Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9034
Issued Date : 1999.03.17
Revised Date : 2002.05.08
Page No. : 1/3
HI13003
NPN EPITAXIAL PLANAR TRANSISTOR
Description
These devices are designed for high-voltage, high-speed power
switching inductive circuits where fall time is critical. They are
particularly suited for 115 and 220V switchmode appl i ca ti ons such as
Switching Regulators, Inverters, Motor Controls, Solenoid/Relay
drivers and Deflection circuits.
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature...................................................................................... 150 °C Maximum
TO-251
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 40 W
Total Power Dissipation (Ta=25°C).................................................................................... 1.3 W
• Maximum Voltages and Currents (Ta=25°C)
BVCEV Collector to Emitter Voltage.................................................................................. 700 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 9 V
IC Collector Current ........................................................................................................... 1.5 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCEO 400 - - V IC=10mA
BVCEV 700 - - V IC=1mA, VBE(OFF)= 1.5 V
IEBO - - 1 mA VEB=9V
ICEV - - 1 mA VCE=700V, VBE(OFF)=1.5V
*VCE(sat)1 - - 0.5 V IC=0.5A, IB=0.1A
*VCE(sat)2 - - 1 V IC=1A, IB=0.25A
*VCE(sat)3 - - 3 V IC=1.5A, IB=0.5A
*VBE(sat)1 - - 1 V IC=0.5A, IB=0.1A
*VBE(sat)2 - - 1.2 V IC=1A, IB=0.25A
*hFE1 8 - 40 IC=0.5A, VCE=2V
*hFE2 5 - 25 VCE=2V, IC=1A
Cob - 21 - pF VCB=10V, IE=0, f=1MHz
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HI13003 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9034
Issued Date : 1999.03.17
Revised Date : 2002.05.08
Page No. : 2/3
100
Cur rent G ain & C o llector Current
75oC125oC
25oC
10
hFE
hFE @ VCE=2V
1
0.1 1 10 100 1000 10000
10000
1000
Collector Current-IC (mA)
Sat urati on Voltage & Collector Curren t
CE(sat)
V
@ IC=4I
B
1000
CE(sat)
V
100
Saturation Voltage (mV)
10
1 10 100 1000 10000
B
@ IC=3I
125oC
25oC
Collector Current- IC (mA)
Sat uration Voltage & Collect or Cur rent
10000
Sat urati on Voltage & Collector Current
1000
CE(sat)
V
@ IC=5I
B
75oC
75oC
100
125oC
Saturat ion Volta ge ( m V)
10
1 10 100 1000 10000
Collector Current- IC (mA)
25oC
Sat ura tion Voltage & C ollector C urrent
10000
1000
Saturation Voltage (mV)
BE(sat)
V
@ IC=4I
25oC
125oC
B
75oC
75oC
125oC
100
Saturation Vpltage (mV)
10
1 10 100 1000 10000
Collector Current-IC (mA)
25oC
Sat uration Voltage & Collector Current
10000
Satur ation Voltage ( m V)
1000
BE(sat)
V
@ IC=5I
25oC
125oC
B
75oC
100
1 10 100 1000 10000
Collector Current-IC (mA)
100
1 10 100 1000 10000
Collector Current- IC (mA)
HI13003 HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9034
Issued Date : 1999.03.17
Revised Date : 2002.05.08
Page No. : 3/3
A
C
B
HI
03
D
Date Code
310
Control Code
F G
Marking:
Style: Pin 1.Base 2.Collector 3.Emitter
3
I
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code: I
DIM
*: Typical
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI13003 HSMC Product Specification
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