Datasheet HGTG20N100D2 Datasheet (Intersil Corporation)

Page 1
HGTG20N100D2
May 1995
Features
• 34A, 1000V
• Typical Fall Time 520ns
• High Input Impedance
• Low Conduction Loss
Description
The HGTG20N100D2 is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. The device has the high input impedance of a MOS­FET and the low on-state conduction loss of a bipolar transistor. The much lower on-state voltage drop varies only moderately between +25
IGBTs are ideal for many high voltage switching applications operating at frequencies where low conduction losses are essen­tial, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
PART NUMBER PACKAGE BRAND
HGTG20N100D2 TO-247 G20N100D2
o
C and +150oC.
PACKAGING AVAILABILITY
20A, 1000V N-Channel IGBT
Package
JEDEC STYLE TO-247
COLLECTOR
(BOTTOM SIDE
METAL)
Terminal Diagram
N-CHANNEL ENHANCEMENT MODE
G
EMITTER
C
E
COLLECTOR
GATE
Absolute Maximum Ratings T
Collector-Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
Collector-Gate Voltage RGE = 1M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
Collector Current Continuous at TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
at TC = +90oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate-Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate-Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Switching Safe Operating Area at TJ = +150oC . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA 100A at 0.8 BV
Power Dissipation Total at TC = +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Power Dissipation Derating TC > +25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.20 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . .TJ, T
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
(0.125 inch from case for 5 seconds)
Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . t
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. V
CE(PEAK)
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,567,641 4,587,713 4,598,461 4,605,948 4,618,872 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
= 600V, TC = +125oC, RGE = 25.
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS:
= +25oC, Unless Otherwise Specified
C
at VGE = 10V. . . . . . . . . . . . . . . . . . . . . . . . . . t
CES
CGR
C25 C90
CM
GES
GEM
STG
SC SC
HGTG20N100D2 UNITS
1000 V 1000 V
34 A 20 A
100 A
±20 V ±30 V
CES
D
L
150 W
-55 to +150 260
3 µs
15 µs
-
o
C
o
C
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
3-93
File Number 2826.3
Page 2
Specifications HGTG20N100D2
Electrical Specifications T
= +25oC, Unless Otherwise Specified
C
PARAMETERS SYMBOL TEST CONDITIONS
Collector-Emitter Breakdown Voltage BV Collector-Emitter Leakage Voltage I
Collector-Emitter Saturation Voltage V
Gate-Emitter Threshold Voltage V
Gate-Emitter Leakage Current I Gate-Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t Current Rise Time t Current Turn-Off Delay Time t Current Fall Time t Turn-Off Energy (Note 1) W Current Turn-On Delay Time t Current Rise Time t Current Turn-Off t Current Fall Time t Turn-Off Energy (Note 1) W Thermal Resistance R
NOTE: 1. T urn-Off Energy Loss (W
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and
OFF
ending at the point where the collector current equals zero (ICE = 0A) The HGTG20N100D2 was tested per JEDEC standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total T urn-Of f Energy Loss.
