Datasheet HFBR-2119T, HFBR-1119T Datasheet (HP)

Fiber Optic Transmitter
and Receiver Data Links
for 266 MBd

Technical Data

HFBR-1119T Transmitter
HFBR-2119T Receiver

Features

• Full Compliance with the
Optical Performance
Requirements of the Fibre
Channel Physical Layer

• Other Versions Available for:

- FDDI

- ATM

• Compact 16-pin DIP Package
with Plastic ST* Connector

• Wave Solder and Aqueous
Wash Process Compatible
Package

• Manufactured in an ISO
9001 Certified Facility

Applications

• Fibre Channel Interfaces

• Multimode Fiber Optic Links
up to 266 MBd at 1500 m

• General Purpose, Point-to­Point Data Communications

• Replaces DLT/R1040-ST2
Model Transmitters and
Receivers

Description

The HFBR-1119/-2119 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication

applications specified at 266 MBd
for Fibre Channel applications or
for general-purpose fiber optic
data link transmission.

These modules are designed for
50 or 62.5 µm core multimode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our high­performance, reliable, long­wavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.

Transmitter

The transmitter utilizes a 1300 nm
surface-emitting InGaAsP LED,
packaged in an optical subassem­bly. The LED is dc-coupled to a
custom IC which converts
differential-input, PECL logic
signals, ECL-referenced (shifted)
to a +5 V power supply, into an
analog LED drive current.

Receiver

The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance
preamplifier IC. The PIN­preamplifier combination is ac-

coupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.

Package

The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

200

5965-3483E (8/96)

DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL

DETECT OUT

DIFFERENTIAL
DATA IN
V

BB

RECEIVER

QUANTIZER

IC

ELECTRICAL
SUBASSEMBLIES

TRANSMITTER

DRIVER IC

PREAMP IC

PIN PHOTODIODE

OPTICAL
SUBASSEMBLIES

LED

SIMPLEX ST
RECEPTACLE

The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from

®

other vendors.

The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.

TOP VIEW

Figure 1. Transmitter and Receiver Block Diagram.

8.31

41 MAX.

5.05

5.0

7.01

2.45

19.72

THREADS
3/8 – 32 UNEF-2A

HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE

12.19
MAX.

0.9

The electrical subassemblies con­sist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.

9.8 MAX.

3

NOTES:

1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.

2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.

3. UNITS = mm

Figure 2. Package Outline Drawing.

12

17.78

(7 x 2.54)

8 x 7.62

HOUSING PINS 0.38 x 0.5 mm
NOTE 1

PCB PINS
DIA. 0.46 mm
NOTE 2

201

OPTICAL PORT

NC

GND

V
V

GND
DATA
DATA

NC

Figure 3. Pinout Drawing.

9NC

8

10 NO PIN

7

11 GND

CC
CC

TRANSMITTER

6

12 GND

5

13 GND

4

14 GND

3

15 V

2

16 NC

1

BB

NC

NO PIN

GND
GND
GND

SD
SD

NO PIN

OPTICAL PORT

9NC

8

10 GND

7

11 V

6

CC

12 V

5

CC

13 V

4

CC

14 DATA

3

15 DATA

2

16 NC

1

RECEIVER

8

7
6

5

62.5/125 µm

4
3
2

50/125 µm

1

OPTICAL POWER BUDGET – dB

0

Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.

0.5

021.5
FIBER OPTIC CABLE LENGTH – km

1

Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high

The following information is
provided to answer some of the
most common questions about the
use of these parts.

immunity to external EMI fields.

Transmitter and Receiver

The outer housing, including the
ST* port, is molded of filled, non­conductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your Hewlett­Packard Sales Representative.

Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcom­ing metal-port modules.

Application Information

The Applications Engineering
group of the Optical Communi­cation Division is available to assist
you with the technical understand­ing and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Hewlett-Packard
sales representative.

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

Optical Power Budget
versus Link Length

The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.

Figure 4 illustrates the predicted
OPB associated with the trans­mitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125 µm and 50/125 µm
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.

Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging character­istics than normally associated with
these technologies in the industry.
The industry convention is 1.5 dB
aging for 1300 nm LEDs; however,
HP 1300 nm LEDs will experience
less than 1 dB of aging over
normal commercial equipment
mission-life periods. Contact your
Hewlett-Packard sales represen­tative for additional details.

