Datasheet HD74HCT245 Datasheet (HIT)

Page 1
HD74HCT245
Octal Bus Transceivers (with 3-state outputs)
Description
This device has an active low enable input G and a direction control input (DIR). When DIR is high, data flows from the A inputs to the B outputs. When DIR is low, data flows from the B inputs to the A outputs. The HD74HCT245 transfers true data from one bus to the other.
This device does not have schmitt trigger inputs.
Features
• High Speed Operation: tpd (A to Y) = 12 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 4.5 to 5.5 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Enable G Direction Control DIR Operation
L L B data to A bus L H A data to B bus H X Isolation
H : High level L : Low level X : Irrelevant
Page 2
HD74HCT245
Pin Arrangement
DIR
A
1 2
1
20 19
V
CC
Enable G A2 A3 A4 A5 A6 A7 A8
GND
3 4 5 6 7 8 9
10
18 17 16 15 14 13 12 11
B
B2
B3
B4
B5
B6
B7
B8
1
(Top view)
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V Input voltage V Output voltage V DC current drain per pin I DC current drain per VCC, GND ICC, I DC input diode current I DC output diode current I Power dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
–0.5 to +7.0 V –0.5 to VCC + 0.5 V –0.5 to VCC + 0.5 V
±35 mA ±75 mA ±20 mA ±20 mA
500 mW
2
Page 3
HD74HCT245
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol Min Typ Max Min Max Unit V
Input voltage V
Output voltage V
IH
V
IL
OH
2.0 — — 2.0 — V 4.5 to
— — 0.8 — 0.8 V 4.5 to
4.4 — — 4.4 — V 4.5 Vin = VIH or VILIOH = –20 µA
4.18 — — 4.13 — 4.5 IOH = –6 mA
V
OL
— — 0.1 — 0.1 V 4.5 Vin = VIH or VILIOL = 20 µA — — 0.26 — 0.33 4.5 IOL = 6 mA
Off-state output
I
OZ
——±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL,
current Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND Quiescent current I
CC
— — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA
+85°C Test Conditions
(V)
CC
5.5
5.5
Vout = V
or GND
CC
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol Min Typ Max Min Max Unit V
Propagation delay t time t Output enable t time t Output disable t time t Output rise/fall
time
PLH
PHL
ZL
ZH
LZ
HZ
t
TLH
t
THL
— 11 22 — 28 ns 4.5 — 13 22 — 28 4.5 — 17 30 — 38 ns 4.5 — 14 30 — 38 4.5 — 20 30 — 38 ns 4.5 — 22 30 — 38 4.5 — 4 12 — 15 ns 4.5
Input capacitance Cin — 5 10 — 10 pF —
+85°C Test Conditions
(V)
CC
3
Page 4
24.50
25.40 Max
Unit: mm
1120
6.30
1
0.89
1.27 Max
2.54 ± 0.25
1.30
10
0.48 ± 0.10
7.00 Max
0.51 Min
2.54 Min 5.08 Max
Hitachi Code JEDEC EIAJ Weight
7.62
+ 0.11
0.25
– 0.05
0° – 15°
(reference value)
DP-20N — Conforms
1.26 g
Page 5
20
Unit: mm
12.6
13 Max
11
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code JEDEC EIAJ Weight
(reference value)
+ 0.20 – 0.30
1.15
0° – 8°
FP-20DA — Conforms
0.31 g
Page 6
20
Unit: mm
12.8
13.2 Max 11
7.50
1
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.20 ± 0.10
0.15
M
2.65 Max
10.40
0.25 ± 0.04
*0.27 ± 0.05
0.70
Hitachi Code JEDEC EIAJ Weight
(reference value)
+ 0.25 – 0.40
1.45
+ 0.57 – 0.30
0° – 8°
FP-20DB Conforms —
0.52 g
Page 7
20 11
110
+0.08
*0.22
–0.07
0.20 ± 0.06
6.50
6.80 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code JEDEC EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-20DA — —
0.07 g
Page 8
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Loading...