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HI-SINCERITY
MICROELECTRONICS CORP.
HI10387
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HI10387 is designed for general-purpose amplifier and lowspeed switching applications.
Spec. No. : HE9028
Issued Date : 1994.01.25
Revised Date : 2001.12.19
Page No. : 1/3
Absolute Maximum Ratings (Ta=25°C)
• Maximum Temperatures
Stor age Temperature.............................................................................................. -55~+150 °C
Junction Temperature....................................................................................... 150°C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C)..................................................................................... 65 W
Total Power Dissipation (Ta=25°C)....................................................................................... 2 W
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage......................................................................................... 80 V
VCEO Collector to Emitter Voltage...................................................................................... 80 V
VEBO Emitter to Base Voltage.............................................................................................. 5 V
IC Collector Current ............................................................................................................ 10 A
TO-251
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCEO 80 - - V IC=200mA
ICBO - - 100 uA VCB=160V
IEBO - - 2 mA VEB=5V
ICEO - - 1 mA VCE=80V
ICEV - - 300 uA VCE=80V, VBE(Off)=1.5V
VCE(sat)1 - - 2 V IC=5A, IB=10mA
VCE(sat)2 - - 3 V IC=10A, IB=100mA
VCE(sat)3 - - 1.5 V IC=5A, IB=2.5mA
VBE(sat) - - 2 V IC=5A, IB=5mA
VBE(on)1 - - 2.8 V VCE=3V, IC=5A
VBE(on)2 - - 4.5 V VCE=3V, IC=10A
VFEC - - 3 V IC=5A
hFE1 2 - 20 K IC=5A, VCE=3V
hFE2 100 - - VCE=3V, IC=10A
Classification Of VCE(sat)1
Rank KA KB KC NORMAL
VCE(sat)1 <1.5, BVCEO>130V <1.1V <1.3V <2V
HI10387 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE9028
Issued Date : 1994.01.25
Revised Date : 2001.12.19
Page No. : 2/3
10000
1000
hFE @ VCE=3V
100
hFE
10
1
1 10 100 1000 10000
Collector Current (m A)
On Voltage & Collector C urr ent
10000
Current Gain & Collector Current
10000
1000
Saturation Voltage (mV)
100
Sat uration Voltage & Collector Cur rent
BE(sat)
V
@ IC=100I
100 1000 10000
Collector Current (m A)
B
CE(sat)
V
@ IC=100I
Switching Time & Collector Current
10
VCC=30 V, IC=250IB1=-250I
B2
Tstg
B
1000
On Voltage (mV)
100
10 100 1000 10000
BE(on)
V
@ VCE=3V
Collect o r Current ( mA)
Capacitance & Rev erse-Biased Voltage
1000
100
Capacitan c e ( pF)
Cob
1
Tf
Switching T imes ( us)
0.1
110
Ton
Collector Current ( A)
Safe Operating Area
10000
1000
100
Collector Current (m A)
PT=100ms
PT=1s
10
PT=1ms
10
0.1 1 10 100
Rev e r se-Biased Voltage ( V)
1
1 10 100
Forwar d Voltage (V)
HI10387 HSMC Product Specification
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HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-251 Dimension
Spec. No. : HE9028
Issued Date : 1994.01.25
Revised Date : 2001.12.19
Page No. : 3/3
A
C
B
HSMC Logo
D
Part Number
Date Code
Product Series
Rank
Ink Mark
F G
Marking:
Style: Pin 1.Base 2.Collector 3.Emitter
3
I
E
K
2
H
1
J
3-Lead TO-251 Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code: I
DIM
*: Typical
Min. Max. Min. Max.
A 0.0177 0.0217 0.45 0.55 G 0.2559 - 6.50 B 0.0354 0.0591 0.90 1.50 H - *0.1811 - *4.60
C 0.0177 0.0236 0.45 0.60 I - 0.0354 - 0.90
D 0.0866 0.0945 2.20 2.40 J - 0.0315 - 0.80
E 0.2520 0.2677 6.40 6.80 K 0.2047 0.2165 5.20 5.50
F 0.2677 0.2835 6.80 7.20
Notes: 1.Dimension and tolerance based on our Spec. dated May. 24,1995.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HI10387 HSMC Product Specification
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