Datasheet HI-8382UT, HI-8382U, HI-8382ST, HI-8382SM-01, HI-8382S Datasheet (HOLT)

...
January2001
TheHI-8382andHI-8383businterfaceproductsaresilicon gateCMOSdevicesdesignedasalinedriverinaccordancewith theARINC429busspecifications.
HI-8382,HI-8383
PINCONFIGURATION (TopView)GENERALDESCRIPTION
Inputsareprovidedforclockingandsynchronization.These signalsareAND'dwiththeDATAinputstoenhancesystem performanceandallowtheHI-8382tobeusedinavarietyof applications.Bothlogicandsynchronizationinputsfeature built-in2,000VminimumESDinputprotectionaswellasTTL andCMOScompatibility.
ThedifferentialoutputsoftheHI-8382areindependently programmabletoeitherthehighspeedorlowspeedARINC 429 outputriseandfalltimespecificationsthroughtheuseoftwo externalcapacitors.Theoutputvoltageswingisalsoadjustable bytheapplicationofanexternalvoltagetotheVREFinput.The HI-8382hason-chipZenerdiodesinserieswithafusetoeach differentialoutputprotectingtheARINCbusfromanovervoltage failure.Theoutputseachhaveaseriesresistanceof37.5ohms. TheHI-8383isidenticaltotheHI-8382exceptthattheseries resistorsare13ohmsandtheovervoltageprotectioncircuitry hasbeeneliminated.
TheHI-8382andHI-8383areintendedforusewherelogic sig nalsmustbeconvertedtoARINC429levelssuchasauser ASICortheHI-8282ARINC429SerialTransmitter/Dual ReceiverortheHI-6010ARINC429Transmitter/Receiver.Holt productsarereadilyavailableforbothindustrialandmilitary applications.PleasecontacttheHoltSalesDepartmentfor additionalinformation,includingdatasheetsfortheHI-8282and HI-6010products.
N/C
DATA(A)
N/C N/C
C
A
N/C N/C
(SeePage4-46foradditionalpackagepinconfigurations)
FUNCTION
4321282726
5 6
HI-8382J
7 8
9 10 11
28-PIN
PLASTIC
PLCC
12131415161718
+
HI-8382
25 24 23 22 21 20 19
CLOCK N/C DATA(B) C
B
N/C N/C N/C
FEATURES
!
LowpowerCMOS
!
TTLandCMOScompatibleinputs
!
Programmableoutputvoltageswing
!
AdjustableARINCriseandfalltimes
!
Operatesatdataratesupto100Kbits
!
Overvoltageprotection
!
IndustrialandMilitarytemperatureranges
!
DSCCSMDpartnumber
ARINC429DIFFERENTIALLINEDRIVER
TRUTHTABLE
SYNCCLOCKDATA(A)DATA(B)AOUTBOUTCOMMENTS
XLXX0V0VNULL LXXX0V0VNULL HHLL0V0VNULL HHLH-V+VLOW HHHL+V-VHIGH HHHH0V0VNULL
HOLTINTEGRATEDCIRCUITS
1(DS8382Rev.A)01/01
REFREF
REFREF
FUNCTIONALDESCRIPTION
HI-8382,HI-8383
TheSYNCandCLOCKinputsestablishdatasynchronization utilizingtwoANDgates,oneforeachdatainput.Eachlogic input,includingthepowerenable()input,are
STROBE TTL/CMOScompatible.Besidesreducingchipcurrentdrain, STROBE
alsofloatseachoutput.Howevertheovervoltage
fusesanddiodesoftheHI-8382arenotswitchedout. Figure1illustratesatypicalARINC429busapplication.
ThreepowersuppliesarenecessarytooperatetheHI-8382; typically+15V,-15Vand+5V.Thechipalsoworkswith±12V supplies.The+5Vsupplycanalsoprovideareference voltagethatdeterminestheoutputv oltageswing.The differentialoutputvoltageswingwillequal2V.Ifavalueof Votherthan+5Visneeded,aseparate+5Vpowersupply
REF
isrequiredforpinV.