Figure 4 was generated with a
Hewlett-Packard fiber-optic link
model containing the current
industry conventions for fiber
cable specifications and Fibre
Channel optical parameters. These
parameters are reflected in the
guaranteed performance of the
transmitter and receiver specifica­tions in this data sheet. This same
model has been used extensively in
the ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the optical
performance requirements for
various fiber-optic interface
standards. The cable parameters
used come from the ISO/IEC JTC1/

202

SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom­munications Cabling Standard per
SP-2840.

Transmitter and Receiver Signaling Rate Range and BER Performance

For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).

The specifications in this data
sheet have all been measured using
the standard Fibre Channel symbol
rate of 266 MBd.

The data link modules can be used
for other applications at signaling
rates different than specified in this
data sheet. Depending on the
actual signaling rate, there may be
some differences in optical power
budget. This is primarily caused by
a change in receiver sensitivity.

These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the receiver
input optical power level.

Data Link Jitter Performance

The Hewlett-Packard 1300 nm data
link modules are designed to
operate per the system jitter
allocations stated in FC-PH Annex
A.4.3 and A.4.4.

The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed, without
violating the worst-case output
optical jitter requirements.

-2

1 x 10

-3

1 x 10

-4

1 x 10

-5

1 x 10

-6

1 x 10

-7

1 x 10

-8

BIT ERROR RATIO

1 x 10

-9

1 x 10

-10

1 x 10

-11

1 x 10

-12

1 x 10

-6 20

RELATIVE INPUT OPTICAL POWER – dB

CONDITIONS:

1. 266 MBd

2. PRBS 2
= 25 °C

3. T

A

4. V

CC

5. INPUT OPTICAL RISE/FALL TIMES =

1.0/1.9 ns

Figure 5. HFBR-1119T/2119T Bit­Error-Ratio vs. Relative Receiver
Input Optical Power.

CENTER OF SYMBOL

-4

7

-1

= 5 Vdc

-2

The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed without violating the
worst-case output electrical jitter
allowed.

The jitter specifications stated in
the following transmitter and
receiver specification tables are
derived from the values in FC-PH
Annex A.4.3 and A.4.4. They
represent the worst-case jitter
contribution that the transmitter
and receiver are allowed to make
to the overall system jitter without
violating the allowed allocation. In
practice, the typical jitter contribu­tion of the Hewlett-Packard data
link modules is well below the
maximum allowed amounts.

Recommended Handling Precautions

It is advised that normal static pre­cautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1119/

-2119 series meets MIL-STD-883C
Method 3015.4 Class 2.

Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper current­limiting impedance.

Solder and Wash Process Compatibility

The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.

These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.

Shipping Container

The data link modules are
packaged in a shipping container
designed to protect it from
mechanical and ESD damage
during shipment or storage.

Board Layout–Interface Circuit and Layout Guidelines

It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these data link modules.
Figure 6 provides a good example
of a power supply filter circuit that
works well with these parts. Also,
suggested signal terminations for
the Data, Data-bar, Signal Detect
and Signal Detect-bar lines are
shown. Use of a multilayer,
ground-plane printed circuit board
will provide good high-frequency
circuit performance with a low
inductance ground return path. See
additional recommendations noted
in the interface schematic shown in
Figure 6.

203

Tx

Rx

CC
CC
CC

D 3
D

NC 1

*

6

0.1

C1

0.1

C6

R10

130

5
4

2

L1

1

C7
10
(OPTIONAL)

R9

82

R11

82

R12

130

TERMINATE D, D, SD, SD AT

INPUTS OF FOLLOW-ON DEVICES

C3

0.1C410

R8

R5

R7

82

BB

130

82

) TO GROUND WITHOUT

*

9 NC
10
11 GND
12 GND
13 GND
14 SD
15 SD
16

NO
PIN

NO
PIN

NC 8

GND 7

V
V
V

+5 Vdc

GND

DATA
DATA

A

R3

82

C5

0.1

L2

1

C2

0.1

R4

R2

130

82

TERMINATE D, D

AT Tx INPUTS

130

*

9 NC
10 GND
11 V
12 V
13 GND
14 D
15 D

R1

16 NC

NC 8

NO
PIN

GND 6

CC

GND 5

CC

GND 4
GND 3

V

NC 1

BB

*

7

2

TOP VIEWS

NOTES:

