Datasheet HFA08SD60S DataSheet (Vishay)

Ultrafast, Soft Recovery Diode

Bulletin PD-20618 07/00

HFA08SD60S

Features

• Ultrafast Recovery Time

• Ultrasoft Recovery

• Very Low I

• Very Low Q

• Guaranteed Avalanche

• Specified at Operating Temperature

RRM

rr

Benefits

• Reduced RFI and EMI

• Reduced Power Loss in Diode and Switching Transistor

• Higher Frequency Operation

• Reduced Snubbing

• Reduced Parts Count

Description/ Applications

These diodes are optimized to reduce losses and EMI/RFI in high frequency power conditioning systems. The softness of the recovery eliminates the need for a snubber in most applications. These devices are ideally suited for freewheeling, flyback, power converters, motor drives, and other applications where high speed and reduced switching losses are design requirements.

Package Outline

I

F(AV)

D - PAK

t

= 18ns

rr

= 8Amp

VR = 600V

Absolute Maximum Ratings

Parameters Max Units

V

RRM

I

F(AV)

I

FSM

I

FRM

P

D

TJ, T

Cathode-to-Anode Voltage 600 V

Continuous Forward Current 8 A

TC = 100°C

Single Pulse Forward Current 60

Peak Repetitive Forward Current 24

Maximum Power Dissipation 14 W

TC = 100°C

Operating Junction and Storage Temperatures - 55 to 150 °C

STG

1

HFA08SD60S

Bulletin PD-20618 07/00

Electrical Characteristics @ T

Parameters Min Typ

VBR, VrBreakdown Voltage, 600 - - V IR = 100µA

Blocking Voltage

V

F

I

R

C

T

L

S

Forward Voltage - 1.4 1.7 V IF = 8A

See Fig. 1 - 1.7 2.1 V IF = 16A

Max. Reverse Leakage Current - 0.3 5.0 µA VR = VR Rated

Junction Capacitance - 10 25 pF VR = 200V

Series Inductance - 8.0 - nH Measured lead to lead 5mm from package body

= 25°C (unless otherwise specified)

J

Max Units

- 1.4 1.7 V IF = 8A, TJ = 125°C

- 100 500 µA TJ = 125°C, VR = 0.8 x VR Rated

Test Conditions

Dynamic Recovery Characteristics @ TJ = 25°C (unless otherwise specified)

Parameters Min Typ

di

t

rr

I

RRM

Q

(rec)

rr

Reverse Recovery Time -18-nsIF = 1.0A, diF/dt = 200A/µA, VR = 30V

-3755 TJ = 25°C

-5590 TJ = 125°C

Peak Recovery Current - 3.5 5.0 A TJ = 25°C

- 4.5 8.0 TJ = 125°C

Reverse Recovery Charge - 65 138 nC TJ = 25°C

- 124 360 TJ = 125°C

/dt Rate of Fall of recovery Current - 240 - A/µs TJ = 25°C

M

- 210 - TJ = 125°C

Max

Units Test Conditions

IF = 8A

VR = 200V

diF /dt = 200A/µs

Thermal - Mechanical Characteristics

Parameters Min Typ Max Units

T

J

T

Stg

T

lead

R

thJC

R

thJA

Wt Weight - 2.0 - g

! Typical Socket Mount

2

Max. Junction Temperature Range - - - 55 to 150 °C

Max. Storage Temperature Range - - - 55 to 150

Lead Temperature - - 300

Thermal Resistance, Junction to Case - - 3.5 °C/ W

!

Thermal Resistance, Junction to Ambient - - 80

- 0.07 - (oz)

(A)

0.001

0.01

0.1

1

10

100

1000

0 100 200 300 400 500 600

125˚C

25˚C

T = 150˚C

J

0.1

1

10

00

0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4

T = 150˚C T = 125˚C T = 25˚C

J

Instantaneous Forward Current - I

HFA08SD60S

Bulletin PD-20618 07/00

(µA)

R

Reverse Current - I

F

Reverse Voltage - VR (V)

Fig. 2 - Typical Values Of Reverse Current

100

(pF)

T

Vs. Reverse Voltage

T = 25˚C

J

10

Junction Capacitance - C

1

1 10 100 1000

Forward Voltage Drop - V

Fig. 1 - Typical Forward Voltage Drop Characteristics

FM

(V)

Reverse Voltage - V R (V)

Fig. 3 - Typical Junction Capacitance

Vs. Reverse Voltage

10

(°C/W)

thJC

Thermal Impedance Z

D = 0.50 D = 0.20 D = 0.10

0.1

1

D = 0.05 D = 0.02 D = 0.01

Single Pulse

(Thermal Resistance)

Notes:

P

DM

t

1

t

2

1. Duty factor D = t1/ t2

2. Peak Tj = Pdm x ZthJC + Tc

.01

0.00001 0.0001 0.001 0.01 0.1 1

t1, Rectangular Pulse Duration (Seconds)

Fig. 4 - Max. Thermal Impedance Z

Characteristics

thJC

3

HFA08SD60S

Bulletin PD-20618 07/00

80

70

60

50

trr (nC)

40

30

Vr = 200V

20

Tj = 125˚C Tj = 25˚C

10

100 1000

di

/dt (A/ µs)

F

Fig. 5 - Typical Reverse Recovery vs. di

10000

Vr = 200V Tj = 125˚C Tj = 25˚C

If = 16A If = 8A If = 4A

20

15

If = 16A If = 8A If = 4A

10

Irr (A)