1
REF
WiththeDATA(A)inputatalogichighandDATA(B)inputata logiclow,Awillswitchtothe+VrailandBwill switchtothe-Vrail(ARINCHIGHstate).Withbothdata
OUTREFOUT
REF
inputsignalsatalogiclowstate,theoutputswillbothswitchto 0V(ARINCNULLstate).
Thedriveroutputimpedance,R,isnominally75ohms.
OUT
Theriseandfalltimesoftheoutputscanbecalibratedthrough theselectionoftwoexternalcapacitorvaluesthre connectedtotheCandCi nputpins.Typicalvaluesfor high-speedoperation(100KBPS)areC=C=75pFandfor low-speedoperation(12.5to14KBPS)C=C=500pF.
AB
AB
AB
ata
Thedrivercanbeexternallypowereddownbyapplyingalogic hightotheinputpin.Ifthisfeatureisnotbeingused,
STROBE
thepinshouldbetiedtoground. TheCandCpinsareinputstounitygainamplifiers.
AB
Thereforetheymustbeallowedtoswingto-5V.Provisionto switchcapacitorsmustbedonewithanalogswitchesthat allowvoltagesbelowtheirground.
+15V+5V
V
REF
V
1
DATA(A)
INPUTS TOARINCBUS
DATA(B)
SYNC
CLOCK
+V
-V
STROBE
GND
C
C
-15V
OUT
B
DATA(A)
CLOCK
SYNC
DATA(B)
STROBE
Figure1. ARINC429BUSAPPLICATION
+V
C
REF
LEVELSHIFTER
ANDSLOPE
CONTROL(A)
LEVELSHIFTER
ANDSLOPE
CONTROL(B)
V 1
CURRENT
REGULATOR
A
OUTPUT
DRIVER(A)
R/2OUT
R/2OUT
OUTPUT
DRIVER(B)
F A
F B
OVERVOLTAGE
CLAMPS
R L
C L
NotincludedonHI-8383
-V
CGND
B
B
OUT
Figure2. FUNCTIONALBLOCKDIAGRAM
HOLTINTEGRATEDCIRCUITS
2
HI-8382,HI-8383
SYMBOLFUNCTIONDESCRIPTION
VPOWERTHEREFERENCEVOLTAGEUSEDTODETERMINETHEOUTPUTVOLTAGESWING
REF
STROBE
SYNCINPUTSYNCHRONIZESDATAINPUTS
DATA(A)INPUTDATAINPUTTERMINALA
CINPUTCONNECTIONFORDATA(A)SLEW-RATECAPACITOR
A
AOUTPUTARINCOUTPUTTERMINALA
OUT
-VPOWER-12Vto-15V
GNDPOWER0.0V
+VPOWER+12Vto+15V
BOUTPUTARINCOUTPUTTERMINALB
OUT
CINPUTCONNECTIONFORDATA(B)SLEW-RATECAPACITOR
B
DATA(B)INPUTDATAINPUTTERMINALB
CLOCKINPUTSYNCHRONIZESDATAINPUTS
VPOWER+5V±5%
1
INPUTALOGICHIGHONTHISINPUTPLACESTHEDRIVERINPOWERDOWNMODE
AllVoltagesreferencedtoGND,TA=OperatingTemperatureRange(unlessotherwisespecified)
PARAMETERSYMBOLCONDITIONSOPERATINGRANGEMAXIMUMUNIT
DifferentialVoltageVVoltagebetween+Vand-Vterminals40V
DIF
SupplyVoltage+V+10.8to+16.5V
-V-10.8to-16.5V V+5±10%+7V
1
VoltageReferenceVForARINC429+5±5%6V
REF
ForApplicationsotherthanARINC0to66V
InputVoltageRangeVGND-0.3V
IN
>
V1+0.3V
< OutputShort-CircuitDurationSeeNote:1 OutputOvervoltageProtectionSeeNote:2 OperatingTemperatureRangeTHi-temp&Military-55to+125°C
A
Industrial-40to+85°C
StorageTemperatureRangeTCeramic&Plastic-65to+150°C
STG
