Page 1
HD74HC670
4-by-4 Register File (with 3-state outputs)
Description
The HD74HC670, 16-bit register file is organized as 4 words of 4 bits each and separate on-chip decoding
is provided for addressing the four word locations to either write-in or retrieve data.
This permits simultaneous writing into one location and reading from another word location. Four data
inputs are available which are used to supply the 4-bit word to be stored. Location of the word is
determined by the write-address inputs A and B in conjunction with a write-enable signal. Data applied at
the inputs should be in its true form. That is, if a high-level signal is desired from the output, a high-level is
applied at the data input for that particular bit location. The latch inputs are arranged so that new data will
be accepted only if both internal address gate inputs are high. When this condition exists, data at the D
input is transferred to the latch output. When the write-enable input, (GW) is high, the data inputs are
inhibited and their levels can cuase no change in the information stored in the internal latches. When the
read-enable input, (GR) is high, the data outputs are inhibited and go into the high-impedance state. The
individual address lines permit direct acquisition of data stored in any four of the latches. Four individual
decoding gates are used to complete the address for reading a word. when the read address is made in
conjunction with the read-enable signal, the word appears at the four outputs.
Features
• High Speed Operation: tpd (Read Select to Q) = 21 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
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HD74HC670
Function Table
Write Inputs Word
W
B
W
A
L L L Q = D Q
LH L Q
HL L Q
HH L Q
XX H Q
Read Inputs Outputs
R
B
R
A
LL L W
LH L W
HL L W
HH L W
XXHZZZZ
H : high level
L : low level
X : irrelevant
Z : high impedance (off)
(Q = D) : The four selected internal flip-flop outputs will assume the states applied to the four external data
inputs.
Q
: The level of Q before the indicated input conditions were established.
0
W
: The first bit of word 0, etc.
0 B1
G
W
G
R
0123
0
0
0
0
Q
1
0 B1
1 B1
2 B1
3 B1
0
Q = D Q
Q
0
Q
0
Q
0
Q
2
W0 B
2
W1 B
2
W2 B
2
W3 B
2
Q
0
0
Q = D Q
Q
0
Q
0
Q
3
W0 B
3
W1 B
3
W2 B
3
W3 B
3
Q
0
Q
0
0
Q = D
Q
0
Q
4
W0 B
4
W1 B
4
W2 B
4
W3 B
4
2
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Pin Arrangement
HD74HC670
V
1
D
2
16
CC
Logic Diagram
Data
Read
select
Outputs
D
D
R
R
Q
Q
GND
D
2
3
3
4
4
B
5
A
D
D
R
R
2
D
W
W
C
1
A
B
W
3
4
B
A
15
14
13
12
Data
D
1
W
A
W
B
Write
Write
select
Enable
Read
6
4
7
3
Q
4
Q
3
C
Q
Q
2
8
11
R
Q
10
1
1
Outputs
Q
9
2
(Top view)
To other three bits
Data
D
G
D
G
D
G
D
G
W
A
W
B
G
W
Q
Q
Q
Q
V
CC
Q
R
A
G
R
R
B
3
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HD74HC670
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –6 mA
6.0 5.68 — — 5.63 — IOH = –7.8 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 6 mA
6.0 — — 0.26 — 0.33 IOL = 7.8 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIN or VIL,
current
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
4
Page 5
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Item Symbol V
Propagation delay t
time t
Output enable t
time t
Output disable t
time t
Pulse width t
Setup time t
Hold time t
PLH
PHL
t
PLH
t
PHL
t
PLH
t
PHL
ZH
ZL
HZ
LZ
w
su
t
su
h
Ta = 25°C
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 160 — 200 ns Read select to Q
4.5 — 21 32 — 40
6.0 — — 27 — 34
2.0 — — 200 — 250 ns Write enable to Q
4.5 — 24 40 — 50
6.0 — — 34 — 43
2.0 — — 150 — 190 ns Data to Q
4.5 — 18 30 — 38
6.0 — — 26 — 33
2.0 — — 150 — 190 ns
4.5 — 18 30 — 38
6.0 — — 26 — 33
2.0 — — 150 — 190 ns
4.5 — 17 30 — 38
6.0 — — 26 — 33
2.0 80 — — 100 — ns
4.5 16 — — 20 —
6.0 14 — — 17 —
2.0 60 — — 75 — ns Data to Write enable
4.5 12 4 — 15 —
6.0 10 — — 13 —
2.0 60 — — 75 — ns Write select to Write enable
4.5 12 — — 15 —
6.0 10 — — 13 —
2.0 50 — — 63 — ns Write enable to Data
4.5 10 6 — 13 —
6.0 9 — — 11 —
2.0 50 — — 63 — ns Write enable to Write select
4.5 10 — — 13 —
6.0 9 — — 11 —
+85°C
HD74HC670
5
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HD74HC670
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) (cont)
Ta = –40 to
Ta = 25°C
Item Symbol V
Latch time for new t
latch
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.5 100 — — 125 — ns
data 4.5 20 — — 25 —
6.0 17 — — 21 —
Output rise/fall t
time t
TLH
THL
2.0 — — 75 — 95 ns
4.5 — 5 15 — 19
6.0 — — 13 — 16
Input capacitance Cin — — 5 10 — 10 pF
+85°C
6
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19.20
20.00 Max
16 9
1.3
Unit: mm
6.30
7.40 Max
81
1.11 Max
2.54 ± 0.25
0.48 ± 0.10
5.06 Max
2.54 Min
0.51 Min
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.13
0.25
– 0.05
0° – 15°
(reference value)
DP-16
Conforms
Conforms
1.07 g
Page 8
16
Unit: mm
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
+ 0.20
– 0.30
1.15
0° – 8°
FP-16DA
—
Conforms
0.24 g
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16
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
0.60
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
+ 0.67
– 0.20
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Page 10
Cautions
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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products.
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