Page 1
HD74HC651/HD74HC652
Octal Bus Transceivers/Registers (with inverted 3-state outputs)
Octal Bus Transceivers/Registers (with 3-state outputs)
Description
This device consists of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for
multiplexed transmission of data directly from the data bus or from the internal storage registers. Enable
GAB and GBA are provided to cotrol the transceiver functions. Select AB and Select BA control pins are
provided to select whether real-time or stored data is transferred. A low input level selects real-time data,
and a high selects stored data. The following examples demonstrate the four fundamental bus-management
functions that can be performed with the HD74HC651 and HD74HC652.
Data on the A or B data bus, or both, can be stored in the internal D flip-flops by low-to high transition at
the appropriate clock pins (Clock AB or Clock BA) regardless of the select or enable control pins. When
Select AB and Select BA are in the real-time transfer mode, it is also possible to store data without using
the internal D-type flip-flops by simultaneously enabling Enable GAB and GBA. In this configuration
each output reinforces its input. Thus, when all other data sources to the two sets of bus lines are at high
impedance, each set of bus lines will remain at its last state.
Features
• High Speed Operation: tpd (Bus to Bus) = 16 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
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HD74HC651/HD74HC652
Function Table
Real-Time Transfer
Bus B to Bus A
Clock AB X X L or H
Select AB X L X H
Enable GAB L H L H
Clock BA X X L or H
Select BA L X X H
Enable GBA L H H L
Bus A
Real-Time Transfer
Bus A to Bus B Storage
Bus B
Bus A
Transfer Stored
Data to A and/or B
Bus B
Real-time transfer
Bus B to Bus A
Real-time transfer
Bus A to Bus B
2
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HD74HC651/HD74HC652
(
)
Bus A
Pin Arrangement
Storage
Clock AB
Select AB
Enable GAB
A
A
Bus A
Bus B
Bus B
Transfer stored data
to A and/or B
1
2
3
4
1
5
2
V
24
Clock BA
23
Select BA
22
Enable GBA
21
B
20
CC
1
A
A
A
A
A
A
GND
6
3
7
4
8
5
9
6
10
7
11
8
12
19
18
17
16
15
14
13
B
2
B
3
B
4
B
5
B
6
B
7
B
8
Top view
3
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HD74HC651/HD74HC652
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V
Input voltage V
Output voltage V
Output current I
DC current drain per VCC , GND ICC, I
DC input diode current I
DC output diode current I
Power Dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
Logic Diagram
HD74HC651
–0.5 to +7.0 V
–0.5 to VCC + 0.5 V
–0.5 to VCC + 0.5 V
±35 mA
±75 mA
±20 mA
±20 mA
500 mW
x 7
V
CC
Q
CAB
A
Q
CAB
D
CAB
CAB
CAB
SBA
GBA
D
V
CC
B
CBA
SAB
GAB
4
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HD74HC652
A
HD74HC651/HD74HC652
x 7
V
CC
Q
CAB
CAB
Q
CAB
D
CAB
D
V
CC
B
CAB
SBA
GBA
CBA
SAB
GAB
5
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HD74HC651/HD74HC652
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –6 mA
6.0 5.68 — — 5.63 — IOH = –7.8 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 6 mA
6.0 — — 0.26 — 0.33 IOL = 7.8 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,
current
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
6
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HD74HC651/HD74HC652
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Propagation delay t
time t
PLH
PHL
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 170 — 215 ns Clock to Bus
4.5 — 19 34 — 43
6.0 — — 29 — 37
2.0 — — 135 — 170 ns Bus to Bus
4.5 — 16 27 — 34
6.0 — — 23 — 29
2.0 — — 190 — 240 ns Select to Bus
4.5 — 18 38 — 48
6.0 — — 32 — 41
Output enable t
time t
ZL
ZH
2.0 — — 150 — 190 ns
4.5 — 14 30 — 38
6.0 — — 26 — 33
Output disable t
time t
LZ
HZ
2.0 — — 150 — 190 ns
4.5 — 18 30 — 38
6.0 — — 26 — 33
Pulse width t
w
2.0 80 — — 100 — ns
4.5 16 7 — 20 —
6.0 14 — — 17 —
Setup time t
su
2.0 100 — — 125 — ns
4.5 20 4 — 25 —
6.0 17 — — 21 —
Hold time t
h
2.0 5 — — 5 — ns
4.5 5 –1 — 5 —
6.0 5 — — 5 —
Output rise/fall t
time t
TLH
THL
2.0 — — 60 — 75 ns
4.5 — 4 12 — 15
6.0 — — 10 — 13
Input capacitance Cin — — 5 10 — 10 pF
+85°C
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31.6
24 13
32.5 Max
13.4
15.0 Max
Unit: mm
112
1.2
15.24
2.13 Max
+ 0.11
0.25
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.54 Min 5.70 Max
– 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
DP-24
Conforms
Conforms
3.1 g
Page 9
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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