LeadTemperatureSoldering,10seconds+275°C JunctionTemperatureT+175°C PowerDissipationP16-PinCeramic DIPSeeNote:31.725W
J
D
28-PinCeramicLCCSeeNote:31.120W 28-PinPlasticPLCCSeeNote:32.143W 32-PinCERQUADSeeNote:31.725W
ThermalResistance,Ø16-PinCeramicDIP86.5°C/W
JA
(Junction-to-Ambient)28-PinCeramicLCC133.7°C/W
28-PinPlasticPLCC70.0°C/W 32-PinCERQUAD86.5°C/W
Note1.HeatsinkingmayberequiredforOutputShortCircuitat+125°Candfor100KBPSat+125°C. Note2.ThefusesusedforOutputOvervoltageProtectionmaybeblownbythepresenceofavoltageateitheroutputthat isgreater
than±12.0VwithrespecttoGND.(HI-8382only)
Note3.Derateabove+25°C,11.5 mW/°Cfor16-PINDIPand32-PINCERQUAD,7.5mW/°Cfor28-PINLCC,14.2mW/°Cfor28-PINPLCC
NOTE:Stressesabovethoselistedunder"AbsoluteMaximumRatings"maycausepermanentdamagetothedevice.Thesea restressratings only.Functionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationalse ctionsofthespecifications isnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectdevicereliability.
HOLTINTEGRATEDCIRCUITS
3
HI-8382,HI-8383
+V=+15V,-V=-15V,V=V=+5.0V,T=OperatingTemperatureRange(unlessotherwisespecified).1REFA
PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS
SupplyCurrent+V(Operating)(+V)NoLoad(0-100KBPS)+11mA SupplyCurrent-V(Operating)(-V)NoLoad(0-100KBPS)-11mA SupplyCurrent(Operating)()NoLoad(0-100KBPS)500µA SupplyCurrent(Operating)()NoLoad(0-100KBPS)500µA
VIV
1CCOP1
VIV
REFCCOPREF
SupplyCurrent+V(PowerDown)(+V)STROBE=HIGH475uA SupplyCurrent-V(PowerDown)(-V)STROBE=HIGH-475uA SupplyCurrent+V(DuringShortCircuitTest)(+V)ShorttoGround(SeeNote:1)150mA SupplyCurrent-V(DuringShortCircuitTest)(-V)ShorttoGround(SeeNote:1)-150mA OutputShortCircuitCurrent(OutputHigh)ShorttoGround=0(SeeNote:2 )-80mA OutputShortCircuitCurrent(OutputLow)ShorttoGround=0(SeeNote:2)+80mA InputCurrent(InputHigh)1.0µA InputCurrent(InputLow)-1.0µA InputVoltageHigh2.0V InputVoltageLow0.5V OutputVoltageHigh(OutputtoGround)NoLoad(0-100KBPS)+V+VV
OutputVoltageLow(OutputtoGround)NoLoad(0-100KBPS)-V-VV OutputVoltageNullNoLoad(0-100KBPS)-250+250mV
InputCapacitance15pF
Note1.Nottested,butcharacterizedatinitialdevicedesignandaftermajorprocessand/ordesignchangewhichaff ectsthisparameter. Note2.Interchangeabilityofforceandsenseisacceptable.
I
CCOP
I
CCOP
I
CCPD
I
CCPD
I
SC
I
SC
IV
OHSCMIN
IV
OLSCMIN
I
IH
I
IL
V
IH
V
IL
V
OH
V
OL
V
NULL
C
INSeeNote1
REFREF
-.+.
2525
REFREF
-.+.
