Datasheet HD74HC623, HD74HC620 Datasheet (HIT)

Page 1

HD74HC620/HD74HC623

Octal Bus Transceivers (with inverted 3-state outputs)

Octal Bus Transceivers (with 3-state outputs)

Description

This octal bus transceiver is designed for asynchronous two-way communication between data buses. The control fuction implementation allows for maximum flexibility in timing.

This device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic levels at the enable inputs (GBA and GAB).

The enable inputs can be used to disable the device so that the buses are effectively isolated.

The dual-enable configuration gives these devices the capability to store data by simultaneous enabling of GBA and GAB. Each output reinforces its input in this transceiver configuration. Thus, when both control inputs are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (16 in all) will remain at their last states. The 8-bit codes appearing on the two sets of buses will be identical for the HD74HC623 or coplementary for the HD74HC620.

Features

• High Speed Operation: tpd (Bus to Bus) = 12 ns typ (CL = 50 pF)

• High Output Current: Fanout of 15 LSTTL Loads

• Wide Operating Voltage: VCC = 2 to 6 V

• Low Input Current: 1 µA max

• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)

Function Table

Enable Inputs Operation GBA GAB HD74HC620 HD74HC623

LLB data to A bus B data to A bus HHA data to B bus A data to B bus H L Isolation Isolation LHB data to A bus, A data to B bus B data to A bus, A data to B bus

Page 2

HD74HC620/HD74HC623

Pin Arrangement

Enable GAB V

GND

Absolute Maximum Ratings

10 11

(Top view)

Enable GBA

Item Symbol Rating Unit

Supply voltage range V Input voltage V Output voltage V Output current I

OUT

DC current drain per VCC GND ICC, I DC input diode current I DC output diode current I Power Dissipation per package P

GND

–0.5 to +7.0 V –0.5 to VCC + 0.5 V –0.5 to VCC + 0.5 V

±35 mA ±75 mA ±20 mA ±20 mA

500 mW

Storage temperature Tstg –65 to +150 °C

Page 3

Block Diagram

HD74HC620

GBA

GAB

HD74HC620/HD74HC623

VCC

B8A8

Page 4

HD74HC620/HD74HC623

HD74HC623

GBA

GAB

VCC

B8A8

Page 5

HD74HC620/HD74HC623

DC Characteristics

Ta = –40 to

Ta = 25°C

Item Symbol V

Input voltage V

(V) Min Typ Max Min Max Unit Test Conditions

2.0 1.5 — — 1.5 — V

4.5 3.15 — — 3.15 —

6.0 4.2 — — 4.2 —

2.0 — — 0.5 — 0.5 V

4.5 — — 1.35 — 1.35

6.0 — — 1.8 — 1.8

Output voltage V

2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA

4.5 4.4 4.5 — 4.4 —

6.0 5.9 6.0 — 5.9 —

4.5 4.18 — — 4.13 — IOH = –6 mA

6.0 5.68 — — 5.63 — IOH = –7.8 mA

2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA

4.5 — 0.0 0.1 — 0.1

6.0 — 0.0 0.1 — 0.1

4.5 — — 0.26 — 0.33 IOL = 6 mA

6.0 — — 0.26 — 0.33 IOL = 7.8 mA

Off-state output

6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,

current Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND Quiescent supply

6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA

current

+85°C

Vout = V

or GND

Page 6

HD74HC620/HD74HC623

AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)

Ta = –40 to

Ta = 25°C

Item Symbol V

Propagation delay t time t

PLH

PHL

(V) Min Typ Max Min Max Unit Test Conditions

2.0 — — 100 — 125 ns

4.5 — 12 20 — 25

6.0 — — 17 — 21 Output enable t time t

2.0 — — 150 — 190 ns

4.5 — 12 30 — 38

6.0 — — 26 — 33 Output disable t time t

2.0 — — 150 — 190 ns

4.5 — 16 30 — 38

6.0 — — 26 — 33 Output rise/fall t time t

TLH

THL

2.0 — — 60 — 75 ns

4.5 — 4 12 — 15

6.0 — — 10 — 13 Input capacitance Cin — — 5 10 — 10 pF

+85°C

Page 7

24.50

25.40 Max

Unit: mm

1120

6.30

0.89

1.27 Max

2.54 ± 0.25

1.30

0.48 ± 0.10

7.00 Max

0.51 Min

2.54 Min 5.08 Max

Hitachi Code JEDEC EIAJ Weight

7.62

+ 0.11

0.25

– 0.05

0° – 15°

(reference value)

DP-20N — Conforms

1.26 g

Page 8

Unit: mm

12.6

13 Max

5.5

0.80 Max

1.27

*0.42 ± 0.08

0.40 ± 0.06

*Dimension including the plating thickness

Base material dimension

0.12

0.10 ± 0.10

0.15

2.20 Max

7.80

0.20 ± 0.04

*0.22 ± 0.05

0.70 ± 0.20

Hitachi Code JEDEC EIAJ Weight

(reference value)

+ 0.20 – 0.30

1.15

0° – 8°

FP-20DA — Conforms

0.31 g

Page 9

Unit: mm

12.8

13.2 Max 11

7.50

0.935 Max

1.27

*0.42 ± 0.08

0.40 ± 0.06

*Dimension including the plating thickness

Base material dimension

0.12

0.20 ± 0.10

0.15

2.65 Max

10.40

0.25 ± 0.04

*0.27 ± 0.05

0.70

Hitachi Code JEDEC EIAJ Weight

(reference value)

+ 0.25 – 0.40

1.45

+ 0.57 – 0.30

0° – 8°

FP-20DB Conforms —

0.52 g

Page 10

Cautions

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2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.

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4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.

5. This product is not designed to be radiation resistant.

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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.

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