Datasheet HI-3188PST, HI-3188PSI, HI-3187PST, HI-3187PSI, HI-3186PST Datasheet (HOLT)

HI-3182,HI-3183,HI-3184,HI-3185

HI-3186,HI-3187,HI-3188

March2001

TheHI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187and
HI-3188businterfaceproductsaresilicongateCMOSdevices
designedasalinedriverinaccordancewiththeARINC429bus
specifications.InadditiontobeingfunctionalupgradesofHolt's
HI-8382&HI-8383products,theyarealsoalternatesourcesfor
theHS-3182(Intersil/Harris),theRM3182(Fairchild/Raytheon)
andavarietyofsimilarDEI/DDClinedriverproducts.

Inputsareprovidedforclockingandsynchronization.These
signalsareAND'dwiththeDATAinputstoenhancesystem
performanceandallowtheHI-318Xs eriesofproductstobe
usedinavarietyofapplications.Bothlogicandsynchronization
inputsfeaturebuilt-in2,000VminimumESDinputprotectionas
wellasTTLandCMOScompatibility.

ThedifferentialoutputsoftheHI-318Xseriesofproductsare
independentlyprogrammabletoeitherthehighspeedorlow
speedARINC429outputriseandfalltimespecificationsthrough
theuseoftwoexternalcapacitors.Theoutputvoltageswingis
alsoadjustablebytheapplicationofanexternalvoltagetothe
VREFinput.Productswith0,13or37.5ohmresistorsinseries
witheachARINCoutputareav ailable.Inaddition,the
HI-3184andHI-3187productsalsohavea
eachoutput.

fuseinserieswith

HI-3182,

PINCONFIGURATION (TopView)GENERALDESCRIPTION

14V

V1

REF

GND(SeeNote*)2

SYNC3

DATA(A)4

C5

A

A6

OUT

-V7

1

13CLOCK
12DATA(B)
11C

B

10B

OUT

9+V
8GND

HI-3184PS,HI-3185PS,HI-3186PS

&HI-3187PS

14-PINPLASTICSMALLOUTLINE(ESOIC) **

Notes:*Pin2maybeleftfloating

**ThermallyEnhancedSOICPackage

(SeePage5foradditionalpackagepinconfigurations)

FUNCTION

TheHI-318Xseriesoflinedriversareintendedforusewhere
logicsignalsmustbeconvertedtoARINC429levelssuchas
whenusinganASIC,theHI-8282ARINC429SerialTransmit­ter/DualReceiver,theHI-6010ARINC429Transmitter/Receiver
ortheHI-8783ARINCInterfaceDevice.Holtproductsare
readilyavailableforbothindustrialandmilitaryapplications.
PleasecontacttheHoltSalesDepartmentforadditional
information.

FEATURES

!

LowpowerCMOS

!

TTLandCMOScompatibleinputs

!

Programmableoutputvoltageswing

!

AdjustableARINCriseandfalltimes
Plastic14&16-pinthermallyenhancedSOIC

!

packagesavailable
Pin-for-PinalternativeforDEI/DDC/Intersil/Fairchild

!

applications

!

Operatesatdataratesupto100Kbits

!

Overvoltageprotection

!

IndustrialandMilitarytemperatureranges

+

ARINC429DIFFERENTIALLINEDRIVER

TRUTHTABLE

SYNCCLOCKDATA(A)DATA(B)AOUTBOUTCOMMENTS

XLXX0V0VNULL
LXXX0V0VNULL
HHLL0V0VNULL
HHLH-V+VLOW
HHHL+V-VHIGH
HHHH0V0VNULL

REFREF

REFREF

HOLTINTEGRATEDCIRCUITS

(DS3182Rev.B)03/01

1

HI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187,HI-3188

FUNCTIONALDESCRIPTION

TheSYNCandCLOCKinputsestablishdatasynchronization
utilizingtwoANDgates,oneforeachdatainput.Eachlogic
input,includingthepowerenable()input,are

STROBE

TTL/CMOScompatible.
Figure1illustratesatypicalARINC429busapplication.

