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HI-SINCERITY
MICROELECTRONICS CORP.
HE9015
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HE9015 is designed for use in pre-amplifier of low level and low
noise.
Spec. No. : HE6101
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 1/4
Features
• High Total Power Dissipation (P D: 4 50 mW)
• Complementary to HE9014
• High hFE and Good Linearity
TO-92
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 450 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -50 V
VCEO Collector to Emitter Voltage..................................................................................... -45 V
VEBO Emitter to Base Voltage............................................................................................. -5 V
IC Collector Current....................................................................................................... -100 mA
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -50 - - V IC=-100uA, IE=0
BVCEO -45 - - V IC=-1mA, IB=0
BVEBO -5 - - V IE=-100uA, IC=0
ICBO - - -50 nA VCB=-50V, IE=0
IEBO - - -50 nA VEB=-5V, IC=0
*VCE(sat) - -0.20 -0.7 V IC=-100mA, IB=-5mA
*VBE(sat) - -0.82 -1 V IC=-100mA, IB=-5mA
VBE(on) -0.6 -0.65 -0.75 V VCE=-5V, IC=-2mA
*hFE 100 200 600 VCE=-5V, IC=-1mA
Cob - 4.5 7 pF VCB=-10V , f= 1M Hz, IE=0
fT 100 190 - MHz VCE=-5V, IC=-10mA
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
Classification on hFE1
Rank B C
Range 100-300 200-600
HE9015 HSMC Product Specification
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HI-SINCERITY
V
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6101
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 2/4
1000
hFE @ VCE=5V
125oC
hFE
100
1 10 100
Collector Current - IC (mA)
75oC
25oC
Sat urati on Voltage & Collector Current
1000
25oC
Current Gain & Coll ector Current
1000
CE(sat)
V
100
Saturation Voltage (mV)
10
0.1 1 10 100
125oC
B
@ IC=20I
75oC
25oC
Collector Current - IC (mA)
ON Voltage & Collector Current
1000
25oC
Sat urati on Voltage & C ollector Cu rrent
75oC
125oC
Saturation Voltage (mV)
100
0.1 1 10 100
Collector Current - IC (mA)
BE(sat)
V
@ IC=20I
Ca pacitan ce & R everse-Biased V olt age
10
Cob
Capacitance (pF)
75oC
125oC
ON Voltage ( m V)
B
100
0.1 1 10 100
Collector Current - IC (mA)
BE(ON)
V
@ VCE=5V
Cut o ff Frequen cy & Collector Current
1000
VCE=5
100
Cutoff Frequency (MHz)...
1
0.1 1 10 100
Rev e r se- Biased Voltage ( V)
10
1 10 100
Collec tor Current (mA )
HE9015 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6101
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 3/4
1000
Safe Operating Ar ea
100
(mA)
C
10
Collector Current-I
1
1 10 100
Forwar d Voltage- VCE (V)
PT=1ms
PT=100ms
PT=1s
500
PD-Ta
450
400
350
300
250
200
150
Power Dissipation-PD (mW)
100
50
0
0 50 100 150 200
Ambient Temperatur e - Ta (oC)
HE9015 HSMC Product Specification
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HI-SINCERITY
g
A
MICROELECTRONICS CORP.
TO-92 Dimension
Spec. No. : HE6101
Issued Date : 1992.08.25
Revised Date : 2002.02.18
Page No. : 4/4
A
α2
B
31
2
Marking:
HE
091
5
Date Code Control Code
Rank
α3
C
D
H
I
α1
G
Style: Pin 1.Emitter 2.Base 3.Collector
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code:
DIM
*: Typical
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0 .0142 0.0220 0.36 0 .56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family , flammability solid burning class: UL94V-0
α1
α2
α3
-
-
-
*5°
*2°
*2°
-
-
-
*5°
*2°
*2°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HE9015 HSMC Product Specification
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