CES
CES
CE(SAT)
GE(TH)
GES
GEP
G(ON)
D(ON)I
RI
D(OFF)I
FI OFF
D(ON)I
RI
D(OFF)I
FI OFF θJC
LIMITS
UNITSMIN TYP MAX
IC = 250mA, VGE = 0V 1000 - - V VCE = BV
CES
VCE = 0.8 BV IC = I
,
C90
VGE = 15V
IC = I
,
C90
VGE = 10V
IC = 500µA, VCE = V
GE
TC = +25oC - - 250 µA
CESTC
= +125oC - - 1.0 mA TC = +25oC - 3.1 3.8 V TC = +125oC - 2.9 3.6 V TC = +25oC - 3.3 4.1 V TC = +125oC - 3.2 4.0 V TC= +25oC 3.0 4.5 6.0 V
VGE = ±20V - - ±250 nA IC = I
, VCE = 0.5 BV
C90
IC = I
,
C90
VCE = 0.5 BV
L = 50µH, IC = I
VGE = 15V - 120 160 nC
CES
VGE = 20V - 163 212 nC
, RG = 25,
C90
VGE = 15V, TJ = +125oC, VCE = 0.8 BV
CES
CES
- 7.1 - V
- 100 - ns
- 150 - ns
- 500 650 ns
- 520 680 ns
- 3.7 - mJ
L = 50µH, IC = I VGE = 10V, TJ = +125oC, VCE = 0.8 BV
C90
CES
, RG = 25,
- 100 - ns
- 150 - ns
- 410 530 ns
- 520 680 ns
- 3.7 - mJ
- 0.7 0.83
o
C/W
Typical Performance Curves
40
PULSE DURATION = 250µs DUTY CYCLE < 0.5%, V
30
20
10
, COLLECTOR-EMITTER CURRENT (A)
CE
I
0
0246810
, GATE-TO-EMITTER VOLTAGE (V)
V
GE
T
= +150oC
C
CE
= 10V
TC = +25oC
TC = -40oC
80
70
60
50
40
30
VGE = 6.0V
20
10
, COLLECTOR-EMITTER CURRENT (A)
CE
I
0
0246810
FIGURE 1. TRANSFER CHARACTERISTICS (TYPICAL) FIGURE 2. SATURATION CHARACTERISTICS (TYPICAL)
3-94
PULSE DURATION = 250µs DUTY CYCLE < 0.5%, TC = +25oC
V
= 15V
GE
VCE, COLLECTOR-TO-EMITTER VOLTAGE (V)
VGE = 8.5V
VGE = 8.0V
VGE = 7.5V
VGE = 7.0V
VGE = 6.5V
Page 3
HGTG20N100D2
Typical Performance Curves
(Continued)
2.5
35
30
V
= 15V
GE
2.0
= 800V, TJ = +150oC,
V
CE
= 15V, RG = 25,L = 50µH
V
GE
25
VGE = 10V
1.5
20
15
10
, DC COLLECTOR CURRENT (A)
5
CE
I
0
+25 +50 +75 +100 +125 +150
T
, CASE TEMPERATURE (oC)
C
1.0
, FALL TIME (µs)
FI
t
0.5
0.0 11040
ICE, COLLECTOR-EMITTER CURRENT (A)
FIGURE 3. DC COLLECTOR CURRENT vs CASE TEMPERATURE FIGURE 4. FALL TIME vs COLLECTOR-EMITTER CURRENT
6000
5000
4000
C
ISS
3000
C
2000
C, CAPACITANCE (pF)
OSS
1000
C
RSS
0
0 5 10 15 20 25
, COLLECTOR-TO-EMITTER VOLTAGE (V)
V
CE
f = 1MHz
1000
750
500
250
, COLLECTOR-EMITTER VOLTAGE (V)
CE
V
0
VCC = BV
CES
0.75 BV
0.50 BV
0.25 BV
GATE­EMITTER VOLTAGE
CES CES
CES
COLLECTOR-EMITTER VOLTAGE
I
G(REF)
20
I
G(ACT)
TIME (µs)
I
0.75 BV
0.50 BV
0.25 BV
RL = 29
G(REF)
V
GE
VCC = BV
CES CES
CES
= 1.8mA = 10V
CES
I
G(REF)
80
I
G(ACT)
10
5
0
FIGURE 5. CAPACITANCE vs COLLECT OR-EMITTER VOLTAGE FIGURE 6. NORMALIZED SWITCHING WAVEFORMS AT CON-
STANT GATE CURRENT (REFER TO APPLICATION NOTES AN7254 AND AN7260)
, GATE-EMITTER VOLTAGE (V)
GE
V
5
TJ = +150oC
4
VGE = 10V
10
T R
3
VGE = 15V
1.0
2
, SATURATION VOLTAGE (V)
1
CE(ON)
V
0
11040
, TURN-OFF SWITCHING LOSS (mJ)
OFF
W
0.1 11040
ICE, COLLECTOR-EMITTER CURRENT (A)
FIGURE 7. SATURATION VOLTAGE vs COLLECTOR-EMITTER
FIGURE 8. TURN-OFF SWITCHING LOSS vs COLLECTOR-
CURRENT
3-95
= +150oC, VGE = 15V,
J
= 25Ω, L = 50µH
G
VCE = 800V, VGE = 10V, 15V
