SHUTENT5
DOWN
44 43 42 41 40
1
2
3
4
5
6
7
8
9
10
11
12 13 14 15 16 17
NC
OUT
R2
25
C1+
+
27
C1-
28
C2+
+
29
C2-
+5V
400kΩ
15
+5V
400kΩ
14
+5V
400kΩ
37 6
+5V
400kΩ
38 5
+5V
400kΩ
241
16
42
R3
T4
T3
T1
T2
T5
R3
R2
NC
OUT
OUT
OUT
OUT
OUT
NC
NC
R1
R2
R3
R4
R5
IN
IN
IN
1µF
1µF
T1
T2
T3
T4
T5
OUT
OUT
OUT
OUT
OUT
IN
IN
IN
IN
IN
EN
HIN240 (MQFP)
OUT
IN
OUT
R4
T4INT3INR5
R4
39 38 37 36 35 34
IN
IN
OUT
T2INT1
VOLTAGE DOUBLER
VOLTAGE INVERTER
R1
R1
+5V
19
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
T5
R1
R2
R3
R4
R5
18
GND
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
CC
V
OUTR5IN
NC
33
32
31
30
29
28
27
26
25
24
23
2221201918
NCNCNC
26
V+
30
V-
7
8
17
1013
43
4039
3536
43
HIN231 thru HIN241
NC
NC
NC
VC2C2+
C1V+
C1+
NC
NC
1µF
+
1µF
T1
OUT
T2
OUT
T3
OUT
T4
OUT
T5
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
SHUTDOWN
R1
R2
R3
R4
R5
1µF
1µF
T1
T2
T3
T4
OUT
OUT
OUT
OUT
OUT
HIN241 (SOIC, SSOP)
TOP VIEW
T3
1
OUT
T1
2
OUT
T2
3
OUT
R2
4
IN
R2
5
OUT
T2
6
IN
T1
7
IN
R1
8
OUT
R1
9
IN
GND
10
11
V
CC
C1+
12
13
V+
14
C1-
+5V
12
C1+
+
14
C1-
15
+
16
IN
IN
20 1
IN
21 28
IN
8
24
EN
VOLTAGE DOUBLER
C2+
VOLT AGE INVERTER
C2-
+5V
400kΩ
7
+5V
400kΩ
6
+5V
400kΩ
+5V
400kΩ
11
V
CC
+5V TO 10V
+10V TO -10V
T1
T2
T3
T4
R1
R2
R3
R4
R5
10
5kΩ
5kΩ
5kΩ
5kΩ
5kΩ
28
T4
OUT
27
R3
IN
R3
26
OUT
SHUTDOWN
25
24
EN
R4
23
IN
R4
22
OUT
T4
21
IN
20
T3
IN
R5
19
OUT
R5
18
IN
V-
17
16
C2-
15
C2+
13
V+
17
V-
2
3
9
45
2726
2322
1819
25
1µF
+
1µF
+
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
SHUTDOWN
6
Page 7
HIN231 thru HIN241
Absolute Maximum Ratings Thermal Information
VCCtoGround......................(GND-0.3V)<VCC<6V
V+toGround(Note4)...............(V
-0.3V)<V+<13.2V
CC
V-toGround........................-12V<V-<(GND+0.3V)
V+toV-........................................... 24V
Input Voltages
T
.............................-0.3V<VIN<(V++0.3V)
IN
R
............................................ ±30V
IN
OutputVoltages
T
....................(V--0.3V)<V
OUT
R
.................(GND-0.3V)<V
OUT
Short Circuit Duration
T
......................................Continuous
OUT
R
......................................Continuous
OUT
TXOUT
RXOUT
<(V++0.3V)
<(V++0.3V)
Operating Conditions
Temperature Range
HIN2XXCX.................................0
HIN2XXIX................................-40
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. Only HIN231 and HIN239. For V+ > 11V, C1 must be ≤0.1µF.
is measured with the component mounted on a low effective thermalconductivity test board in free air. See Tech Brief TB379 for details.