1. RESISTANCE IS IN OHMS. CAPACITANCE IS IN MICROFARADS. INDUCTANCE IS IN MICROHENRIES.

2. TERMINATE TRANSMITTER INPUT DATA AND DATA-BAR AT THE TRANSMITTER INPUT PINS. TERMINATE THE RECEIVER OUTPUT DATA, DATA-BAR, AND SIGNAL DETECT­BAR AT THE FOLLOW-ON DEVICE INPUT PINS. FOR LOWER POWER DISSIPATION IN THE SIGNAL DETECT TERMINATION CIRCUITRY WITH SMALL COMPROMISE TO THE
SIGNAL QUALITY, EACH SIGNAL DETECT OUTPUT CAN BE LOADED WITH 510 OHMS TO GROUND INSTEAD OF THE TWO RESISTOR, SPLIT-LOAD PECL TERMINATION
SHOWN IN THIS SCHEMATIC.

3. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF SAME LENGTH WITH EQUAL TERMINATION IMPEDANCE.

4. SIGNAL TRACES SHOULD BE 50 OHMS MICROSTRIP OR STRIPLINE TRANSMISSION LINES. USE MULTILAYER, GROUND-PLANE PRINTED CIRCUIT BOARD FOR BEST HIGH­FREQUENCY PERFORMANCE.

5. USE HIGH-FREQUENCY, MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS. RECOMMEND USE OF SURFACE-MOUNT COIL
INDUCTORS AND CAPACITORS. IN LOW NOISE POWER SUPPLY SYSTEMS, FERRITE BEAD INDUCTORS CAN BE SUBSTITUTED FOR COIL INDUCTORS. LOCATE POWER
SUPPLY FILTER COMPONENTS CLOSE TO THEIR RESPECTIVE POWER SUPPLY PINS. C7 IS AN OPTIONAL BYPASS CAPACITOR FOR IMPROVED, LOW-FREQUENCY NOISE
POWER SUPPLY FILTER PERFORMANCE.

6. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND.

7. CAUTION: DO NOT DIRECTLY CONNECT THE FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA-BAR, SIGNAL DETECT, SIGNAL DETECT-BAR, V
PROPER CURRENT LIMITING IMPEDANCE.

8. (*) OPTIONAL METAL ST OPTICAL PORT TRANSMITTER AND RECEIVER MODULES WILL HAVE PINS 8 AND 9 ELECTRICALLY CONNECTED TO THE METAL PORT ONLY AND
NOT CONNECTED TO THE INTERNAL SIGNAL GROUND.

SD

130

A

DATA
DATA

R6

SD

Figure 6. Recommended Interface Circuitry and Power Supply Filter Circuits.

204

Board Layout–Hole Pattern

The Hewlett-Packard transmitter
and receiver hole pattern is
compatible with other data link
modules from other vendors. The
drawing shown in Figure 7 can be
used as a guide in the mechanical
layout of your circuit board.

17.78
.700

(16X)

0.8 ± 0.1

ø

.032 ± .004

Ø 0.000

–A–

MA

(7X)

7.62
.300

Figure 6. Recommended Board Layout Hole Pattern.

TOP VIEW

2.54
.100

UNITS = mm/INCH

205

Regulatory Compliance

∆λc – TRANSMITTER OUTPUT OPTICAL

SPECTRAL WIDTH (FWHM) – nm

λc – TRANSMITTER OUTPUT OPTICAL

CENTER WAVELENGTH – nm

140

100

1300

220

1320

60

180

1280 13801340

80

120

160

200

1360

TRANSMITTER
OUTPUT OPTICAL
RISE TIMES – ns

t

r

= 1.8 ns

t

r

= 1.9 ns

t

r

= 2.0 ns

t

r

= 2.1 ns

t

r

= 2.2 ns

HFBR-1119T TYPICAL TRANSMITTER TEST
RESULTS OF λc, ∆λ AND t

r

ARE CORRELATED
AND COMPLY WITH THE ALLOWED SPECTRAL
WIDTH AS A FUNCTION OF CENTER WAVELENGTH
FOR VARIOUS RISE AND FALL TIMES.

These data link modules are
intended to enable commercial
system designers to develop
equipment that complies with the
various international regulations
governing certification of Infor­mation Technology Equipment.
Additional information is available
from your Hewlett-Packard sales
representative.