= 400V, VGE = 10V, 15V
V
CE
, COLLECTOR-EMITTER CURRENT (A)
I
CE
EMITTER CURRENT
Page 4
HGTG20N100D2
Typical Performance Curves
1.2 = 15V, RG = 50
V
GE
1.0
(Continued)
T
= +150oC
J
V
= 800V
CE
L = 50µH
VGE = 10V, RG = 50
0.8
VGE = 15V, RG = 25
0.6
VGE = 10V, RG = 25
0.4
, TURN-OFF DELAY (µs)
D(OFF)I
t
0.2
0.0
11040
ICE, COLLECTOR-EMITTER CURRENT (A)
FIGURE 9. TURN-OFF DELAY vs COLLECTOR-EMITTER
CURRENT
40
VGE = 10V
10
TJ = +150oC
100
VCE = 400V
f
= 0.05/t
MAX1
f
MAX2
PC = DUTY FACTOR = 50% R
θJC
10
, OPERATING FREQUENCY (kHz)
OP
f
TJ = +150oC, TC = +75oC, VGE = 15V R
G
D(OFF)I
= (PD - PC)/W
= 0.7oC/W
= 25, L = 50µH
OFF
V
= 800V
CE
1
1 10 100
I
, COLLECTOR-EMITTER CURRENT (A)
NOTE:
CE
PD = ALLOWABLE DISSIPATION PC = CONDUCTION DISSIPATION
FIGURE 10. OPERATING FREQUENCY vs COLLECTOR-
EMITTER CURRENT AND VOLTAGE
Test Circuit
TJ = +25oC
, COLLECTOR-EMITTER CURRENT (A)
CE
I
1
12 3 4 5
V
, SATURATION VOLTAGE (V)
CE(ON)
FIGURE 11. COLLECTOR-EMITTER SATURATION VOLTAGE
L = 50µH
1/R
= 1/R
G
+ 1/R
GEN
R
GEN
= 50
GE
V
CC
800V
+
-
20V
0V
RGE = 50
FIGURE 12. INDUCTIVE SWITCHING TEST CIRCUIT
3-96
Page 5
Operating Frequency Information
HGTG20N100D2
Operating frequency information for a typical device (Figure
10) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (I
) plots are possible using the information shown
CE
for a typical unit in Figures 7, 8 and 9. The operating frequency plot (Figure 10) of a typical device shows f f
whichever is smaller at each point. The information is
MAX2
MAX1
or
based on measurements of a typical device and is bounded by the maximum rated junction temperature.
f
is defined by f
MAX1
MAX1
= 0.05/t
D(OFF)I
. t
D(OFF)I
deadtime (the denominator) has been arbitrarily held to 10% of the on­state time for a 50% duty factor. Other definitions are possible. t
is defined as the time between the 90% point of the
D(OFF)I
trailing edge of the input pulse and the point where the collector current falls to 90% of its maximum value. Device
turn-off delay can establish an additional frequency limiting condition for an application other than T
JMAX
. t
D(OFF)I
is important when controlling output ripple under a lightly loaded condition.
f
is defined by f
MAX2
dissipation (P
) is defined by PD = (T
D
= (PD - PC)/W
MAX2
JMAX
. The allowable
OFF
- TC)/R
θJC
. The sum of device switching and conduction losses must not exceed P A 50% duty factor was used (Figure 10) and the conduction losses (P
) are approximated by PC = (VCE • ICE)/2. W
C
OFF
is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (I
The switching power loss (Figure 10) is defined as f W
. Turn-on switching losses are not included because they
OFF
CE
= 0A).
MAX2
can be greatly influenced by external circuit conditions and com­ponents.
.
D
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