5

Vr = 200V Tj = 125˚C Tj = 25˚C

0

100 1000

Average Forward Current - I

/dt

F

Fig. 6 - Typical Recovery Current vs. di F /dt

F(AV)

(A)

10000

Vr = 200V Tj = 125˚C Tj = 25˚C

4

If = 16A If = 8A If = 4A

1000

Qrr ( nC )

100

100 1000

di F /dt (A/µs )

Fig. 7 - Typical Stored Charge vs. di

If = 16A If = 8A If = 4A

1000

/ dt (A/ µs)

(rec)M

di

100

100 1000

di F /dt (A/µs )

/dt

F

Fig. 8 - Typical di

(rec)M

/dt vs. di

/dt

F

Reverse Recovery Circuit

V = 200V

R

0.01

Ω

L = 70µH

D.U.T.

HFA08SD60S

Bulletin PD-20618 07/00

di F /dt

dif/dt ADJUST

G

Fig. 9- Reverse Recovery Parameter Test Circuit

I

F

t

a

0

1

di F /dt

di /dt

f

1. diF/dt - Rate of change of current through zero crossing

2. I

- Peak reverse recovery current

RRM

3. t

- Reverse recovery time measured from zero

rr

crossing point of negative going IF to point where a line passing through 0.75 I extrapolated to zero current

RRM

and 0.50 I

RRM

3

2

D

IRFP250

S

t

rr

t

b

Q

I

RRM

0.5

di(rec)M/dt

0.75

I

RRM

4. Qrr - Area under curve defined by t and I

RRM

Q

rr

5. di

/dt - Peak rate of change of

(rec)M

current during tb portion of t

rr

I

=

4

RRM

t rr x I

RRM

2

5

rr

Fig. 10 - Reverse Recovery Waveform and Definitions

5

HFA08SD60S

e

Bulletin PD-20618 07/00

Outline Table

6.73 (0.26)

6.35 (0.25)

5.46 (0.21)

5.21 (0.20)

4

1.64 (0.02)

123

1.52 (0.06)

1.15 (0.04)

1.14 (0.04)

2x

0.76 (0.03)

2.28 (0.09) 2x

Conform to JEDEC outline D-Pak

Dimensions in millimeters and (inches)

Tape & Reel Information

TRR

FEED DIRECTION

TRL

FEED DIRECTION

1.85 (0.073)

1.65 (0.065)

1.27 (0.05)

0.88 (0.03)

6.22 (0.24)

5.97 (0.23)

0.89 (0.03)

3x

0.64 (0.02)

4.57 (0.18)

4.10 (0.161)

3.90 (0.153)

10.9 0 (0.4 29)

10.7 0 (0.4 21)

2.38 (0.09)

2.19 (0.08)

10.42 (0.41)

9.40 (0.37)

1 - Anode 2 - Cathode 3 - Anode 4 - Cathode

1.60 (0.063)

1.50 (0.059)

1.60 (0. 063)

1.50 (0. 059)

11.6 0 (0.4 57)

11.4 0 (0.4 49)

1.75 (0.069)

1.25 (0.049)

16.1 0 (0.6 34)

15.9 0 (0.6 26)

1.14 (0.04)

0.89 (0.03)

0.58 (0.02)

0.46 (0.02)

6.45 (0.24)

5.68 (0.22)

0.51 (0.02) MIN.

0.58 (0.02)

0.46 (0.02)

DIA.

15.42 (0.6 09)

15.22 (0.6 01)

MINIMUM RECOMMENDED FOOTPRINT

5.97 (0.24)

6.48 (0.26)

10.67 (0.42)

2x

2.54 (0.10)

1.65 (0.06)

2x

0.368 (0.0145)

0.342 (0.0135)

24.3 0 (0.95 7)

23.9 0 (0.94 1)

4.72 (0.186)

4.52 (0.178)

2.28 (0.09) 2x

base

cathode

13

cathode

anode anod

4

2

360 (14.173)

DIA. M AX.

13.5 0 (0.5 32)

12.8 0 (0.5 04)

DIA.

26.4 0 (1.0 39)

24.4 0 (0.9 61)

60 (2 .362)

DIA. MIN.

SMD-220 Tape & Reel

When order ing, indicate th e part

SMD-220 Tape & Reel

number, part orientation, and th e quantity. Quantities are in multiples

When ordering, indicate the part

of 8 00 pi eces p er reel for bo th

number, part orientation and the

TRL an d TRR.

quantity. Quantities are in multiples of 800 pieces per reel for both TRL and TRR.

6

Marking Information

HFA08SD60S

Bulletin PD-20618 07/00

EXAMPLE: THIS IS AN HFA08SD60S

Ordering Information Table

Device Code

HF A 08 SD 60 S

1

2

1 - Hexfred Family

2 - Electron Irradiated

3 - Current Rating (08 = 8A)

4 - D-PAK

5 - Voltage Rating (60 = 600V)

6 - Suffix

INTERNATIONAL

RECTIFIER LOGO

4

3

ASSEMBLY

LOT CODE

5

2 (K)

PART NUMBER

HFA08SD60S

9812

5K3A

DATE CODE (YYWW)

YY = YEAR

1 (K) 3 (A)

WW = WEEK

6

S= D2PAK/ Dpak

TR = Tape & Reel

TRL = Tape & Reel Left

TRR = Tape & Reel Right

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