Page 1
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6114
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 1/3
HE8550
PNP EPITAXIAL PLANAR TRANSIST OR
Description
The HE8550 is designed for use in 2W output amplifier of portable
radios in class B push-pull operation.
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -55 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Ta=25°C)...................................................................................... 1 W
Maximum Voltages and Currents (Ta=25°C)
•
VCBO Collector to Base Voltage ....................................................................................... -40 V
VCEO Collector to Emitter Voltage .................................................................................... -25 V
VEBO Emitter to Base Voltage ............................................................................................ -6 V
IC Collector Current ......................................................................................................... -1.5 A
IB Base Current................................................................................................................ -0.5 A
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -40 - - V IC=-100uA, IE=0
BVCEO -25 - - V IC=-2mA, IB=0
BVEBO -6 - - V IE=-100uA, IC=0
ICBO - - -100 nA VCB=-35V, IE=0
IEBO - - -100 nA VEB=-6V, IC=0
*VCE(sat) - - -0.5 V IC=-0.8A, IB=-80mA
*VBE(sat) - - -1.2 V IC=-0.8A, IB=-80mA
VBE(on) - - -1 V VCE=-1V, IC=-10mA
*hFE1 45 - - VCE=-1V, IC=-5mA
*hFE2 85 - 500 VCE=-1V, IC=-100mA
*hFE3 40 - - VCE=-1V, IC=-800mA
fT 100 - - MHz VCE=-10V, IC=-50mA, f=100MHz
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification on hFE2
Rank B C D E
Range 85-160 120-200 160-320 250-500
HE8550 HSMC Product Specification
Page 2
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Spec. No. : HE6114
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 2/3
1000
Current Gai n & Collector Current
VCE=1V
100
hFE
10
0.1 1 10 100 1000 10000
10000
Collector Curren t (m A )
On Vol t age & Collector Cur rent
10000
Saturation Volt age & Coll ector Cu rren t
1000
BE(sat)
V
@ IC=10IB
100
CE(sat)
V
@ IC=10I
Satu r ation Voltage (mV)
10
1
0.1 1 10 100 1000 10000
1000
Cut o ff Fr equency & Collect or Current
Collector Curren t (m )
VCE=10V
B
1000
BE(on)
V
On Voltage (mV)
100
1 10 100 1000 10000
100
10
Capac itanc e (pF)
Capcitance & Reverse-Bia sed Voltage
Collector Curren t (m A )
Cob
@ VCE=1V
100
Cutoff Frequency (MHz)
10
1 10 100 1000
10000
1000
(mA)
C
100
Collector Curren t-I
PT=1ms
PT=100ms
PT=1s
10
Collector Curren t (m A )
Safe Operating Area
1
0.1 1 10 100
Reverse-Biased Vol t ag e ( V)
1
1 10 100
Forwar d Vol tage-VCE (V)
HE8550 HSMC Product Specification
Page 3
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-92 Dimension
A
Spec. No. : HE6114
Issued Date : 1992.09.30
Revised Date : 2001.08.13
Page No. : 3/3
α
2
Marking :
C
B
31
2
α
3
HSMC Logo
Part Number
Date Code
HSMC Logo
D
Part Number
H
α
I
1
G
Style : Pin 1.Emitter 2.Collector 3.Bas e
Product Series
Rank
Laser Mark
Product Series
Ink Mark
E
DIM
F
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
3-Lead TO-92 Plastic Package
HSMC Packa
e Code : A
DIM
Min. Max. Min. Max.
A 0.1704 0.1902 4.33 4.83 G 0.0142 0.0220 0.36 0.56
B 0.1704 0.1902 4.33 4.83 H - *0.1000 - *2.54
C 0.5000 - 12.70 - I - *0.0500 - *1.27
D 0.0142 0.0220 0.36 0.56
E - *0.0500 - *1.27
F 0.1323 0.1480 3.36 3.76
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.
1
α
2
α
3
α
-
-
-
*5
*2
*2
°
°
°
-
-
-
*:Typical
*5
°
*2
°
*2
°
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HE8550 HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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