5. θ
JA
o
Cto70oC
o
Cto85oC
Thermal Resistance (Typical, Note 5) θ
JA
(oC/W)
16LdPDIPPackage........................ 90
24LdPDIPPackage........................ 70
16LdSOIC(W)Package..................... 100
24LdSOICPackage........................ 75
28LdSOICPackage........................ 70
28LdSSOPPackage....................... 95
44LdMQFPPackage....................... 80
MaximumJunction Temperature (PlasticPackage) . . . . . . . .150
MaximumStorageTemperatureRange..........-65
o
Cto150oC
MaximumLead Temperature(Soldering 10s) . . . . . . . . . . . . .300
(SOIC, SS OP,MQFP - Lead Tips Only)
o
C
o
C
Electrical Specifications Test Conditions: V
=+5V ±10%, TA= Operating Temperature Range
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, I
CC
V+ Power Supply Current, I
No Load, TA=25oC
Shutdown Supply Current, I
CC
(SD) TA=25oC-110µA
CC
No Load,
T
=25oC
A
No Load,
TA=25oC
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, V
Input Logic High, V
Transmitter Input Pullup Current, I
TTL/CMOS Receiver Output Voltage Low, V
TTL/CMOS Receiver Output Voltage High, V
lL
lH
P
OL
OH
RECEIVER INPUTS
RS-232 Input VoltageRange V
Receiver I nput Impedance R
Receiver Input Low Threshold, V
Receiver I nput High Threshold,V
Receiver Input HysteresisV
IN
IN
(H-L) VCC=5V,TA=25oC0.81.2-V
lN
(L-H) VCC=5V,TA=25oC-1.72.4V
IN
HYST
HIN232 - 5 10 mA
HIN236-238, HIN240-241 - 7 15 mA
HIN231, HIN239 - 0.4 1 mA
HIN231 - 1.8 5 mA
HIN239 - 5.0 15 mA
TIN,EN, Shutdown - - 0.8 V
T
IN
2.0 - - V
EN, Shutdown 2.4 - - V
TIN= 0V - 15 200 µA
I
=1.6mA
OUT
(HIN231 I
I
= -1.0mA 3.5 4.6 - V
OUT
OUT
=3.2mA)
-0.10.4V
-30 - +30 V
VIN= ±3V 3.0 5.0 7.0 kΩ
0.2 0.5 1.0 V
7
Page 8
HIN231 thru HIN241
Electrical Specifications Test Conditions: V
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
TIMING CHARACTERISTICS
Baud Rate (1 Transmitter Switching) R
Output Enable Time, t
Output Disable Time, t
Propagation Delay, t
InstantaneousSlew Rate SR C
Transition Region Slew Rate, SR
TRANSMITTER OUTPUTS
Output Voltage Swing, T
Output Resistance, R
RS-232 Output Short Circuit Current, I
NOTE:
6. Guaranteed by design.
V
CC
GND
EN
DIS
PD
T
OUT
OUT
SC
VOLTAGE DOUBLER
S1 S2
S3
C1
C1-
+
+
-
C1
S4
=+5V ±10%, TA= Operating Temperature Range (Continued)
CC
+
C3
V
CC
=3kΩ 120 - - kbps
L
HIN236, 239, 240, 241 - 400 - ns
HIN236, 236, 239, 240, 241 - 250 - ns
RS-232 to TTL - 0.5 - µs
=10pF,RL=3kΩ ,TA=25oC
L
(Note 6)
RL=3kΩ ,CL= 2500pF Measured
from +3V to -3V or -3V to +3V, 1
Transmitter Switching
TransmitterOutputs,3kΩ to Ground ±5 ±9 ±10 V
VCC=V+=V-=0V,V
T
shortedtoGND - ±10 - mA
OUT
GND
CC
S5
S7
V+=2V
= ±2V 300 - - Ω
OUT
VOLTAGE INVERTER
+
C2
+
C2
-
-
C2
--30V/µs
-3-V/µs
S6
S8
+
C4
-
GND
V- = -(V+)
RC
OSCILLATOR
FIGURE 1. CHARGE PUMP
Detailed Description
The HIN232 thru HIN241 family of RS-232
transmitters/receivers are powered by a single +5V power
supply (except HIN231 and HIN239), feature low power
consumption, and meet all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, transmitter, and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in Figure
1. The charge pumpcontainstwo s ections:the voltage
doubler and the voltage inverter. Each section is driven by a
two phase, internally generated clockto generate+10V and
-10V. The nominal clock frequency is 16kHz.Duringphase
one of the clock, capacitor C1 is charged to V
phasetwo,thevoltageonC1isaddedtoV
signal across C3 equal to twice V
also charged to 2V
, and then during phase two, it is
CC
. During phase one, C2 is
CC
invertedwithrespecttogroundtoproduceasignalacrossC4
.During
CC
, producing a
CC
equal to -2V
. The charge pump accepts input voltages up
CC
to 5.5V. The output impedance of the voltage doubler section
(V+)is approximately200Ω, and the output impedance of the
voltage inverter section (V-) is approximately 450Ω.Atypical
application uses1µF capacitors for C1-C4, however, the value
isnot critical. Increasing the valuesof C1 and C2 will lower the
outputimpedance of the voltage doublerand inverter,
increasing the values of the reservoir capacitors, C3 and C4,
lowers the ripple on the V+ and V-supplies.
During shutdown mode (HIN236, 240 and 241),
SHUTDOWN control l ine set to logic “1”, the charge pump is
turnedoff, V+ is pulled down to V
,V-ispulleduptoGND,
CC
and the supply current is reduced to less than 10µA. The
transmitter outputsare disabled and the receiveroutputs are
placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
8
Page 9
HIN231 thru HIN241
threshold is about 26% of V
,or1.3VforVCC= 5V . A logic 1
CC
at the input results in a voltage of between -5V and V- at the
output, and a logic 0 results in a voltage between +5V and (V+
-0.6V). Each transmitter input has an internal 400kΩ pullup
resistor so any unused input can be left unconnected and its
output remains in its low state. The output voltage swing meets
the RS-232C specifications of ±5V minimum with the worst
case conditions of: all transmitters driving 3kΩ minimum load
impedance, V
= 4.5V,and maximum allowable operating
CC
temperature. The transmitters have an internally limited output
slew rate which is less than 30V/µs. The outputs are short
circuit protected and can be shorted to ground indefinitely. The
powered down output impedance is a minimum of 300Ω with
±2V applied to the outputs and V
V+
V
GND < T
CC
T
XIN
XIN<VCC
V-
400kΩ
FIGURE 2. TRANSMITTER
CC
=0V.
300Ω
V- < V
T
OUT
TOUT
<V+
Receivers
The receiver inputs accept up to ±30V while presenting the
required3kΩ to 7kΩ inputimpedance even if the power is off
(V
= 0V). The receivers have a typical input threshold of
CC
1.3V which is within the ±3V l imits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to V
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis to i mprove noise rejection.The receiver Enable
line EN
disables the receiver outputs, placing them i n the high
impedance m ode. The receiver outputs are also placed in
the high impedance state when in shutdown mode.