2525
+V=+15V,-V=-15V,V=V=+5.0V,T=OperatingTemperatureRange(unlessotherwisespecified).1REFA
PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS
RiseTime(,)==75pFSeeFigure3.1.02.0µs FallTime(,)==75pFSeeFigure3.1.02.0µs PropagtionDelayInputtoOutput==75pFSeeFigure3.3.0µs PropagtionDelayInputtoOutput==75pFSeeFigure3.3.0µs
DIFFERENTIAL
()ABOUT-OUT
NOTE:OUTPUTSUNLOADED
ABtCC
OUTOUTRAB
ABtCC
OUTOUTFAB
tCC tCC
t PHL
50%
50%
ADJUST
BY C A
-V REF
+V REF
50%
50%
t PLH
DATA(A)0V
DATA(B)0V
A OUT 0V
B OUT 0V
V REF
ADJUST
BY C A
-V REF
t R
OUTPUT0V
t F
PLHAB PHLAB
ADJUST
ADJUST
2V REF
BY C B
BY C B
-2V RE
HIGH
NULL
2.0V
0.5V
2.0V
0.5V
+4.75Vto+5.25V
-4.75Vto-5.25V +4.75Vto+5.25V
-4.75Vto-5.25V +9.5Vto+10.5V
LOW
-9.5Vto-10.5V
Figure3. SWITCHINGWAVEFORMS
HOLTINTEGRATEDCIRCUITS
4
HI-8382,HI-8383
HI-8382PACKAGETHERMALCHARACTERISTICS
7
2
PACKAGE STYLE
1
28 Lead PLCC
16 Lead Ceramic SB DIP
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed
High Speed
MAXIMUM ARINC LOAD
SUPPLY CURRENT (mA)
Ta = 25oC Ta = 85oC Ta=125oC Ta = 25oC Ta = 85oC Ta=125oC
3
17.6 17.2 17.0 48 107 142
4
25.4 24.5 24.2 56 110 150
17.9 17.4 17.1 41 103 145
25.8 24.8 24.4 47 112 147
JUNCTION TEMP, Tj (°C)
5, 6, 7
2
JUNCTION TEMP, Tj (°C)
PACKAGE STYLE
1
28 Lead PLCC
16 Lead Ceramic SB DIP
A OUT and B OUT Shorted to Ground
ARINC 429
DATA RATE
Low Speed
High Speed
Low Speed 62.1 56.2 53.0 90 145 180
SUPPLY CURRENT (mA)
Ta = 25oC Ta = 85oC Ta=125oC Ta = 25oC Ta = 85oC Ta=125oC
3
60.1 55.7 52.4 110 157 194
4
63.1 56.3 52.3 100 150 182
High Speed 64.0 56.2 52.2 86 144 176
Notes:
1.AlldatatakenondevicessolderedtoasinglelayercopperPCB(3"X4.5"X.062").
instillair
2.At100%dutycycle,15Vpowersupplies.For12Vpowersuppliesmultiplyalltabulatedvaluesby0.8.
3.LowSpeed:DataRate=12.5Kbps,Load:R=400Ohms,C=30nF.
4.HighSpeed:DataRate=100Kbps,Load:R=400Ohms,C=10nF.DatanotpresentedforC=30 asthisisconsideredunrealisticforhighspeedoperation.
5.SimilarresultswouldbeobtainedwithAshortedtoB.
OUTOUT
6.Forapplicationsrequiringsurvivalwithcontinuousshortcircuit,operationaboveTj=175°Cisnotrecommended .
7.Datawillvaryd ependingonairflowandthemethodofheatsinkingemployed.
HI-8383partnumbersidenticalexcepttheSMDversionisnotavailable.
