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HI-SINCERITY
MICROELECTRONICS CORP.
HI1538
PNP EPITAXIAL PLANAR TRANSIST OR
Description
High-definition CRT display video output, wide-band amp.
Features
High fT: fT=400MHz
•
High breakdown voltage: VCEO=120Vmin
•
Small reverse transfer capacitance and excellent HF response
•
Spec. No. : HE9020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 1/3
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature....................................................................................................... -55 ~ +150 °C
Junction Temperature ................................................................................................................ +150 °C
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)................................................................................................ 1.3 W
Total Power Dissipation (Tc=25°C)................................................................................................. 20 W
Maximum Voltages and Currents
•
BVCBO Collector to Base Voltage ............................................................................................... -120 V
BVCEO Collector to Emitter Voltage ............................................................................................ -120 V
BVEBO Emitter to Base Voltage ...................................................................................................... -3 V
IC Collector Current.................................................................................................................. -200 mA
IC Peak Collector Current......................................................................................................... -400 mA
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -120 - - V IC=-10uA, IE=0
BVCEO -120 - - V IC=-1mA, IB=0
BVEBO -3 - - V IE=-100uA, IC=0
ICBO - - -100 nA VCB=-80V
IEBO - - -100 nA VEB=-2V,
*VCE(sat) - - -1 V IC=-30mA, IB=-3mA
*VBE(sat) - - -1 V IC=-30mA, IB=-3mA
*hFE1 60 160 320 VCE=-10V, IC=-10mA
*hFE2 40 - - VCE=-10V, IC=-100mA
fT 400 - - MHz VCE=-10V, IC=-50mA
Cob 2.8 - - pF VCB=-30V, f=1MHz
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE1
Rank D E F
Range 60-120 100-200 160-320
HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 2/3
1000
Current Gain & Collector Current
100
hFE
10
1 10 100 1000
10000
Saturation Volt age & Coll ector Current
VCE=10V
Collector Current (mA)
10000
Saturation Volt age & Coll ector Cu rrent
1000
CE(sat)
V
100
Saturation Voltage (mV)
10
10 100 1000
100
Capacitance & Reverse-Biased Volt age
Collector Current (mA)
@ IC=10I
B
1000
BE(sat)
V
Saturation Voltage (mV)
100
1 10 100 1000
Collector Current (mA)
Cut off Fr equency & I
1000
fT
100
Cutoff Frequency (MHz)
@ IC=10I
B
C
10
Capacitance (Pf)
Cob
1
1 10 100
1
0.1
Collector Current (A)
Reverse Biased Volt a ge ( V)
Safe Operating Area
PT=1ms
PT=100ms
PT=1s
10
1 10 100 1000
Collector Current (mA)
0.01
1 10 100 1000
Forwar d Voltage (V)
HSMC Product Specification
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HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9020-B
Issued Date : 1996.04.15
Revised Date : 2000.11.01
Page No. : 3/3
A
C
B
HSMC Logo
D
Part Number
Date Code
Product Series
Rank
Ink Mark
F G
Style : Pin 1.Base 2.Collector 3.Emitter
3
I
Marking :
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : I
DIM
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated May. 24,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringem ent of patents, or application assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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