ThreepowersuppliesarenecessarytooperatetheHI-3182;
typically+15V,-15Vand+5V.Thechipalsoworkswith±12V
supplies.The+5Vsupplycanalsoprovideareference
voltagethatdeterminestheoutputvoltageswing.The
differentialoutputvoltageswingwillequal2V.Ifavalueof
Votherthan+5Visneeded,aseparate+5Vpowersupply

REF

isrequ iredforpinV.

1

REF

WiththeDATA(A)inputatalogichighandDATA(B)inputata
logiclow,Awillswitchtothe+VrailandBwill
switchtothe-Vrail(ARINCHIGHstate).Withbothdata

OUTREFOUT

REF

inputsignalsatalogiclowstate,theoutputswillbothswitchto
0V(ARINCNULLstate).

Thedriveroutputimpedance,R,isnominally75,26or0

OUT

ohmsdependingontheoptionchosen.Theriseandfalltimes
oftheoutputscanbecalibratedthroughtheselectionoftwo
externalcapacitorvaluesthreconnectedtotheCandC

ata

AB

inputpins.Typicalvaluesforhigh-speedoperation
(100KBPS)areC=C=75pFandforlow-speedoperati on
(12.5to14KBPS)C=C=500pF.

AB

AB

TheARINCoutputscanbeputinatri-statemodebyapplying
alogichightotheinputpin.Ifthisfeatureisnot
beingused,thepinshouldbetiedtoground.The

STROBE

STROBE
functionisnotavailableinthe14&16-pinSOICpackage
configurationswherethepinisinternallyconnectedto
ground.

TheARINCoutputsoftheHI-3182,HI-3184andHI-3187are
protectedbyinternalfusescapableofsinkingbetween800­900mAforshortperiodsoftime(125s).

V

REF

V

1

DATA(A)

INPUTS TOARINCBUS

DATA(B)

SYNC

GND

C

C

CLOCK

STROBE

µ

+15V+5V

OUT

+V

-V

B

TheCandCpinsswingbetween+5Vandgroundallowing

AB

theswitchingofcapacitorvalueswithanexternalsingle­supplyanalogswitch.

+V

C

A

DATA(A)

CLOCK

SYNC

DATA(B)

STROBE

REF

LEVELSHIFTER

ANDSLOPE

CONTROL(A)

LEVELSHIFTER

ANDSLOPE

CONTROL(B)

V 1

CURRENT

REGULATOR

Figure1. ARINC429BUSAPPLICATION

Shortedon

HI-3186,HI-3187,HI-3188

OUTPUT

DRIVER(A)

OUTPUT

DRIVER(B)

Shortedon
HI-3183,HI-3186
HI-3187,HI-3188

24.5 Ω

24.5Ω

-15V

13 Ω

13 Ω

F A

F B

Shortedon
HI-3183,HI-3185
HI-3186,HI-3188

C L

R L

-V

CGND

B

Figure2. FUNCTIONALBLOCKDIAGRAM

HOLTINTEGRATEDCIRCUITS

2

B

OUT

HI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187,HI-3188

SYMBOLFUNCTIONDESCRIPTION

VPOWERReferencevoltageusedtodeterminetheoutputvoltageswing

REF

STROBE

SYNCINPUTSynchronizesdatainputs

DATA(A)INPUTDatainputterminalA

CINPUTConnectionforDATA(A)slew-ratecapacitor

A

AOUTPUTARINCoutputterminalA

OUT

-VPOWER-12Vto-15V

GNDPOWER0.0V

+VPOWER+12Vto+15V

BOUTPUTB

OUT

CINPUT

B

DATA(B)INPUTB

CLOCKINPUTSynchronizesdatainputs

VPOWER+5V±5%

1

INPUTAlogichightri-statestheARINCoutputs.Notavailableinthe14-pinSOICpackage(tiedtoGNDinternally).