All HFBR-1119T LED transmitters
are classified as IEC-825-1
Accessible Emission Limit (AEL)
Class 1 based upon the current
proposed draft scheduled to go
into effect on January 1, 1997. AEL
Class 1 LED devices are consid­ered eye safe. See Application Note
1094, LED Device Classifications

with Respect to AEL Values as
Defined in the IEC 825-1
Standard and the European
EN60825-1 Directive.

The material used for the housing
in the HFBR-1119/-2119 series is
Ultem 2100 (GE). Ultem 2100 is
recognized for a UL flammability
rating of 94V-0 (UL File Number
E121562) and the CSA (Canadian
Standards Association) equivalent
(File Number LS88480).

Figure 8. Typical Transmitter Output Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center Wavelength and Rise/Fall Times.

4

3

2

1

0

RELATIVE INPUT OPTICAL POWER – dB

CONDITIONS:

1. T

2. V

3. INPUT OPTICAL RISE/FALL TIMES = 1.0/1.9 ns

4. INPUT OPTICAL POWER IS NORMALIZED
TO CENTER OF DATA SYMBOL

5. NOTES 11 AND 12 APPLY

-15-0.5

-1.5 1.50.5
EYE SAMPLING TIME POSITION – ns

= 25 °C

A

= 5 Vdc

CC

0

1

Figure 9. HFBR-2119T Receiver
Relative Input Optical Power vs. Eye
Sampling Time Position.

206

HFBR-1119T Transmitter Pin-Out Table

Pin Symbol Functional Description Reference

1 NC No internal connect, used for mechanical strength only
2VBBVBB Bias output
3 GND Ground Note 3
4 GND Ground Note 3
5 GND Ground Note 3
6 GND Ground Note 3
7 OMIT No pin
8 NC No internal connect, used for mechanical strength only Note 5

9 NC No internal connect, used for mechanical strength only Note 5
10 GND Ground Note 3
11 V
12 V

CC
CC

Common supply voltage Note 1

Common supply voltage Note 1
13 GND Ground Note 3
14 DATA Data input Note 4
15 DATA Inverted Data input Note 4
16 NC No internal connect, used for mechanical strength only

HFBR-2119T Receiver Pin-Out Table

Pin Symbol Functional Description Reference

1 NC No internal connect, used for mechanical strength only
2 DATA Inverted Data input Note 4
3 DATA Data input Note 4
4VCCCommon supply voltage Note 1
5VCCCommon supply voltage Note 1
6VCCCommon supply voltage Note 1
7 GND Ground Note 3
8 NC No internal connect, used for mechanical strength only Note 5

9 NC No internal connect, used for mechanical strength only Note 5
10 OMIT No pin
11 GND Ground Note 3
12 GND Ground Note 3
13 GND Ground Note 3
14 SD Signal Detect Note 2, 4
15 SD Inverted Signal Detect Note 2, 4
16 OMIT No pin

Notes:

1. Voltages on VCC must be from the same power supply (they are connected together internally).

2. Signal Detect is a logic signal that indicates the presence or absence of an input optical signal. A logic-high, VOH, on Signal Detect
indicates presence of an input optical signal. A logic-low, VOL, on Signal Detect indicates an absence of input optical signal.

3. All GNDs are connected together internally and to the internal shield.

4. DATA, DATA, SD, SD are open-emitter output circuits.

5. On metal-port modules, these pins are redefined as “Port Connection.”

207

Specifications–Absolute Maximum Ratings

Parameter Symbol Min. Typ. Max. Unit Reference

Storage Temperature T
Lead Soldering Temperature T
Lead Soldering Time t

SOLD

SOLD

Supply Voltage V
Data Input Voltage V
Differential Input Voltage V
Output Current I

S

CC

I

D

O

-40 100 °C

-0.5 7.0 V

-0.5 V

Recommended Operating Conditions

Parameter Symbol Min. Typ. Max. Unit Reference

Ambient Operating Temperature T
Supply Voltage V

A

CC

Data Input Voltage–Low VIL - V
Data Input Voltage–High VIH - V
Data and Signal Detect Output Load R

L

CC

CC

070°C

4.5 5.5 V

-1.810 -1.475 V

-1.165 -0.880 V

HFBR-1119T Transmitter Electrical Characteristics

(TA = 0°C to 70°C, VCC 4.5 V to 5.5 V)

Parameter Symbol Min. Typ. Max. Unit Reference

Supply Current I
Power Dissipation P
Threshold Voltage VBB - V
Data Input Current–Low I
Data Input Current–High I

CC

DISS

IL

IH

CC

-1.42 -1.3 -1.24 V Note 21

-350 0 µA

260 °C

10 sec.

