Datasheet HFA3424 Datasheet (Intersil Corporation)

HFA3424

Data Sheet January 1997 File Number

2.4GHz - 2.5GHz Low Noise Amplifier

™

The Intersil 2.4GHz PRISM™ chip set is
a highly integrated five-chip solution for
RF modems employing Direct
Sequence Spread Spectrum (DSSS)
signaling. The HF A3424 2.4GHz -

2.5GHz low noise amplifier is an optional chip that can be
added to the five chips in the PRISM™ chip set. The
HF A3424 offers increased sensitivity for systems targeting

802.11 specifications. (See Figure 1, the Typical Application
Diagram.)

The Intersil HFA3424 PRISM™ is a high performance low
noise amplifier in a low cost SOIC 8 lead surface mount
plastic package. The HFA3424 employs a fully monolithic
design which eliminates the need for external tuning
networks. It can be biased using 3V or 5V supplies and has
an option for biasing at higher currents for increased
dynamic range.

The HFA3424 is ideally suited for use where low noise
figure, high gain, high dynamic range and low power
consumption required. Typical applications include receiver
front ends in the Wireless Local Area Network (WLAN) and
wireless data collection markets in the 2.4GHz Industrial,
Scientific and Medical (ISM) band, as well as standard gain
blocks, buffer amps, driver amps and IF amps in both fixed
and portable systems.

4131.2

Features

• Low Noise Figure . . . . . . . . . . . . . . . . . . . . . . . . . . 1.90dB

• High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14dB

• Low Power Consumption . . . . . . . . . . . . . . 3V to 5V, 5mA

• High Dynamic Range

• DC Decoupled RF Input and Output

• No External RF Tuning Elements Necessary

• Low Cost SOIC 8 Lead Plastic Package

Applications

• Systems Targeting IEEE 802.11 Standard

• TDD Quadrature-Modulated Communication
Systems

• Wireless Local Area Networks

• PCMCIA Wireless Transceivers

• ISM Systems

• TDMA Packet Protocol Radios

• PCS/Wireless PBX

• Wireless Local Loop

Ordering Information

TEMP.

PART NUMBER

HFA3424IB -40 to 85 8 Ld SOIC M8.15
HFA3424IB96 -40 to 85 Tape and Reel

RANGE (oC) PACKAGE

PKG.

NO.

Pinout

GND

V

BIAS

RF IN

GND

1
2
3
4

HFA3424

(SOIC)

TOP VIEW

2-7

8
7
6
5

Functional Block Diagram

V

DD

RF OUT

GND
V

DD

RF OUT
GND

EXTENDED

BIAS

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

http://www.intersil.com or 407-727-9207

PRISM® is a registered trademark of Intersil Corporation. PRISM logo is a trademark of Intersil Corporation.

LNA 1

RF IN

| Copyright © Intersil Corporation 1999

Typical Application Diagram

HFA3424

HFA3724

(FILE# 4067)

HF A3424 (NOTE)

(FILE# 4131)

HF A3624

UP/DOWN

CONVERTER

(FILE# 4066)

RFPA

HF A3925

VCO

VCO

(FILE# 4132)

DUAL SYNTHESIZER

HFA3524

(FILE# 4062)

FIGURE 1. TYPICAL TRANSCEIVER AMPLIFIER APPLICATIONS CIRCUIT USING THE HFA3424

NOTE: Required for systems targeting 802.11 specifications.

For additional information on the PRISM™ chip set, call
[phone]toaccessIntersil’AnswerFAX system. When
prompted, key in the four-digit document number (File #) of
the datasheets you wish to receive.

÷2

0o/90

QUAD IF MODULATOR

The four-digit file numbers are shown in Typical Application
Diagram, and correspond to the appropriate circuit.

TUNE/SELECT

I

M

o

U
X

Q

HSP3824

(FILE# 4064)

RXI

RXQ

RSSI

M
U
X

A/D

DE-

SPREAD

A/D

CCA

A/D

TXI

SPREAD

TXQ

DSSS BASEBAND PROCESSOR

PRISM™ CHIP SET FILE #4063

DPSK

DEMOD

802.11

MAC-PHY

INTERFACE

DPSK

MOD.