ARINCoutputterminal
ConnectionforDATA(B)slew-ratecapacitor
Datainputterminal

AllVoltagesreferencedtoGND,TA=OperatingTemperatureRange(unlessotherwisespecified)

PARAMETERSYMBOLCONDITIONSOPERATINGRANGEMAXIMUMUNIT

DifferentialVoltageVVoltagebetween+Vand-Vterminals40V

DIF

SupplyVoltage+V+10.8to+16.5V

-V-10.8to-16.5V
V+5±10%+7V

1

VoltageReferenceVForARINC429+5±5%6V

REF

ForApplicationsotherthanARINC0to66V

InputVoltageRangeVGND-0.3V

IN

>

V1+0.3V

<
OutputShort-CircuitDurationSeeNote:1
OutputOvervoltageProtectionSeeNote:2
OperatingTemperatureRangeTHi-temp&Military-55to+125°C

A

Industrial-40to+85°C

StorageTemperatureRangeTCeramic&Plastic-65to+150°C

STG

LeadTemperatureSoldering,10seconds+275°C
JunctionTemperatureT+175°C

J

Note1.Heatsinkingmayberequired forOutputShortCircuitat+125°Candfor100KBPSat+125°C.
Note2.ThefusesusedforOutputOvervoltageProtectionmaybeblownbythepresenceofavoltageateitheroutputthat isgreater

than±12.0VwithrespecttoGND.(HI-3182,3184&3187only)

NOTE:Stressesabovethoselistedunder"AbsoluteMaximumRatings"maycausepermanentdamagetothedevice.Thesea restressratings
only.Functionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationalse ctionsofthespecifications
isnotimplied.Exposuretoabsolutemaximumratingconditionsforextendedperiodsmayaffectdevicereliability.

HOLTINTEGRATEDCIRCUITS

3

HI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187,HI-3188

+V=+15V,-V=-15V,V=V=+5.0V,T=OperatingTemperatureRange(unlessotherwisespecified).1REFA

PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS

SupplyCurrent+V(Operating)(+V)NoLoad(0-100KBPS)+16mA
SupplyCurrent-V(Operating)(-V)NoLoad(0-100KBPS)-16mA
SupplyCurrent(Operating)()NoLoad(0-100KBPS)500µA
SupplyCurrent(Operating)()NoLoad,REF=5V(0-100KBPS)-1.0mA

VIV

1CCOP1

VIVV

REFCCOPREF

SupplyCurrent+V(DuringShortCircuitTest)(+V)ShorttoGround(SeeNote:1)150mA
SupplyCurrent-V(DuringShortCircuitTest)(-V)ShorttoGround(SeeNote:1)-150mA
OutputShortCircuitCurrent(OutputHigh)ShorttoGround=0(SeeNote:2)-80mA
OutputShortCircuitCurrent(OutputLow)ShorttoGround=0(SeeNote:2)+80mA
InputCurrent (InputHigh)1.0µA
InputCurrent(InputLow)-1.0µA
InputVoltageHigh2.0V
InputVoltageLow0.5V
OutputVoltageHigh(OutputtoGround)NoLoad(0-100KBPS)+V+VV

OutputVoltageLow(OutputtoGround)NoLoad(0-100KBPS)-V-VV
OutputVoltageNullNoLoad(0-100KBPS)-250+250mV

InputCapacitance15pF

Note1.Nottested,butcharacterizedatinitialdevicedesignandaftermajorprocessand/ordesignchangewhichaff ectsthisparameter.
Note2.Interchangeabilityofforceandsenseisacceptable.

I

CCOP

I

CCOP

I

SC

I

SC

IV

OHSCMIN

IV

OLSCMIN

I

IH

I

IL

V

IH

V

IL

V

OH

V

OL

V

NULL

C

INSeeNote1

REFREF

-.+.

2525

REFREF

-.+.

