Page 1
HD74HC73
Dual J-K Flip-Flops (with Clear)
Description
The flip-flop is edge sensitive to the clock input and change state on the negative going transition of the
clock pulse. Each flip-flop has independent, J, K, clock, and clear inputs and Q and Q outputs. Clear is
independent of the clock and accomplished by a low level on the input.
Features
• High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 2 µA max (Ta = 25°C)
Function Table
Inputs Outputs
Clear Clock J K Q Q
LX X X L H
H L L No change
H LHLH
H HL HL
H H H Toggle
H L X X No change
H H X X No change
H X X No change
Page 2
HD74HC73
Pin Arrangement
Block Diagram
CLR
J
K
1CK
1CLR
1K
V
CC
2CK
2CLR
2J
14
13
12
11
10
1J
1Q
1Q
GND
2K
9
2Q
8
2Q
Q
Q
CK
1
2
3
4
5
6
7
CK
CK
CLR
J
CK
K
K
CK
J
CLR
(Top view)
CK
Q
Q
Q
Q
CK
CK
CK
CK
CK
2
CK
CK
Page 3
HD74HC73
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –4 mA
6.0 5.68 — — 5.63 — IOH = –5.2 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 4 mA
6.0 — — 0.26 — 0.33 IOL = 5.2 mA
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 2.0 — 20 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
3
Page 4
HD74HC73
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Maximum clock f
max
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 6 — 5 MHz
frequency 4.5 — — 30 — 24
6.0 — — 35 — 28
Propagation delay t
time t
PLH
PHL
2.0 — — 150 — 190 ns Clock to Q or Q
4.5 — 18 30 — 38
6.0 — — 26 — 33
2.0 — — 140 — 175 Clear to Q or Q
4.5 — 18 28 — 35
6.0 — — 24 — 30
Pulse width t
w
2.0 80 — — 100 — ns Clock, Clear
4.5 16 8 — 20 —
6.0 14 — — 17 —
Setup time t
su
2.0 100 — — 125 — ns Data to clock
4.5 20 3 — 25 —
6.0 17 — — 21 —
Hold time t
h
2.0 5 — — 5 — ns Clock to data
4.5 5 –2 — 5 —
6.0 5 — — 5 —
Removal time t
rem
2.0 100 — — 125 — ns Clear to clock
4.5 20 –3 — 25 —
6.0 17 — — 21 —
Output rise/fall t
time t
TLH
THL
2.0 — — 75 — 95 ns
4.5 — 5 15 — 19
6.0 — — 13 — 16
Input capacitance Cin — — 5 10 — 10 pF
+85°C
4
Page 5
1
19.20
20.32 Max
1.30
Unit: mm
814
6.30
7.40 Max
7
2.54 ± 0.25
2.39 Max
0.48 ± 0.10
2.54 Min 5.06 Max
0.51 Min
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.10
0.25
– 0.05
0° – 15°
(reference value)
DP-14
Conforms
Conforms
0.97 g
Page 6
14
1.27
10.5 Max
1
1.42 Max
10.06
Unit: mm
8
5.5
7
+ 0.20
7.80
– 0.30
2.20 Max
*0.22 ± 0.05
1.15
0.20 ± 0.04
0° – 8°
0.70 ± 0.20
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
0.12
0.10 ± 0.10
0.15
M
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
FP-14DA
—
Conforms
0.23 g
Page 7
9.05 Max
14
Unit: mm
8.65
8
*Pd plating
1
0.635 Max
1.27
*0.40 ± 0.06
7
+ 0.11
– 0.04
0.14
0.25
3.95
1.75 Max
0.15
M
6.10
1.08
*0.20 ± 0.05
+ 0.67
0.60
– 0.20
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
(reference value)
FP-14DN
Conforms
Conforms
0.13 g
Page 8
5.30 Max
14 8
17
+0.08
*0.22
–0.07
0.20 ± 0.06
5.00
0.83 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-14D
—
—
0.05 g
Page 9
Cautions
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Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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