Page 1
HD74HCT373/HD74HCT533
Octal D-type Transparent Latches (with 3-state outputs)/
Octal D-type Transparent Latches (with inverted 3-state outputs)
Description
When the latch enable input is high, the Q outputs of HD74HCT373 will follow the D inputs and the Q
outputs of HD74HCT533 will follow the inversion of the D inputs. When the latch enable goes low, data at
the D inputs will be retained at the outputs until latch enable returns high again. When a high logic level is
applied to the output control input, all outputs go to a high impedance state, regardless of what signals
present at the other inputs and the state of the storage elements.
Features
• LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility
• High Speed Operation: tpd (Data to Q) = 14 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 4.5 to 5.5 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Enable
Output Control
LH H H L
LH L L H
L L X No change No change
HX X Z Z
X : Irrelevant
Z : Off (high-impedance) state of a 3-state output.
GD
HD74HCT373
Q
HD74HCT533
Q
Page 2
HD74HCT373/HD74HCT533
Pin Arrangement
HD74HCT373
HD74HCT533
Output
Control
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
Output
Control
10
V
1
2
3
4
5
6
7
8
9
(Top view)
1
20
19
18
17
16
15
14
13
12
11
20
CC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
Enable G
V
CC
1Q
2
1D
3
2D
4
2Q
5
3Q
6
3D
7
4D
8
4Q
9
GND
10
(Top view)
2
19
18
17
16
15
14
13
12
11
8Q
8D
7D
7Q
6Q
6D
5D
5Q
Enable G
Page 3
Block Diagram
HD74HCT373
HD74HCT373/HD74HCT533
Enable G
Output
Control
HD74HCT533
Enable G
1D
1D
2D 3D 4D 5D 6D 7D 8D
D
G
D
G
D
Q
G
1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q
2D 3D 4D 5D 6D 7D 8D
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
G
D
Q
Q
Q
G
D
Q
G
D
Q
G
D
Q
G
Output
Control
1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q
3
Page 4
HD74HCT373/HD74HCT533
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V
Input voltage V
Output voltage V
DC current drain per pin I
DC current drain per VCC, GND ICC, I
DC input diode current I
DC output diode current I
Power dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol Min Typ Max Min Max Unit V
Input voltage V
Output voltage V
IH
V
IL
OH
2.0 — — 2.0 — V 4.5 to
— — 0.8 — 0.8 V 4.5 to
4.4 — — 4.4 — V 4.5 Vin = VIH or VILIOH = –20 µA
4.18 — — 4.13 — 4.5 IOH = –6 mA
V
OL
— — 0.1 — 0.1 V 4.5 Vin = VIH or VILIOL = 20 µA
— — 0.26 — 0.33 4.5 IOL = 6 mA
Off-state output
I
OZ
——±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL,
current
Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND
Quiescent current I
CC
— — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA
+85°C Test Conditions
–0.5 to +7.0 V
–0.5 to VCC + 0.5 V
–0.5 to VCC + 0.5 V
±35 mA
±75 mA
±20 mA
±20 mA
500 mW
(V)
CC
5.5
5.5
Vout = V
or GND
CC
4
Page 5
HD74HCT373/HD74HCT533
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol Min Typ Max Min Max Unit V
Propagation delay t
time t
Output enable t
time t
Output disable t
time t
Setup time t
Hold time t
Pulse width t
Output rise/fall
time
PLH
PHL
t
PLH
t
PHL
ZL
ZH
LZ
HZ
su
h
w
t
TLH
t
THL
— 13 30 — 38 ns 4.5 Latch control to Q
— 16 30 — 38 4.5
— 14 25 — 31 ns 4.5 Data to Q
— 12 25 — 31 4.5
— 16 30 — 38 ns 4.5
— 15 30 — 38 4.5
— 14 30 — 38 ns 4.5
— 16 30 — 38 4.5
20 — — 25 — ns 4.5 Data to latch control
10 — — 13 — ns 4.5 Latch control to data
16 — — 20 — ns 4.5 Latch control, output control
— 4 12 — 15 ns 4.5
Input capacitance Cin — 5 10 — 10 pF —
+85°C Test Conditions
(V)
CC
5
Page 6
24.50
25.40 Max
Unit: mm
1120
6.30
1
0.89
1.27 Max
2.54 ± 0.25
1.30
10
0.48 ± 0.10
7.00 Max
0.51 Min
2.54 Min 5.08 Max
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.11
0.25
– 0.05
0° – 15°
(reference value)
DP-20N
—
Conforms
1.26 g
Page 7
20
Unit: mm
12.6
13 Max
11
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.20
– 0.30
1.15
0° – 8°
FP-20DA
—
Conforms
0.31 g
Page 8
20
Unit: mm
12.8
13.2 Max
11
7.50
1
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.20 ± 0.10
0.15
M
2.65 Max
10.40
0.25 ± 0.04
*0.27 ± 0.05
0.70
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.25
– 0.40
1.45
+ 0.57
– 0.30
(reference value)
0° – 8°
FP-20DB
Conforms
—
0.52 g
Page 9
20 11
110
+0.08
*0.22
–0.07
0.20 ± 0.06
6.50
6.80 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-20DA
—
—
0.07 g
Page 10
Cautions
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copyright, trademark, or other intellectual property rights for information contained in this document.
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intellectual property rights, in connection with use of the information contained in this document.
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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