2525

+V=+15V,-V=-15V,V=V=+5.0V,T=OperatingTemperatureRange(unlessotherwisespecified).1REFA

PARAMETERSYMBOLCONDITIONMINTYPMAXUNITS

RiseTime(,)==75pFSeeFigure3.1.02.0µs
FallTime(,)==75pFSeeFigure3.1.02.0µs
PropagtionDelayInputtoOutput==75pFSeeFigure3.3.0µs
PropagtionDelayInputtoOutput==75pFSeeFigure3.3.0µs

DATA(A)0V

DATA(B)0V

DIFFERENTIAL

OUTPUT0V

()ABOUT-OUT

NOTE:OUTPUTSUNLOADED

ABtCC

OUTOUTRAB

ABtCC

OUTOUTFAB

tCC

PLHAB

tCC

PHLAB

50%

50%

ADJUST

BY C A

50%

t PLH

-V REF

+V REF

ADJUST

2V REF

BY C B

A OUT 0V

B OUT 0V

V REF

ADJUST

BY C A

t PHL

-V REF

t R

50%

t F

ADJUST

BY C B

-2V REF

HIGH

NULL

2.0V

0.5V

2.0V

0.5V

+4.75Vto+5.25V

-4.75Vto-5.25V
+4.75Vto+5.25V

-4.75Vto-5.25V
+9.5Vto+10.5V

LOW

-9.5Vto-10.5V

Figure3. SWITCHINGWAVEFORMS

HOLTINTEGRATEDCIRCUITS

4

HI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187,HI-3188

ADDITIONALPINCONFIGURATIONS (Seepage1for14-PinSmallOutlineSOIC)

HI-3182PS,HI-3183PS,HI-3188PS

V-1

REF

GND(SeeNote*)-2

SYNC-3

DATA(A)-4

C-5

A

A-6

OUT

-V-7

GND-8

16-PIN

PLASTIC

SMALL

OUTLINE

(ESOIC)**

16-V

1

15-N/C
14-CLOCK
13-DATA(B)
12-C

B

11-B

OUT

10-N/C

9-+V

N/C

DATA(A)

N/C
N/C

N/C
N/C

5
6
7
8
9

C

A

10
11

4321282726

HI-3182PJ
HI-3183PJ

28-PIN

PLASTIC

PLCC

12131415161718

25
24
23
22
21
20
19

CLOCK
N/C
DATA(B)
C

B

N/C
N/C
N/C

Notes:

*Pin2maybeleftfloating

**ThermallyEnhancedSOICpackage

292827262524232221

CLOCK

STROBE

V

SYNC

N/C

REF

N/C

30

V

1

31

HI-3182CR

32

HI-3183CR

1
2
3

CERQUAD

4

5678910111213

32-PIN

20

N/C

19

N/C

18

+V

17

GND

16

N/C

15

-V

14

N/C

HI-3182CD
HI-3183CD

16-PIN

CERAMIC

DIP

1

VREF

STROBE

DATA(A)

2
3

SYNC

4
5

CA

6

AOUT

7

-V

8 9

GND +V

N/C

DATA(A)

N/C
N/C

N/C
N/C

16
15
14
13
12
11
10

4321282726

5

HI-3182CL

6

HI-3183CL

7
8
9

C

A

CERAMIC

10
11

12131415161718

V1
N/C
CLOCK
DATA(B)
CB
BOUT
N/C

28-PIN

LCC

25
24
23
22
21
20
19

CLOCK
N/C
DATA(B)
C

B

N/C
N/C
N/C

HOLTINTEGRATEDCIRCUITS

5

HI-3182,HI-3183,HI-3184,HI-3185,HI-3186,HI-3187,HI-3188

ORDERINGINFORMATION

PART PACKAGE TEMPERATURE OUTPUT SERIES BURN LEAD

NUMBER DESCRIPTION RANGE RESISTANCE FUSE FLOW IN FINISH

HI-3182CDI 16 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C 37.5 YES I NO GOLD
HI-3182CDT 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C 37.5 YES T NO GOLD
HI-3182CDM 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C 37.5 YES M YES SOLDER

HI-3182CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C 37.5 YES I NO GOLD
HI-3182CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 37.5 YES T NO GOLD
HI-3182CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 37.5 YES M YES SOLDER

HI-3182CRI 32 PIN J-LEAD CERQUAD -40°C TO +85°C 37.5 YES I NO SOLDER
HI-3182CRT 32 PIN J-LEAD CERQUAD -55°C TO +125°C 37.5 YES T NO SOLDER