CC

V

1.4 V Note 1
50 mA Note 2

50 Ω Note 3

165 185 mA Note 4

0.86 1.1 W Note 16

14 350 µA

HFBR-2119T Receiver Electrical Characteristics

(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)

Parameter Symbol Min. Typ. Max. Unit Reference

Supply Current I
Power Dissipation P
Data Output Voltage–Low VOL - V
Data Output Voltage–High VOH - V
Data Output Rise Time t
Data Output Fall Time t
Signal Detect Output VOL - V

Voltage–Low (De-asserted)
Signal Detect Output VOH - V

Voltage–High (Asserted)
Signal Detect Output Rise Time t
Signal Detect Output Fall Time t
Signal Detect Assert Time (off to on) t
Sighal Detect De-assert Time (on to off) t

208

CC

DISS

r
f

r
f

SDA

SDD

-1.840 -1.620 V Note 17

CC

-1.045 -0.880 V Note 17

CC

0.35 2.2 ns Note 18

0.35 2.2 ns Note 18

-1.840 -1.620 V Note 17

CC

-1.045 -0.880 V Note 17

CC

0.35 2.2 ns Note 18

0.35 2.2 ns Note 18

0 55 100 µs Note 19
0 110 350 µs Note 20

100 165 mA Note 15

0.3 0.5 W Note 16

HFBR-1119T Transmitter Optical Characteristics

(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)

Parameter Symbol Min. Typ. Max. Unit Reference

Output Optical Power PO, BOL -19 -14 dBm Note 5

62.5/125 µm, NA = 0.275 Fiber PO, EOL -20 -14 avg.
Output Optical Power PO, BOL -22.5 -14 dBm Note 5

50/125 µm, NA = 0.20 Fiber avg.
Optical Extinction Ratio 0.03 % dB Note 6

-35

Center Wavelength λ

C

Spectral Width–FWHM ∆λ 137 nm Note 7

Optical Rise Time t

Optical Fall Time t

Deterministic Jitter Contributed by DJ

r

f

C

the Transmitter 0.30 ns p-p
Random Jitter Contributed by the RJ

C

Transmitter 0.11 ns p-p

1280 1308 1380 nm Note 7

Figure 8

Figure 8

0.6 2.0 ns Note 8
Figure 8

0.6 2.2 ns Note 8
Figure 8

0.08 ns rms Note 9

0.03 ns p-p Note 10

HFBR-2119T Receiver Optical Characteristics

(TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V)

Parameter Symbol Min. Typ. Max Unit Reference

Input Optical Power PIN Min. (W) -26 dBm Note 11
Minimum at Window Edge avg. Figure 9

Input Optical Power PIN Min. (C) -28 dBm Note 12
Minimum at Eye Center avg. Figure 9

Input Optical Power Maximum PIN Max. -14 dBm Note 11

avg.

Operating Wavelength λ 1270 1380 nm
Signal Detect–Asserted P

Signal Detect–De-asserted P

Signal Detect–Hysteresis PA-P
Deterministic Jitter Contributed DJ

A

D

D

C

by the Receiver 0.90 ns p-p
Random Jitter Contributed by RJ

C

the Receiver 0.97 ns p-p

PD+1.5 dB -27 dBm Note 13, 19

avg.

-45 dBm Note 14, 20
avg.

1.5 2.4 dB

0.24 ns rms Note 9, 11

0.26 ns rms Note 10, 11

209

Notes:

1. This is the maximum voltage that can
be applied across the Differential
Transmitter Data Inputs to prevent
damage to the input ESD protection
circuit.

2. When component testing these
products, do not short the receiver
Data or Signal Detect outputs directly
to ground to avoid damage to the
part.

3. The outputs are terminated with 50 Ω
connected to VCC - 2 V.

4. The power supply current needed to
operate the transmitter is provided to
differential ECL circuitry. This
circuitry maintains a nearly constant
current flow from the power supply.
Constant current operation helps to
prevent unwanted electrical noise
from being generated and conducted
or emitted to neighboring circuitry.

