Page 1
HD74HC377
Octal D-type Flip-Flops (with Enable)
Description
Information at the D inputs meeting the setup time requirements is transferred to the Q outputs on the
positive-going edge of the clock pulse if the enable input G is low. Clock triggering occurs at a particular
voltage level and is not directly related to the transition time of the positive-going pulse. When the clock
input is at either the high or low level, the D input signal has no effect at the output. The circuits are
designed to prevent false clocking by transitions at the G input.
Features
• High Speed Operation: tpd = 13 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs Outputs
Enable G Clock Data Q Q
HX X Q
L HHL
L LLH
XLXQ
0
0
Q
0
Q
0
Page 2
HD74HC377
Pin Arrangement
Enable G
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
1
2
Q
G
CK
D
3
4
D
CK
G
Q
5
6
Q
G
CK
D
7
8
D
CK
G
Q
9
10 11
(Top view)
G
CK
CK
G
G
CK
CK
G
20
19
Q
D
18
17
D
Q
16
15
Q
D
14
13
D
Q
12
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
Clock
2
Page 3
HD74HC377
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –4 mA
6.0 5.68 — — 5.63 — IOH = –5.2 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 4 mA
6.0 — — 0.26 — 0.33 IOL = 5.2 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,
current
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
3
Page 4
HD74HC377
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Maximum clock f
max
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 6 — 5 MHz
frequency 4.5 — — 30 — 24
6.0 — — 35 — 28
Propagation delay t
time t
PLH
PHL
2.0 — — 140 — 175 ns
4.5 — 13 28 — 35
6.0 — — 24 — 30
Setup time t
su
2.0 100 — — 125 — ns
4.5 20 5 — 25 —
6.0 17 — — 21 —
Hold time t
h
2.0 5 — — 5 — ns
4.5 5 0 — 5 —
6.0 5 — — 5 —
Pulse width t
w
2.0 80 — — 100 — ns
4.5 16 — — 20 —
6.0 14 — — 17 —
Output rise/fall t
time t
TLH
THL
2.0 — — 75 — 95 ns
4.5 — 5 15 — 19
6.0 — — 13 — 16
Input capacitance Cin — — 5 10 — 10 pF
+85°C
4
Page 5
24.50
25.40 Max
Unit: mm
1120
6.30
1
0.89
1.27 Max
2.54 ± 0.25
1.30
10
0.48 ± 0.10
7.00 Max
0.51 Min
2.54 Min 5.08 Max
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.11
0.25
– 0.05
0° – 15°
(reference value)
DP-20N
—
Conforms
1.26 g
Page 6
20
Unit: mm
12.6
13 Max
11
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.20
– 0.30
1.15
0° – 8°
FP-20DA
—
Conforms
0.31 g
Page 7
20
Unit: mm
12.8
13.2 Max
11
7.50
1
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.20 ± 0.10
0.15
M
2.65 Max
10.40
0.25 ± 0.04
*0.27 ± 0.05
0.70
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.25
– 0.40
1.45
+ 0.57
– 0.30
0° – 8°
FP-20DB
Conforms
—
0.52 g
Page 8
20 11
110
+0.08
*0.22
–0.07
0.20 ± 0.06
6.50
6.80 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-20DA
—
—
0.07 g
Page 9
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Loading...