HI-3182PJI 28 PIN PLASTIC J -LEAD PLCC -40°C TO +85°C 37.5 YES I NO SOLDER
HI-3182PJT 28 PIN PLASTIC J -LEAD PLCC -55°C TO +125°C 37.5 YES T NO SOLDER

HI-3182PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -40°C TO +85°C 37.5 YES I NO SOLDER
HI-3182PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -55°C TO +125°C 37.5 YES T NO SOLDER

HI-3183CDI 16 PIN CERAMIC SIDE BRAZED DIP -40°C TO +85°C 13 NO I NO GOLD
HI-3183CDT 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C 13 NO T NO GOLD
HI-3183CDM 16 PIN CERAMIC SIDE BRAZED DIP -55°C TO +125°C 13 NO M YES SOLDER

HI-3183CLI 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -40°C TO +85°C 13 NO I NO GOLD
HI-3183CLT 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 13 NO T NO GOLD
HI-3183CLM 28 PIN CERAMIC LEADLESS CHIP CARRIER (LCC) -55°C TO +125°C 13 NO M YES SOLDER

HI-3183CRI 32 PIN J-LEAD CERQUAD -40°C TO +85°C 13 NO I NO SOLDER
HI-3183CRT 32 PIN J-LEAD CERQUAD -55°C TO +125°C 13 NO T NO SOLDER

HI-3183PJI 28 PIN PLASTIC J -LEAD PLCC -40°C TO +85°C 13 NO I NO SOLDER
HI-3183PJT 28 PIN PLASTIC J -LEAD PLCC -55°C TO +125°C 13 NO T NO SOLDER

HI-3183PSI 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -40°C TO +85°C 13 NO I NO SOLDER
HI-3183PST 16 PIN PLASTIC SMALL OUTLINE - WB (ESOIC) -55°C TO +125°C 13 NO T NO SOLDER

HI-3184PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C 37.5 YES I NO SOLDER
HI-3184PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 37.5 YES T NO SOLDER

HI-3185PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C 37.5 NO I NO SOLDER
HI-3185PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 37.5 NO T NO SOLDER

HI-3186PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C 0 NO I NO SOLDER
HI-3186PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 0 NO T NO SOLDER

HI-3187PSI 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C 0 YES I NO SOLDER
HI-3187PST 14 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 0 YES T NO SOLDER

HI-3188PSI 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -40°C TO +85°C 0 NO I NO SOLDER
HI-3188PST 16 PIN PLASTIC SMALL OUTLINE - NB (ESOIC) -55°C TO +125°C 0 NO T NO SOLDER

Legend:

ESOIC-ThermallyEnhancedSmallOutlinePackage(SOICw/built-inheatsink)

NB-NarrowBody

WB-WideBody

HOLTINTEGRATEDCIRCUITS

6

HI-318XPACKAGEDIMENSIONS

14-PINPLASTICSMALLOUTLINE(ESOIC)-NB

(NarrowBody,ThermallyEnhanced)

inches(millimeters)

PackageType:

PackageType:

14H

14HNE

.00865±.00115

(.220±.029)

DetailA

0 ° to8 °

° °

.033±.017

(.838±.432)

.236 ± .008

(6.00 ± .20)

.3406±.0039
(8.651±.099)

TopView

.0165±.0035

(.419±..089)

.050 ± .010

(1.270 ± .254)

.1535±.0035
(3.899±.089)

16-PINPLASTICSMALLOUTLINE(ESOIC)-NB

(NarrowBody,ThermallyEnhanced)

.110TYP.

(2.794)TYP.

.061±.007

(1.549±.178)

DetailA

PackageType:

PackageType:

.280TYP.

(7.112)TYP.

