Page 1
HD74HC374/HD74HC534
Octal D-type Flip-Flops (with 3-state outputs)
Octal D-type Flip-flops (with inverted 3-state outputs)
Description
These devices are positive edge triggered flip-flops. The difference between HD74HC374 and
HD74HC534 is only that the former is a true outputs and the latter is a false outputs. Data at the D inputs,
meeting the setup and hold time requirements, are transferred to the Q outputs on positive going transitions
of the clock (CK) input. When a high logic level is applied to the output control (OC) input, all outputs go
to a high impedance state, regardless of what signals are present at the other inputs and the state of the
storage elements.
Features
• High Speed Operation: tpd (Clock to Q) = 18 ns typ (CL = 50 pF)
• High Output Current: Fanout of 15 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
HD74HC374
Output Control Clock D
L
L LLH
L L X No change No change
HX X Z Z
X : irrelevant
Z : off (high-impedance) state of a 3-state output.
HHL
Q
HD74HC534
Q
Page 2
HD74HC374/HD74HC534
Pin Arrangement
HD74HC374
HD74HC534
Out put
Control
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
Out put
Control
1Q
1
2
3
4
5
6
7
8
9
10 11
(Top view)
1
2
20
19
18
17
16
15
14
13
12
20
19
CC
V
8Q
8D
7D
7Q
6Q
6D
5D
5Q
Clock
CC
V
8Q
1D
3
2D
4
2Q
5
3Q
6
3D
7
4D
8
9
4Q
GND
10 11
(Top view)
2
18
17
16
15
14
13
12
8D
7D
7Q
6Q
6D
5D
5Q
Clock
Page 3
HD74HC374/HD74HC534
Absolute Maximum Ratings
Item Symbol Rating Unit
Supply voltage range V
Input voltage V
Output voltage V
DC current drain per pin I
DC current drain per VCC , GND ICC, I
DC input diode current I
DC output diode current I
Power Dissipation per package P
CC
IN
OUT
OUT
GND
IK
OK
T
Storage temperature Tstg –65 to +150 °C
Block Diagram
HD74HC374
–0.5 to +7.0 V
–0.5 to VCC + 0.5 V
–0.5 to VCC + 0.5 V
±35 mA
±75 mA
±20 mA
±20 mA
500 mW
Clock
Output
Control
1D
2D
DQQQQQQQQ
Q
1Q
3D
D
Q
2Q
4D
D
Q
3Q
5D
D
Q
4Q
6D
D
Q
5Q
7D
D
Q
6Q
8D
D
CCCCCCC
D
Q
Q
C
7Q
8Q
3
Page 4
HD74HC374/HD74HC534
HD74HC534
Clock
Output
Control
1D
2D
DQQQQQQQQ
Q
1Q
3D
D
Q
2Q
4D
D
Q
3Q
5D
D
Q
4Q
6D
D
Q
5Q
7D
D
Q
6Q
8D
D
CCCCCCC
D
Q
7Q
Q
C
8Q
4
Page 5
HD74HC374/HD74HC534
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –6 mA
6.0 5.68 — — 5.63 — IOH = –7.8 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 6 mA
6.0 — — 0.26 — 0.33 IOL = 7.8 mA
Off-state output
I
OZ
6.0 — — ±0.5 — ±5.0 µA Vin = VIH or VIL,
current
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
Vout = V
or GND
CC
5
Page 6
HD74HC374/HD74HC534
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Maximum clock f
max
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 6 — 5 MHz
frequency 4.5 — — 30 — 24
6.0 — — 35 — 28
Propagation delay t
time t
PHL
PLH
2.0 — — 140 — 175 ns
4.5 — 18 28 — 35
6.0 — — 24 — 30
Output enable t
ZL
2.0 — — 150 — 190 ns
time 4.5 — 11 30 — 38
6.0 — — 26 — 33
t
ZH
2.0 — — 150 — 190 ns
4.5 — 14 30 — 38
6.0 — — 26 — 33
Output disable t
LZ
2.0 — — 150 — 190 ns
time 4.5 — 13 30 — 38
6.0 — — 26 — 33
t
HZ
2.0 — — 150 — 190 ns
4.5 — 16 30 — 38
6.0 — — 26 — 33
Setup time t
su
2.0 100 — — 125 — ns Data to Clock
4.5 20 1 — 25 —
6.0 17 — — 21 —
Hold time t
h
2.0 25 — — 31 — ns Clock to Data
4.5 5 1 — 6 —
6.0 5 — — 6 —
Pulse width t
w
2.0 80 — — 100 — ns Clock or Output control
4.5 16 6 — 20 —
6.0 14 — — 17 —
Output rise/fall t
time t
TLH
THL
2.0 — — 60 — 75 ns
4.5 — 4 12 — 15
6.0 — — 10 — 13
Input capacitance Cin — — 5 10 — 10 pF
+85°C
6
Page 7
24.50
25.40 Max
Unit: mm
1120
6.30
1
0.89
1.27 Max
2.54 ± 0.25
1.30
10
0.48 ± 0.10
7.00 Max
0.51 Min
2.54 Min 5.08 Max
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.11
0.25
– 0.05
0° – 15°
(reference value)
DP-20N
—
Conforms
1.26 g
Page 8
20
Unit: mm
12.6
13 Max
11
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.20
– 0.30
1.15
0° – 8°
FP-20DA
—
Conforms
0.31 g
Page 9
20
Unit: mm
12.8
13.2 Max
11
7.50
1
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.20 ± 0.10
0.15
M
2.65 Max
10.40
0.25 ± 0.04
*0.27 ± 0.05
0.70
Hitachi Code
JEDEC
EIAJ
Weight
(reference value)
+ 0.25
– 0.40
1.45
+ 0.57
– 0.30
0° – 8°
FP-20DB
Conforms
—
0.52 g
Page 10
20 11
110
+0.08
*0.22
–0.07
0.20 ± 0.06
6.50
6.80 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-20DA
—
—
0.07 g
Page 11
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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5. This product is not designed to be radiation resistant.
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7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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