Ultrafast Recovery
Ultrasoft Recovery
Very Low
Very Low Q
I
RRM
rr
Specified at Operating Conditions
Lead-Free
Benefits
Reduced RFI and EMI
1
CATHODE
BASE
CATHODE
4
2
Ultrafast, Soft Recovery DiodeHEXFRED
ANODE
2
Reduced Power Loss in Diode and Switching
Transistor
Higher Frequency Operation
Reduced Snubbing
Reduced Parts Count
Description
International Rectifier's HFA25TB60 is a state of the art ultra fast recovery
diode. Employing the latest in epitaxial construction and advanced processing
techniques it features a superb combination of characteristics which result in
performance which is unsurpassed by any rectifier previously available. With
basic ratings of 600 volts and 25 amps continuous current, the HFA25TB60 is
especially well suited for use as the companion diode for IGBTs and MOSFETs.
In addition to ultra fast recovery time, the HEXFRED product line features
extremely low values of peak recovery current (I
tendency to "snap-off" during the tb portion of recovery. The HEXFRED features
combine to offer designers a rectifier with lower noise and significantly lower
switching losses in both the diode and the switching transistor. These HEXFRED
advantages can help to significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA25TB60 is ideally suited for applications in
power supplies and power conversion systems (such as inverters), motor
drives, and many other similar applications where high speed, high efficiency
is needed.
) and does not exhibit any
RRM
VR = 600V
VF(typ.)* = 1.3V
I
= 25A
F(AV)
Qrr (typ.)= 112nC
I
= 10A
RRM
3
trr(typ.) = 23ns
di
/dt (typ.) = 250A/µs
(rec)M
TO-220AC
Absolute Maximum Ratings
ParameterMax Units
V
R
IF @ TC = 100°CContinuous Forward Current25
I
FSM
I
FRM
PD @ TC = 25°CMaximum Power Dissipation125
PD @ TC = 100°CMaximum Power Dissipation50
T
J
T
STG
Cathode-to-Anode Voltage600V
Single Pulse Forward Current225A
Maximum Repetitive Forward Current100
420 1200TJ = 125°Cdif/dt = 200A/µs
/dt1 Peak Rate of Fall of Recovery Current250TJ = 25°C
/dt2 During t
b
See Fig. 11 & 12
160TJ = 125°C
A
nC
A/µs
Thermal - Mechanical Characteristics
ParameterMinTypMaxUnits
T
Lead Temperature300°C
lead
R
JC
th
R
Thermal Resistance, Junction to Ambient80
JA
th
R
Thermal Resistance, Case to Heat Sink0.5
CS
th
Wt
Thermal Resistance, Junction to Case1.0
Weight
Mounting Torque
6. 012Kg-cm
5.010lbfin
2.0g
0.07(oz)
K/W
0.063 in. from Case (1.6mm) for 10 sec
Typical Socket Mount
Mounting Surface, Flat, Smooth and Greased
2
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Page 3
HFA25TB60PbF
1
1
A
1
0
A
0000
T = 150°C
1000
(µA)
R
Reverse Current - I
100
10
1
0.1
0.01
J
T= 125°C
J
T = 25°C
J
0100200300400500600
Reverse Voltage - V (V)
R
(A)
F
00
T = 150°C
J
T = 125°C
J
T = 25°C
10
J
Fig. 2 - Typical Reverse Current vs. Reverse
Voltage
A
000
Instantaneous Forward Current - I
1
0.61.01.41.82.22.6
Forward Voltage Drop - V (V)
FM
A
(pF)
T
100
T = 25°C
J
Junction Capacitance -C
Fig. 1 - Maximum Forward Voltage Drop
vs. Instantaneous Forward Current
10
110100100
Reverse Voltage - V (V)
R
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
10
thJC
1
D = 0.50
0.20
0.10
0.1
0.05
0.02
Thermal Response (Z )
0.01
0.01
0.000010.00010.0010.010.1 1
SINGLE PULSE
(THERMAL RESPONSE)
t , Rectangular Pulse Duration (sec)
1
Fig. 4 - Maximum Thermal Impedance Z
Notes:
1. Duty factor D = t / t
2. Peak T =Px Z+ T
JDMthJCC
Characteristics
thjc
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1 2
P
DM
t
1
t
2
3
Page 4
HFA25TB60PbF
1
1
2
2
3
A
1
1
1
A
1
A
1
1
1
A
40
20
00
I = 50A
F
80
trr- (nC)
I = 25A
F
I = 10A
F
60
40
20
1001000
di /dt - (A/µs)
f
V = 200V
R
T = 125°C
J
T = 25°C
J
Fig. 5 - Typical Reverse Recovery vs. dif/dt
400
V = 200V
R
T = 125°C
J
T = 25°C
J
200
0
V = 200V
R
T = 125°C
J
T = 25°C
J
5
I = 50A
F
0
I = 25A
F
I = 10A
Irr- ( A)
F
5
0
5
0
1001000
di /dt - (A/µs)
f
Fig. 6 - Typical Recovery Current vs. dif/dt
0000
V = 200V
R
T = 125°C
J
T = 25°C
J
000
800
Qrr- (nC)
600
400
200
Fig. 7 - Typical Stored Charge vs. dif/dtFig. 8 - Typical di
4
I = 50A
F
I = 25A
F
I = 10A
F
0
1001000
di /dt - (A/µs)
f
I = 50A
1000
di (rec) M/dt- (A /µs)
F
I = 25A
F
I = 10A
F
100
1001000
di /dt - (A/µs)
f
/dt vs. dif/dt
(rec)M
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Page 5
0
REVERSE RECOVERY CIRCUIT
dif/dt
ADJUST
L = 70µH
G
V = 200V
R
0.01
D
IRFP250
S
HFA25TB60PbF
3
t
RRM
rr
I
RRM
t
b
Q
0.5
t
a
2
di(rec)M/dt
0.75 I
RRM
4. Qrr - Area under curve defined by t
and I
RRM
t
Qrr =
2
5. di
/dt - Peak rate of change of
(rec)M
current during tb portion of t
I
rr
RRM
4
5
rr
X I
rr
RRM
rr
I
F
Ω
1
di /dt
RRM
f
and 0.50 I
D.U.T.
1. dif/dt - Rate of change of current
through zero crossing
2. I
- Peak reverse recovery current
RRM
3. trr - Reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 I
extrapolated to zero current
Fig. 9 - Reverse Recovery Parameter Test
Circuit
Fig. 10 - Reverse Recovery Waveform and
Definitions
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5
Page 6
HFA25TB60PbF
TO-220AC Package Outline
Dimensions are shown in millimeters (inches)
TO-220AC Part Marking Information
PART NUMBER
DATE CODE
P = LE AD-FREE
YEAR 1 = 2001
WEEK 19
LINE C
PART NUMBER
DATE CODE
YEAR 1 = 2001
WEEK 19
P = LEAD-FREE
T HIS IS A H F A06T B 1 20
EXAMPLE:
LOT CODE 1789
ASS E MBLED ON WW 19, 2001
IN THE ASSEMBLY LINE "C"
EXAMPLE:
THIS IS A HFA06TB120
LOT CODE 1789
ASS EMBLED ON WW 19, 2001
IN THE A SSEMBLY LINE "C"
INTERNATIONAL
RECTIFIER
LOGO
ASSEMBLY
LOT CODE
INTERNATIONAL
RECTIFIER
LOGO
AS S EMB L Y
LOT CODE
Data and specifications subject to change without notice.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.10/04
6
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