Datasheet HES063ZC-A, HES050ZG-A, HES050ZE-A, HES050ZD-A, HES037ZD-A Datasheet (Power-one)

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Powering Communications and Technology
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X10 = LOAD %
HES033ZE
HES075ZG
HES100ZE
HES SERIES
150 WATT
DESCRIPTION
HES single output DC/DC converters provide up to 150 Watts of output power in an industry standard, half-brick package and footprint. These units feature ultra-high efficiency, Class A conducted noise specs, and fixed switching frequency. The HES is designed with open-frame packaging, along with planar magnetics to provide maximum useable power with minimal thermal constraints. The HES is especially suited to harsh telecom, networking, and industrial applications, and is fully compatible with production board washing processes.
TECHNICAL SPECIFICATIONS
Voltage Range
24 VDC Nominal 18 - 36 VDC
48 VDC Nominal 36 - 72 VDC Reflected Ripple 50 mA Input Reverse Voltage Protection Shunt Diode
Input Undervoltage Lockout / Hysteresis <34V/1V Nom.
Setpoint Accuracy ±1% Line Regulation VinMin. - VinMax., I Load Regulation I Remote Sense Headroom 0.5 VDC Minimum Output Current 10 % Dynamic Regulation, Loadstep 25% I
Pk Deviation 4% V
Settling Time 500 ms Voltage Trim Range ±10% Short Circuit / Overcurrent Protection Shutdown / Hiccup Current Limit Threshold Range, % of I OVP Trip Range 120 - 140% V OVP Type Self Recovering
Turn-On Time 10 ms Remote Shutdown Positive Or Negative Logic Remote Shutdown Reference VinNegative Switching Frequency 2.5 & 3.3, 5V Model 200 kHz, 300 kHz (Respectively) Isolation
Input - Output 1500 VDC
Input - Case 1050 VDC
Output - Case 500 VDC Temperature Coefficient 0.02%/°C Case Temperature
Operating Range -40 To +100°C
Storage Range -40 To +125°C Thermal Shutdown Range 105 To 115°C Vibration, 3 Axes, 5 Min Each 5 g, 10 - 55 Hz MTBF†(Bellcore Tr-nwt-000332) 1.8 X 106hrs Safety UL 1950, Csa 22.2-950, En60950 Weight (Approx.) 1.4 oz
Min. - Iout Max., VinNom. 0.2% V
out
Input
Output
Rated 0.2% V
out
Rated 110 - 130%
out
General
out
FEATURES
• High Efficiency
• Industry Standard Half­Brick
• Open-Frame Packaging
• 100°C Baseplate Operation
out out
out out
Nom.
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load, unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully compatible with commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model. Please consult factory for specific model information.
Units are water-washable and fully compatible with commercial spray or immersion post wave-solder washing equipment.
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• Water Washable
• “True-Trim” Option
• 1500V Isolation
• Positive or Negative Logic
Efficiency vs. Load (48V Input)
High Density - Board Mounted Power Division
Notes
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Powering Communications and Technology
MODELS - (See the last page of Section for options.)
HES SERIES
150 WATT
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2.28"
(57.9mm)
1
5
MOUNTING INSERTS M3X.5 THROUGH 4PL
1.400"(35.6mm)
0.18"
(4.6mm)
2.40"
(61.0mm)
(48.3mm)
Thermal Impedance
Natural Convection 15.4 °C/W 100 LFM 12.2 °C/W 200 LFM 9.3 °C/W 300 LFM 7.4 °C/W 400 LFM 6.4 °C/W
Note: Thermal impedance data is dependent on many environmental factors. The exact thermal
High Density - Board Mounted Power Division
performance should be validated for specific application.
1.900"
2
3
4
0
-0.19" (-4.8mm)
1.000"(25.4mm)
0.700"(17.8mm)
0.400"(10.2mm)
0
-0.50"(-12.7mm)
BOTTOM VIEW
6
7
8
9
Pin Function
1-V
2 Case 3 On/Off 4+V
5-V
6 -Sense
7 Trim
8 +Sense
9
+V
in
in
out
out
DIA 0.080"
(2.0mm)
2PL
DIA 0.040"
(1.0mm)
7PL
0.025" REF. (0.6mm)
0.50"
(12.7mm)
Tolerances
Inches: (Millimeters) .XX ± 0.020 .X ± 0.5 .XXX ± 0.010 .XX ± 0.25
Pin: ± 0.002 ± 0.05
(Dimensions as listed unless otherwise specified.)
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OPTIONS
0.95" (24.1mm) Horizontal
All Units (Except DIP, SIP, and SM
All Units (Except DIP, SIP, and SM
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When ordering equipment options, use the following suffix information. Select the option(s) that you prefer and add them to the model number. Example ordering options are located below the options table.
OPTIONS SUFFIX APPLICABLE SERIES REMARKS
Negative Logic N HAS, HBD, HBS, HES, LES, QBS, TTL "Low" Turns Module ON
QES, TES, TQD TTL "High" Turns Module OFF
Lucent Compatible Trim T HAS, HBD, HBS, HES, QBS, QES Terminal Strip TS XWS, XWD, XWT Trim 1 IAS, LES
Enable 2 IAD, IAS, LES, SMS Trim and Enable 3 IAS, LES Current Share 4 SMS Headerless Y Encapsulated EWS, IWS, OWS
PIN LENGTH AND HEATSINK OPTIONS
0.110" (2.8mm) Pin Length 8 All Units (Except SMS)
0.150" (3.8mm) Pin Length 9 All Units (Except SMS) All Units (Except DIP, SIP, and SM
0.24" (6.1mm) Horizontal Heatsink
0.24" (6.1mm) Vertical Heatsink 1V
0.45" (11.4mm) Horizontal
Heatsink
0.45" (11.4mm) Vertical Heatsink 2V
Heatsink
0.95" (24.1mm) Vertical Heatsink 3V
Example Options: HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink. LES015YJ-3N = LES015YJ with optional trim and enable, negative logic. QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
1H
2H
3H
Packages) All Units (Except DIP, SIP, and SM Packages) All Units (Except DIP, SIP, and SM Packages) All Units (Except DIP, SIP, and SM Packages)
Packages)
Packages)
Standard Pin Length is 0.180" (4.6mm)
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
Includes Thermal Pad
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu­factured. Specifications are subject to change without notice.
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