. The output wi ll be low whenever the input is
CC
, when set to logic “1”, (HIN236, 239, 240, and 241)
V
CC
R
-30V < R
XIN
< +30V
XIN
GND
5kΩ
FIGURE 3. RECEIVER
GND < V
R
OUT
ROUT<VCC
Typical Performance Curves
12
10
8
6
4
V- SUPPLY VOLTAGE
2
0
3.0
3.5
4.0 4.5 6.0
V
CC
T
IN
OR
R
IN
T
OUT
OR
R
OUT
t
PHL
Average Propagation Delay =
t
PLH
t
PHL +tPLH
2
FIGURE 4. PROPAGATION DELAY DEFINITION
12
1µF
0.47µF
0.10µF
5.0 5.5
10
8
6
V- (VCC=4.5V)
4
SUPPLY VOLTAGE (|V|)
2
0
0
V
OL
V
OL
TA=25oC
TRANSMITTER OUTPUTS
OPEN CIRCUIT
V+ (VCC=5V)
|I
LOAD
V+ (VCC=4.5V)
V- (VCC=5V)
|(mA)
30252015105
35
FIGURE 5. V- SUPPLY VOLTAGEvs VCC, VARYING
CAPACITORS
9
FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232)
Page 10
Test Circuits (HIN232)
-
1µF
C3
+
C1+
1
1µF
C1
1µF
C2
3kΩ
T2
OUTPUT
RS-232
±30V INPUT
+
-
+
-
+
1µFC4
V+
2
C1-
3
C2+
4
C2-
5
-
V-
6
T2
7
OUT
8
R2
IN
T1
R1
R2
V
CC
GND
OUT
R1
OUT
T1
T2
OUT
HIN231 thru HIN241
+4.5V TO
+5.5V INPUT
16
15
14
13
IN
12
11
IN
10
IN
9
3kΩ
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
C1+
1
V+
2
3
C1C2+
4
5
C2-
6
VT2
7
R2
8
R
OUT=VIN
VIN= ±2V
OUT
IN
16
V
CC
15
GND
14
T1
OUT
R1
13
IN
R1
12
OUT
T1
11
IN
T2
10
IN
9
R2
OUT
T2
/1
OUT
T1
OUT
A
FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. POWER-OFF SOURCE RESISTANCE
Applications
The HIN2XX may be used f or all RS-232 data terminal and
communicationlinks. It is particularly useful in applications
where ±12V power supplies are not available for
conventionalRS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data terminal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kΩ resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure10), note that each circuit requires t wo charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
CONFIGURATION
TTL/CMOS
INPUTS AND
OUTPUTS
C1
1µF
C2
1µF
+5V
TD
RTS
RD
CTS
16
1
+
3
-
+
-
HIN232
4
5
T1
11
10
12
R2
9
R1
T2
-
+
DTR (20) DATA
2
6
-
+
14
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVE DATA
8
CTS (5) CLEAR TO SEND
SIGNAL GROUND (7)15
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
SELECT
RS-232
INPUTS AND OUTPUTS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS
HANDSHAKING
10
Page 11
HIN231 thru HIN241
TTL/CMOS
INPUTS AND
OUTPUTS
TTL/CMOS
INPUTS AND
OUTPUTS
C1
1µF
TD
RTS
RD
CTS
2µF
C1
1µF
DTR
DSRS
DCD
R1
+
C4
1
+
-
+
-
HIN232
3
T1
11
10
12
R2
9
-
V- V+
6
HIN232
1
3
T1
11
10
12
R2
9
R1
R1
T2
T2
4
+
C2
5
1µF
-
14
TD (2) TRANSMIT DATA
7
RTS (4) REQUEST TO SEND
13
RD (3) RECEIVEDATA
8
CTS (5) CLEAR TO SEND
15
16
26
C3
+
2µF
2
16
4
+
C2
5
1µF
-
14
DTR (20) DATA TERMINAL READY
7
DSRS (24) DATA SIGNALING RATE SELECT
13
DCD (8) DATA CARRIER DETECT
8
R1 (22) RING INDICATOR
+5V
-
RS-232
INPUTS AND OUTPUTS
SIGNAL GROUND (7)15
FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
11
Page 12
Die Characteristics
HIN231 thru HIN241
DIE DIMENSIONS
160 mils x 140 mils
METALLIZATION
Type: Al
Thickness: 10k
Å ±1kÅ
SUBSTRATE POTENTIAL
V+
Metallization Mask Layout
R2
IN
R2
OUT
T2
IN
PASSIVATION
Type: Nitride over Silox
Nitride Thickness: 8k
Å
Silox Thickness: 7kÅ
TRANSISTOR COUNT
238
PROCESS
CMOS Metal Gate
HIN240
T1
T2
OUT
OUT
T3
OUT
T4
OUT
R3
IN
R3
OUT
T5
IN
SHUTDOWN
EN
R1
T1
OUT
R1
GND
V
CC
T5
R4
R4
T4
T3
R5
R5
OUT
IN
OUT
IN
IN
OUT
IN
IN
IN
12
C1+ V+ C1-
V-C2-C2+
Page 13
Dual-In-Line Plastic Packages (PDIP)
HIN231 thru HIN241
N
D1
-C-
E1
-B-
A1
A2
E
A
L
e
C
C
L
e
A
C
e
B
INDEX
AREA
BASE
PLANE
SEATING
PLANE
D1
B1
12 3 N/2
-AD
e
B
0.010 (0.25) C AM BS
NOTES:
1. Controlling Dimensions: INCH. In case ofconflictbetween English and
Metricdimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbolsaredefinedin the “MO Series Symbol List” in Section2.2 of
Publication No. 95.