DATA TO MACCTRL

2-8

O

S

G

(

)

HFA3424

Absolute Maximum Ratings Thermal Information

Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10V

DC

Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17dBm

Supply Current (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA

Operating Conditions

Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

1. Only if Pin 2 is used to increase current.

2. θJA is measured with the component mounted on an evaluation PC board in free air.

Thermal Resistance (Typical, Note 2) θJA (oC/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC

(SOIC - Lead Tips Only)

Electrical Specifications T

=25oC, Z0=50Ω,VDD= +5V, PIN= -30dBm, f = 2.45GHz, V

A

= Open Circuit

BIAS

Unless Otherwise Specified

PARAMETER MIN TYP MAX UNITS

LNA Input Frequency Range 2.4 - 2.5 GHz
Gain 12 14 16 dB
Noise Figure - 1.90 2.30 dB
Input VSWR - 1.5:1 ­Output VSWR - 1.5:1 ­Input Return Loss - -14.0 - dB
Output Return Loss - -14.0 - dB
Output 1dB Compression - 3 - dBm
Input IP

3

-1-dBm
Reverse Isolation - 30 - dB
Supply Current at VDD = 5V 3 5 7 mA
Supply Range 2.7 - 5.5 V

Typical Performance Curves

18

TA= 25oC

2.0
TA= 25oC

3V, 5mA

16

5V, 20mA

14

GAIN (dB)

12

10

2.2 2.3 2.4 2.5 2.6 2.7
FREQUENCY (GHz)

5V, 5mA

3V, 5mA

1.9

dB

URE

1.8

E FI
I

N

1.7

1.6

2.40 2.42 2.44 2.46 2.48 2.50
FREQUENCY (GHz)

5V, 5mA

5V, 20mA

FIGURE 2. GAIN vs FREQUENCY FIGURE 3. NOISE FIGURE vs FREQUENCY

2-9

HFA3424

Typical Performance Curves

3.0

2.5
OUTPUT

2.0

VSWR

1.5

1.0

2.2 2.3 2.4 2.5 2.6 2.7
FREQUENCY (GHz)

(Continued)

5V, 5mA, TA= 25oC

FIGURE 4. VSWR vs FREQUENCY

18

5V, 5mA

16

INPUT

4

TA= 25oC

5V, 20mA

2

5V, 5mA

(dBm)

3

0

INPUT IP

-2

-4

2.40 2.42 2.44 2.46 2.48 2.50

3V, 5mA

FREQUENCY (GHz)

FIGURE 5. INPUT IP3 vs FREQUENCY

2.6

85oC

2.3

5V, 5mA

-40oC

14

GAIN (dB)

12

10

2.2 2.3 2.4 2.5 2.6 2.7
FREQUENCY (GHz)

85oC

25oC

FIGURE 6. GAIN vs FREQUENCY FIGURE 7. NOISE FIGURE vs FREQUENCY

2.0

NOISE FIGURE (dB)

1.7

1.4

2.40 2.42 2.44 2.46 2.48 2.50
FREQUENCY (GHz)

25oC

-40

o

C

2-10

Typical Application Circuit

HFA3424

500pF

V

(PIN 2)

BIAS

NORMAL BIAS EXTENDED BIAS

Open 30Ω To 35Ω To Ground

PIN 2 ALLOWS FOR AN EXTERNAL RESISTOR
TO BE USED TO GROUND FOR AN OPTIONAL

R

BB

20mA CURRENT OPERATION. RECOMMENDED

VALUES FOR THE CHIP RESISTOR ARE 30Ω TO 35Ω.

RF SIGNAL INPUT 2.4GHz

(50Ω TRANSMISSION LINE)

SEE NOTE 2

8

1

NOTE:

3. No DC blocking capacitor required on LNA input or output transmission lines.

FIGURE 8. REFERENCE APPLICATION/TEST DESIGN SETUP SCHEMATIC: LOW NOISE AMPLIFIER

15nH

7

6

5

2

3

4

R

BB

+V

DD

RF SIGNAL OUTPUT 2.4GHz
(50Ω TRANSMISSION LINE)
SEE NOTE 2

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold b ydescription only. Intersil Corporation reserves the right to makechangesin circuit design and/or specifications at any time with­out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. Howe ver, no responsibility is assumed by Intersiloritssubsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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2-11

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