5. These optical power values are
measured as follows:

• The Beginning of Life (BOL) to the

End of Life (EOL) optical power
degradation is typically 1.5 dB per
the industry convention for long
wavelength LEDs. The actual
degradation observed in Hewlett­Packard’s 1300 nm LED products is
< 1dB, as specified in this data
sheet.

• Over the specified operating

voltage and temperature ranges.

• With 25 MBd (12.5 MHz square-

wave), input signal.

• At the end of one meter of noted

optical fiber with cladding modes

removed.
The average power value can be
converted to a peak power value by
adding 3 dB. Higher output optical
power transmitters are available on
special request.

6. The Extinction Ratio is a measure of
the modulation depth of the optical
signal. The data “0” output optical
power is compared to the data “1”
peak output optical power and
expressed as a percentage. With the
transmitter driven by a 12.5 MHz
square-wave signal, the average
optical power is measured. The data
“1” peak power is then calculated by
adding 3 dB to the measured average
optical power. The data “0” output
optical power is found by measuring
the optical power when the transmit­ter is driven by a logic “0” input. The
extinction ratio is the ratio of the
optical power at the “0” level
compared to the optical power at the

“1” level expressed as a percentage or
in decibels.

7. This parameter complies with the
requirements for the tradeoffs
between center wave length, spectral
width, and rise/fall times shown in
Figure 8.

8. The optical rise and fall times are
measured from 10% to 90% when the
transmitter is driven by a 25 MBd
(12.5 MHz square-wave) input signal.
This parameter complies with the
requirements for the tradeoffs
between center wavelength, spectral
width, and rise/fall times shown in
Figure 8.

9. Deterministic Jitter is defined as the
combination of Duty Cycle Distortion
and Data Dependent Jitter. Deter­ministic Jitter is measured with a test
pattern consisting of repeating K28.5
(00111110101100000101) data
bytes and evaluated per the method in
FC-PH Annex A.4.3.

10. Random Jitter is specified with a
sequence of K28.7 (square wave of
alternating 5 ones and 5 zeros) data
bytes and, for the receiver, evaluated
at a Bit-Error-Ratio (BER) of 1 x 10
per the method in FC-PH Annex
A.4.4.

11. This specification is intended to
indicate the performance of the
receiver when Input Optical Power
signal characteristics are present per
the following definitions. The Input
Optical Power dynamic range from
the minimum level (with a window
time-width) to the maximum level is
the range over which the receiver is
guaranteed to provide output data
with a Bit-Error-Ratio (BER) better
than or equal to 1 x 10

-12

.

• At the Beginning of Life (BOL).

• Over the specified operation

temperature and voltage ranges.

• Input symbol pattern is a 266 MBd,

27- 1 pseudo-random bit stream
data pattern.

• Receiver data window time-width is

± 0.94 ns or greater and centered
at mid-symbol. This data window
time width is calculated to simulate
the effect of worst-case input jitter
per FC-PH Annex J and clock
recovery sampling position in order
to insure good operation with the
various FC-0 receiver circuits.

• The maximum total jitter added by

the receiver and the maximum total
jitter presented to the clock
recovery circuit comply with the
maximum limits listed in Annex J,

but the allocations of the Rx added
jitter between deterministic jitter
and random jitter are different than
in Annex J.

12. All conditions of Note 11 apply
except that the measurement is made
at the center of the symbol with no
window time-width.

13. This value is measured during the
transition from low to high levels of
input optical power.

14. This value is measured during the
transition from high to low levels of
input optical power.

15. These values are measured with the
outputs terminated into 50 Ω con­nected to VCC - 2 V and an input
optical power level of -14 dBm
average.

16. The power dissipation value is the
power dissipated in the transmitter or
the receiver itself. Power dissipation
is calculated as the sum of the
products of supply voltage and supply
current, minus the sum of the
products of the output voltages and
currents.

17. These values are measured with

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respect to VCC with the output
terminated into 50 Ω connected to
VCC - 2 V.

18. The output rise and fall times are
measured between 20% and 80%
levels with the output connected to
VCC - 2 V through 50 Ω.

19. The Signal Detect output shall be
asserted, logic-high (VOH), within
100 µs after a step increase of the
Input Optical Power.

20. Signal Detect output shall be de­asserted, logic-low (VOL), within
350 µs after a step decrease in the
Input Optical Power.

21. This value is measured with an output
load RL = 10 kΩ.

210