4. Dimensions A, A1 andL are measuredw ith the package seatedin JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not includemold flash or protrusions.
Mold flash or protrusionsshall not exceed 0.010 inch (0.25mm).
6. E and aremeasured with the leadsconstrainedtobe perpendic-
7. e
e
A
ular to datum .
and eCare measured at the lead tips with the leads unconstrained.
B
e
must be zero or greater.
C
-C-
8. B1 maximumdimensions do not includedambarprotrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Cornerleads(1,N, N/2 and N/2 + 1) for E8.3, E16.3,E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 -
D 0.735 0.775 18.66 19.68 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC e
A
e
B
0.300 BSC 7.62 BSC 6
- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N16 169
NOTESMIN MAX MIN MAX
Rev. 0 12/93
13
Page 14
Dual-In-Line Plastic Packages (PDIP)
HIN231 thru HIN241
N
D1
-C-
E1
-B-
A1
A2
E
A
L
e
C
C
L
e
A
C
e
B
INDEX
AREA
BASE
PLANE
SEATING
PLANE
D1
B1
12 3 N/2
-AD
e
B
0.010 (0.25) C AM BS
NOTES:
1. Controlling D imensions:INCH. In case of con flict between English and
Metricdimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbolsaredefinedin the “MO Series Symbol List” in Section2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measuredwith the package seated in
JEDECseating plane gauge GS-3.
5. D, D1, and E1 dimensions do not includemold flash or protrusions.
Mold flash or protrusionsshall not exceed 0.010 inch (0.25mm).
6. E and are measuredwith the leads constrained to be perpendic-
7. e
e
A
ular to datum .
and eCare measured at the lead tips with the leads unconstrained.
B
e
must be zero or greater.
C
-C-
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Cornerleads(1,N, N/2 and N/2 + 1) for E8.3, E16.3,E18.3, E28.3,
E42.6willhave a B1 dimension of 0.030- 0.045inch (0.76 - 1.14mm).
E24.3 (JEDEC MS-001-AF ISSUE D)
24 LEAD NARROW BODY DU AL-IN-LINE PLASTIC
PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 B1 0.045 0.070 1.15 1.77 8
C 0.008 0.014 0.204 0.355 -
D 1.230 1.280 31.24 32.51 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
e
A
e
B
0.300 BSC 7.62 BSC 6
- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N24 249
NOTESMIN MAX MIN MAX
Rev. 0 12/93
14
Page 15
HIN231 thru HIN241
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
SEATING PLANE
-AD
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
hx45
o
C
NOTES:
1. Symbolsaredefinedin the “MO Series Symbol List” in Section2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” doesnot includeinterlead flash or protrusions.Interlead
flash and protrusionsshall not exceed 0.25mm (0.010 inch) per side.