Bottom

View

.0069±.0029

(.175±.074)

16HNE

Heatsinkstud

onbottomof

package

.236 ± .008

.236 ± .008
(6.00 ± .20)

(6.00 ± .20)

.3898±.0039
(9.901±.099)

.050 ± .010

.050 ± .010

(1.270 ± .254)

(1.270 ± .254)

TopView

.0165±.0035

.0165±.0035

(.419±..089)

(.419±..089)

.00865±.00115

(.220±.029)

.1535±.0035
(3.899±.089)

.110TYP.

(2.794)TYP.

DetailA

0 ° to8 °

° °

.033±.017

(.838±.432)

HOLTINTEGRATEDCIRCUITS

7

.061±.007

(1.549±.178)

DetailA

.280TYP.

(7.112)TYP.

Bottom

View

.0069±.0029

(.175±.074)

Heatsinkstud

onbottomof

package

HI-318XPACKAGEDIMENSIONS

16-PINPLASTICSMALLOUTLINE(ESOIC)-WB

(WideBody,ThermallyEnhanced)

inches(millimeters)

PackageType: 16HWE

.405±.008

(10.287±.203)

.4065±.0125

(10.325±.318)

.050±.010

(1.270±.254)

TopView

.0165±.0035

(.4191±.0889)

.295±.004

(7.493±.102)

16-PINCERAMICSIDE-BRAZEDDIP

.0105±.0015

(.2667±.0381)

DetailA

0°to8°

.190±.010

(4.826±.254)

.033±.017

(.838±.432)

DetailA

.240±.010

(6.096±.254)

Bottom

View

.090±.010

(2.286±.254)

.0025±.0015

(.0635±.0381)

Heatsinkstud

onbottomof

package

.125MIN

(3.175MIN )

PIN1

.200MAX

(5.080MAX)

.018±.002

(.457 ± .051)

.810MAX

(20.574MAX)

(2.540BSC)

.050 ± .005

(1.270 ± .127)

.035±.010

(.889 ± .254)

SEATING

.100BSC

.295 ± .010

(7.493 ± .254)

BASE

PLANE

PLANE

.300±.010

(7.620 ± .254)

PackageType:

.010 ± .002

(.254 ± .051)

16C

HOLTINTEGRATEDCIRCUITS

8

28-PINPLASTICPLCC

HI-318XPACKAGEDIMENSIONS

inches(millimeters)

.045x45°

.490 ± .005

(12.446 ± .127)

SQ.

.173 ± .008

(4.394 ± .203)

PINNO.1

(10.414 ± .508)

.410 ± .020

PINNO.1IDENT

.453 ± .003

(11.506 ± .076)

SQ.

SEEDETAIL

A

.045x45°

.017 ± .004

(.432 ± .102)

.009

.011

DETAILA

PackageType:

.050 ± .005

(1.27 ± .127)

.031 ± .005

(.787 ± .127)

.015 ± .002
(.381 ± .051)

.020MIN

(.508 ΜΙΝ )
.025

R

.045

28J

28-PINCERAMICLEADLESSCHIPCARRIER

.020INDEX

(.508INDEX)

PIN1

.451 ± .009

(11.455 ± .229)

SQ.

.040x45°3PLS

(1.016x45°3PLS)

.080 ± .020

(2.032 ± .508)

.050BSC

(1.270BSC)

.008R±.006

(.203R ± .152)

PackageType:

PIN1

28S

.050 ± .005

(1.270 ± .127)

.025 ± .003

(.635 ± .076)

HOLTINTEGRATEDCIRCUITS

9

32-PINJ-LEADCERQUAD

HI-318XPACKAGEDIMENSIONS

inches(millimeters)

.040TYP.

(1.016)TYP.

31
32

1
2

(14.935 ± .203)

(13.970 ± .229)

.019 ± .003

(.483 ± .076)

.520 ± .012

(13.208 ± .305)

.588 ± .008

.550 ± .009

(1.270)TYP.

.050TYP.

.488 ± .008

(12.395 ± .203)

.083 ± .009

(2.108 ± .229)

.450 ± .008

(11.430 ± .203)

.190MAX.

(4.826)MAX.

PackageType:

.420 ± .012

(10.668 ± .305)

32U

HOLTINTEGRATEDCIRCUITS

10