The HD74LV86A performs the Boolean functions Y = A ⊕ B or Y = AB + AB in positive logic. A
common application is as a true/complement element. If one of the inputs is low, the other input wll be
reproduced in true form at the output. If one of the inputs is high, the other input will be reproduced
inverted form at the output. Low-voltage and high-speed operation is suitable for the battery-powered
products (e.g., notebook computers), and the low-power consumption extends the battery life.
Features
• VCC = 2.0 V to 5.5 V operation
• All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V)
• All outputs VO (Max.) = 5.5 V (@VCC = 0 V)
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25°C)
• Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V)
Function Table
Inputs
ABOutput Y
LL L
LH H
HL H
HH L
Note: H: High level
L: Low level
Page 2
HD74LV86A
Pin Arrangement
1A
1B
1Y
2A
2B
2Y
GND
1
2
3
4
5
6
7
(Top view)
14
13
12
11
10
V
CC
4B
4A
4Y
3B
3A
9
3Y
8
2
Page 3
HD74LV86A
Absolute Maximum Ratings
ItemSymbolRatingsUnitConditions
Supply voltage rangeV
Input voltage range*
Output voltage range*
1
1, 2
Input clamp currentI
Output clamp currentI
Continuous output currentI
Continuous current through
V
or GND
CC
Maximum power dissipation
at Ta = 25°C (in still air)*
3
CC
V
I
V
O
IK
OK
O
or I
I
CC
GND
P
T
Storage temperatureTstg–65 to 150°C
Notes: The absolute maximum ratings are values which must not individually be exceeded, and furthermore,
no two of which may be realized at the same time.
1. The input and output voltage ratings may be exceeded if the input and output clamp-current
ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The maximum package power dissipation was calculated using a junction temperature of 150°C.
–0.5 to 7.0V
–0.5 to 7.0V
–0.5 to VCC + 0.5VOutput: H or L
–0.5 to 7.0VCC: OFF
–20mAVI < 0
±50mAVO < 0 or VO> V
±25mAVO = 0 to V
CC
±50mA
785mWSOP
500TSSOP
CC
3
Page 4
HD74LV86A
Recommended Operating Conditions
ItemSymbolMinMaxUnitConditions
Supply voltage rangeV
Input voltage rangeV
Output voltage rangeV
Output currentI
CC
I
O
OH
I
OL
Input transition rise or fall rate∆t /∆v0200ns/VVCC = 2.3 to 2.7 V
Operating free-air temperatureTa–4085°C
Note: Unused or floating inputs must be held high or low.
2.05.5V
05.5V
0VCCV
—–50µAV
—–2 mAV
—–6V
= 2.0 V
CC
= 2.3 to 2.7 V
CC
= 3.0 to 3.6 V
CC
—–12VCC = 4.5 to 5.5 V
—50 µAV
= 2.0 V
CC
—2mAVCC = 2.3 to 2.7 V
—6V
—12V
= 3.0 to 3.6 V
CC
= 4.5 to 5.5 V
CC
0100VCC = 3.0 to 3.6 V
020V
= 4.5 to 5.5 V
CC
Logic Diagram
A
B
Y
4
Page 5
HD74LV86A
DC Electrical Characteristics
• Ta = –40 to 85°C
ItemSymbolVCC (V)*MinTypMaxUnitTest Conditions
Input voltageV
Output voltageV
Input currentI
Quiescent
IH
V
IL
OH
V
OL
IN
I
CC
supply current
Output leak
I
OFF
current
Input
C
IN
capacitance
Note: For conditions shown as Min or Max, use the appropriate values under recommended operating
conditions.
