Datasheet HD74HC648, HD74HC646 Datasheet (HIT)

Page 1
HD74HC646/HD74HC648
Octal Bus Transceivers/Registers with Multiplexed 3-state outputs
Description
Six control inputs enable this device to be used as a latched transceiver, unlatched transceiver or a combination of both. As a latched transceiver, data from one bus is stored for later retrieval by the other bus. Alternately real time bus data (unlatched) may be directly transferred from one bus to another.
Circuit operation is determined by the Control G, Direction, Clock AB, Clock BA, Select AB, Select BA control inputs. The enable input, Contorl G, controls whether any bus outputs are enabled. The direction control Direction (DIR), determines which bus is enabled, and hence the direction data flows: The Select AB, Select BA inputs cotrol whether the latched data (stored in D type flip-flops), or the bus data (from other bus input pins) is transferred. Each set of flip-flops has its own clock Clock AB and Clock BA, for storing data. Data is latched on the rising edge of the clock.
Features
• High Speed Operation: tpd (Bus to Bus) = 14 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Page 2
HD74HC646/HD74HC648
Function Table
Inputs Control Clock Select Data I/O Data I/O Operation or Function G Direction BA AB AB BA A1 thru A8 B1 thru B8 HD74HC646 HD74HC648
H X X X X X Z (Input) Z (Input) Isolation Isolation HX H H Z (Input) Z (Input) Store A & B data Store A & B data L L X X X L Output Z (Input) B real-time data to
A bus
L L H H X H Output Z (Input) B stored data to A
bus
L L LLXHOutput Z (Input) B stored data to A
bus
L H X X L X Z (Input) Output A real-time data to
B bus
L H H H H X Z (Input) Output A stored data to B
bus
L H L L H X Z (Input) Output A stored data to B
bus
B real-time data to A bus
B stored data to A bus
B stored data to A bus
A real-time data to B bus
A stored data to B bus
A stored data to B bus
Bus A
Bus B
Real-time transfer Bus B to Bus A
2
Bus A
Real-time transfer Bus A to Bus B
Bus B
Page 3
HD74HC646/HD74HC648
Bus A
Pin Arrangement
Storage from A, B, or A and B
Clock AR
Select AB
Direciton
A
1
A
2
Bus B
Bus A
Bus B
Transfer stored data to A or B
1 2 3 4 5
24 23 22 21 20
V
CC
Clock BA Select BA Control G B
1
A A A A A A
GND
6
3
7
4
8
5
9
6
10
7
11
8
12
19 18 17 16 15 14 13
B
2
B
3
B
4
B
5
B
6
B
7
B
8
(Top view)
3
Page 4
HD74HC646/HD74HC648
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V Input voltage V Output voltage V Output current I DC current drain per VCC , GND ICC, I DC input diode current I DC output diode current I Power Dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
Logic Diagram
HD74HC646
–0.5 to +7.0 V –0.5 to VCC + 0.5 V –0.5 to VCC + 0.5 V
±35 mA ±75 mA ±20 mA ±20 mA
500 mW
x 7
V
CC
Q
CBA
A
1
Q
CAB
CAB
D
CBA
D
V
CC
B
1
CBACAB
SAB
DIR
SBA
G
4
Page 5
HD74HC648
A
1
SAB SBA
HD74HC646/HD74HC648
x 7
V
CC
Q
CBA
CBA
Q
CAB
CAB
D
D
V
CC
B
1
CBACAB DIR
G
5
Page 6
HD74HC646/HD74HC648
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –6 mA
6.0 5.68 — — 5.63 — IOH = –7.8 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 6 mA
6.0 — — 0.26 — 0.33 IOL = 7.8 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,
current Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
6
Page 7
HD74HC646/HD74HC648
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Maximum clock f
max
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 5 — 4 ns Clock AB to B or
frequency 4.5 — — 27 — 21 Clock BA to A
6.0 — — 32 — 25 Propagation delay t time t
PLH
PHL
2.0 — — 170 — 215 ns A or B input to B or A output
4.5 — 14 34 — 43 (HD74HC646 only)
6.0 — — 29 — 37
t
PLH
t
PHL
2.0 — — 150 — 190 ns A or B input to B or A output
4.5 — 14 30 — 38 (HD74HC648 only)
6.0 — — 26 — 33
t
PLH
t
PHL
2.0 — — 220 — 275 ns Clock BA or Clock AB input to
4.5 — 18 44 — 55 A or B output
6.0 — — 37 — 47
t
PLH
t
PHL
2.0 — — 170 — 215 ns Select BA or Select AB input to
4.5 — 15 34 — 43 A or B output, with A or B high
6.0 — — 29 — 37
t
PLH
t
PHL
2.0 — — 170 — 215 ns Select BA or Select AB input to
4.5 — 16 34 — 43 A or B output, with A or B low
6.0 — — 29 — 37 Output enable t time t
ZH
ZL
2.0 — — 150 — 190 ns Control G input or Direction to
4.5 — 17 30 — 38 A or B output
6.0 — — 26 — 33 Output disable t time t
LZ
HZ
2.0 — — 150 — 190 ns Control G input to A or B
4.5 — 20 30 — 38 output
6.0 — — 26 — 33 Setup time t
su
2.0 100 — — 125 — ns
4.5 20 3 — 25 —
6.0 17 — — 21 — Hold time t
h
2.0 5 — — 5 — ns
4.5 5 0 — 5 —
6.0 5 — — 5 —
+85°C
7
Page 8
HD74HC646/HD74HC648
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) (cont)
Ta = –40 to
Ta = 25°C
Item Symbol V
Pulse width t
w
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 80 — — 100 — ns
4.5 16 5 — 20 —
6.0 14 — — 17 — Output rise/fall t time t
TLH
THL
2.0 — — 60 — 75 ns
4.5 — 4 12 — 15
6.0 — — 10 — 13 Input capacitance Cin — — 5 10 — 10 pF
+85°C
8
Page 9
31.6
24 13
32.5 Max
13.4
15.0 Max
Unit: mm
112
1.2
15.24
2.13 Max
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
2.54 Min 5.70 Max
0.25
0° – 15°
Hitachi Code JEDEC EIAJ
(reference value)
Weight
DP-24 Conforms Conforms
3.1 g
+ 0.11 – 0.05
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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