The HD74LV165A is 8-bit serial shift register shifts data from QA to QH when clocked. Parallel inputs to
each stage are enabled by a low level at the Shift/Load input. Also included is a gated clock input and a
complementary output from the eighth bit.
Clocking is accomplished through a 2-input NOR gate permitting one input to be used as a clock inhibit
function. Holding either of the clock inputs high inhibits clocking, and high enables the other clock input.
Data transfer occurs on the positive going edge of the clock. Parallel loading is inhibited as long as the
Shift/Load input is high. When taken low, data at the parallel inputs is loaded directly into the register
independent of the state of the clock.
Low-voltage and high-speed operation is suitable for the battery-powered products (e.g., notebook
computers), and the low-power consumption extends the battery life.
Features
• VCC = 2.0 V to 5.5 V operation
• All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V)
• All outputs VO (Max.) = 5.5 V (@VCC = 0 V)
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25°C)
• Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V)
1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, t ≤ 3 ns, t ≤ 3 ns
Notes:
2. The output are measured one at a time with one transition per measurement.
50% V
CC
rf
GND
V
CC
GND
13
Page 14
HD74LV165A
Package Dimensions
16
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
0.42 ± 0.08
± 0.06
0.40
Dimension including the plating thickness
Base material dimension
8
0.12
2.20 Max
0.10 ± 0.10
0.15
M
7.80
0.22 ± 0.05
0.20 ± 0.04
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.20
– 0.30
1.15
0
° – 8°
FP-16DA
—
Conforms
0.24 g
14
Page 15
16
HD74LV165A
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
0.60
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
+ 0.67
– 0.20
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
15
Page 16
HD74LV165A
0.22
0.20 ± 0.06
5.0
5.3 Max
169
4.40
18
0.65
+ 0.08
– 0.07
0.13
0.65 Max
1.0
M
6.40 ± 0.20
0.10
1.10 Max
Dimension including the plating thickness
Base material dimension
0.17 ± 0.05
0.15 ± 0.04
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
0.50 ± 0.10
TTP-16DA
—
—
0.05 g
16
Page 17
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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