2.01.5——V
2.3 to 2.7VCC × 0.7——
3.0 to 3.6VCC × 0.7——
4.5 to 5.5VCC × 0.7——
2.0——0.5
2.3 to 2.7——VCC × 0.3
3.0 to 3.6——VCC × 0.3
4.5 to 5.5——VCC × 0.3
Min to
VCC – 0.1——VIOL = –50 µA
Max
2.32.0——IOL = –2 mA
3.02.48——IOL = –6 mA
4.53.8——IOL = –12 mA
Min to
——0.1IOL = 50 µA
Max
2.3——0.4IOL = 2 mA
3.0——0.44IOL = 6 mA
4.5——0.55IOL = 12 mA
0 to 5.5——±1µAVIN = 5.5 V or GND
5.5——20µAVIN = VCC or GND, IO = 0
0——5 µAVO= 5.5 V
3.3—TBD—pFV
= VCC or GND
I
5
Page 6
HD74LV86A
Switching Characteristics
• VCC = 2.5 ± 0.2 V
Ta = 25°CTa = –40 to 85°C
ItemSymbolMinTypMaxMinMaxUnitTest Conditions
Propagation
delay
time
• VCC = 3.3 ± 0.3 V
ItemSymbolMinTypMaxMinMaxUnitTest Conditions
Propagation
delay
time
t
PLH
t
PHL
—TBDTBD1.0TBDnsCL = 15 pFA or BY
—TBDTBD1.0TBDCL = 50 pF
Ta = 25°CTa = –40 to 85°C
t
PLH
t
PHL
—7.011.01.013.0nsCL = 15 pFA or BY
—9.514.51.016.5CL = 50 pF
FROM
(Input)TO(Output)
FROM
(Input)TO(Output)
• VCC = 5.0 ± 0.5 V
Ta = 25°CTa = –40 to 85°C
ItemSymbolMinTypMaxMinMaxUnitTest Conditions
Propagation
delay
time
t
PLH
t
PHL
—4.86.81.08.0nsCL = 15 pFA or BY
—6.38.81.010.0CL = 50 pF
FROM
(Input)TO(Output)
6
Page 7
Operating Characteristics
• CL = 50 pF
ItemSymbolV
Power
C
PD
dissipation
capacitance
(V)MinTypMaxUnitTest Conditions
CC
3.3—TBD—pFf = 10 MHz
5.0—TBD—
Noise Characteristics
• CL = 50 pF
ItemSymbolV
Quiet output,
V
OL (P)
maximum
dynamic V
Quiet output,
OL
V
OL (V)
minimum
dynamic V
Quiet output,
OL
V
OH (V)
minimum
dynamic V
High-level
OH
V
IH (D)
dynamic
input voltage
Low-level
V
IL (D)
dynamic
inout voltage
(V)MinTypMaxUnitTest Conditions
CC
3.3—TBD0.8V
3.3—TBD–0.8
3.3—TBD—
3.32.31——V
3.3——0.99
HD74LV86A
Ta = 25°C
Ta = 25°C
7
Page 8
HD74LV86A
Test Circuit
Measurement point
*
C
L
• Waveform – 1
Input
In phase output
Out of phase output
Notes:
1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, t ≤ 3 ns, t ≤ 3 ns
2. The output are measured one at a time with one transition per measurement.
Note: C includes the probe and jig capacitance.
10 %
L
t
r
50% V
90%
t
CC
PLH
90%
50% VCC
t
f
10%
50% VCC50% VCC
t
PHL
50% VCC50% VCC
rf
t
t
PHL
PLH
V
0 V
V
V
V
V
CC
OH
OL
OH
OL
8
Page 9
Package Dimensions
14
1
1.27
10.06
10.5 Max
1.42 Max
HD74LV86A
Unit: mm
8
5.5
7
+ 0.20
7.80
– 0.30
2.20 Max
0.22 ± 0.05
1.15
0.20 ± 0.04
0° – 8°
0.70 ± 0.20
0.42 ± 0.08
0.40 ± 0.06
Dimension including the plating thickness
Base material dimension
0.12
0.10 ± 0.10
0.15
M
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
FP-14DA
—
Conforms
0.23 g
9
Page 10
HD74LV86A
9.05 Max
14
Unit: mm
8.65
8
1
0.635 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
7
+ 0.11
0.25
3.95
– 0.04
0.14
0.15
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
+ 0.67
0.60
– 0.20
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
(reference value)
FP-14DN
Conforms
Conforms
0.13 g
10
Page 11
5.30 Max
148
17
+0.08
0.22
–0.07
0.20 ± 0.06
5.00
0.83 Max
0.65
0.13
HD74LV86A
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
Dimension including the plating thickness
Base material dimension
0.17 ± 0.05
0.15 ± 0.04
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
0.50 ± 0.10
TTP-14D
—
—
0.05 g
11
Page 12
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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