NUMBER DESCRIPTION RANGE FLOW IN FINISH
HI-8382C 16 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C I NO GOLD HI-8382CT 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C T NO GOLD HI-8382CM-01 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C M YES SOLDER HI-8382CM-03* 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C DSCC YES SOLDER HI-8382J 28 PIN PLASTIC J -LEAD PLCC -40°C TO +85°C I NO SOLDER HI-8382JT 28 PIN PLASTIC J -LEAD PLCC -55°C TO +125°C T NO SOLDER HI-8382S 28 PIN CERAMIC LEADLESS CHIP CARRIER -40°C TO +85°C I NO GOLD HI-8382ST 28 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C T NO GOLD HI-8382SM-01 28 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C M YES SOLDER HI-8382U 32 PIN J-LEAD CERQUAD -40°C TO +85°C I NO SOLDER HI-8382UT 32 PIN J-LEAD CERQUAD -55°C TO +125°C T NO SOLDER
HOLTINTEGRATEDCIRCUITS
5
HI-8382,HI-8383
CLOCK
V
STROBE
SYNC
292827262524232221
30
V
1
31
HI-8382U
32
N/C
1
REF
2 3 4
N/C
32-PIN
CERQUAD
5678910111213
20
N/C
19
N/C
18
+V
17
GND
16
N/C
15
-V
14
N/C
HI-8382C
16-PIN
CERAMIC
DIP
1
VREF
STROBE
DATA(A)
2 3
SYNC
4 5
CA
6
AOUT
7
-V
8 9
GND +V
DATA(A)
16 15 14 13 12 11 10
4321282726
N/C
5
HI-8382S
6
N/C
7 8
N/C
9
C
A
10
N/C
11
N/C
12131415161718
V1 N/C CLOCK DATA(B) CB BOUT N/C
28-PIN
CERAMIC
LCC
25 24 23 22 21 20 19
CLOCK N/C DATA(B) C
B
N/C N/C N/C
HOLTINTEGRATEDCIRCUITS
6
16-PINCERAMICSIDE-BRAZEDDIP
HI-8382PACKAGEDIMENSIONS
inches(millimeters)
.125MIN
(3.175MIN )
PIN1
.200MAX
(5.080MAX)
.018±.002
(.457 ± .051)
.810MAX
(20.574MAX)
(2.540BSC)
.050 ± .005
(1.270 ± .127)
.035±.010
(.889 ± .254)
SEATING
.100BSC
.295 ± .010
(7.493 ± .254)
BASE
PLANE
PLANE
.300±.010
(7.620 ± .254)
PackageType:
.010 ± .002
(.254 ± .051)
16C
28-PINPLASTICPLCC
.045x45°
.490 ± .005
(12.446 ± .127)
SQ.
.173 ± .008
(4.394 ± .203)
PINNO.1
(10.414 ± .508)
.410 ± .020
PINNO.1IDENT
.453 ± .003
(11.506 ± .076)
SQ.
SEEDETAIL
A
.045x45°
.017 ± .004
(.432 ± .102)
.009
.011
DETAILA
PackageType:
.050 ± .005
(1.27 ± .127)
.031 ± .005
(.787 ± .127)
.015 ± .002
(.381 ± .051)
.020MIN
(.508 ΜΙΝ ) .025
R
.045
28J
HOLTINTEGRATEDCIRCUITS
7
HI-8382PACKAGEDIMENSIONS
28-PINCERAMICLEADLESSCHIPCARRIER
inches(millimeters)
.020INDEX
(.508INDEX)
PIN1
.040x45°3PLS
(1.016x45°3PLS)
.451 ± .009
(11.455 ± .229)
SQ.
.080 ± .020
(2.032 ± .508)
.050BSC
(1.270BSC)
.008R±.006
(.203R ± .152)
PackageType:
PIN1
28S
.050 ± .005
(1.270 ± .127)
.025 ± .003
(.635 ± .076)
32-PINJ-LEADCERQUAD
31
32
1 2
(14.935 ± .203)
(13.970 ± .229)
.040TYP.
(1.016)TYP.
.019 ± .003
(.483 ± .076)
.520 ± .012
(13.208 ± .305)
.588 ± .008
.550 ± .009
(1.270)TYP.
.050TYP.
.488 ± .008
(12.395 ± .203)
.083 ± .009
(2.108 ± .229)
.450 ± .008
(11.430 ± .203)
.190MAX.
(4.826)MAX.
PackageType:
.420 ± .012
(10.668 ± .305)
32U
HOLTINTEGRATEDCIRCUITS
8
Loading...