5. The chamferon the body is optional. If it is not present, a visualindex
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminalnumbers are shown for referenceonly.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controllingdimension: MILLIMETER. Convertedinch dimensionsare
not necessarily exact.
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050BSC 1.27 BSC H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
15
Page 16
HIN231 thru HIN241
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
SEATING PLANE
-AD
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
hx45
o
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D”doesnotincludemoldflash,protrusionsor gateburrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.I nterlead flash and protrusions shall not exceed 0.25mm (0.010inch) per
side.
5. Thechamfer on the body is optional.If it is notpresent, a visualindex
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminalnumbers are shown for referenceonly.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controllingdimension: MILLIMETER.Convertedinchdimensions
are not necessarilyexact.
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
16
Page 17
HIN231 thru HIN241
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
SEATING PLANE
-AD
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
hx45
o
NOTES:
1. Symbols aredefinedinthe“MO SeriesSymbolList”in Section2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” doesnot includemoldflash,protrusionsor gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.I nterlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamferon the body is optional.If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminalnumbers are shown for referenceonly.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER.Converted inch dimensions are not necessarily exact.
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 D 0.6969 0.7125 17.70 18.10 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC H 0.394 0.419 10.00 10.65 -
C
h 0.01 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N28 287
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMINMAXMINMAX
-
17
Page 18
HIN231 thru HIN241
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
123
SEATING PLANE
-AD
e
B
0.25(0.010) C AM BS
M
E
-B-
A
-C-
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
C
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” doesnot includemoldflash,protrusionsor gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078inch) per side.
4. Dimension “E” does not include interleadflash or protrusions. Interlead flash and protrusionsshallnot exceed 0.20mm (0.0078 inch)
per side.
5. The chamferonthe body is optional. If it is not present,a visual index feature must be locatedwithin the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminalnumbers are shown for referenceonly.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B”
dimension at maximum material condition.
10. Controllingdimension: MILLIMETER. Convertedinchdimensions
are not necessarilyexact.
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.078 - 2.00 A1 0.002 - 0.05 - A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.390 0.413 9.90 10.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N28 287
o
α
0
o
8
o
0
o
8
Rev. 1 3/95
NOTESMIN MAX MIN MAX
-
18
Page 19
HIN231 thru HIN241
Metric Plastic Quad Flatpack Packages (MQFP)
E
E1
0.40
0.016
0oMIN
0o-7
-H-
-A-
o
MIN
D
D1
-D-
Q44.10x10 (JEDEC MS-022AB ISSUE B)
44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
INCHES MILLIMETERS
SYMBOL
NOTESMINMAXMINMAX
A - 0.096 - 2.45 -
A1 0.004 0.010 0.10 0.25 -
-B-
A2 0.077 0.083 1.95 2.10 -
b 0.012 0.018 0.30 0.45 6
b1 0.012 0.016 0.30 0.40 -
D 0.515 0.524 13.08 13.32 3
D1 0.389 0.399 9.88 10.12 4, 5
E 0.516 0.523 13.10 13.30 3
e
PIN 1
E1 0.390 0.398 9.90 10.10 4, 5
L 0.029 0.040 0.73 1.03 -
N44 447
e 0.032 BSC 0.80 BSC -
12o-16
A2
SEATING
PLANE
A
0.076
b1
0.003
-C-
b
o
A1
0.20
0.008
A-B SDSCM
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarilyexact.
2. All dimensionsand tolerances per A NSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane .
4. Dimensions D1 and E1 to be determinedat datumplane
-H-
.
5. Dimensions D1 and E1 do not include mold protrusion.
Rev.2 4/99
-C-
Allowable protrusion is 0.25mm(0.010 inch) per side.
0.13/0.17
o
L
12o-16
0.005/0.007
BASE METAL
WITH PLATING
0.13/0.23
0.005/0.009
6. Dimension b does not include dambar protrusion. Allowable
dambarprotrusion shall be 0.08mm (0.003 inch) total.
7. “N” is the number of terminal positions.
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19
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