Page 1
HD74HC283
4-bit Binary Full Adder
Description
The sun ( ) outputs are provided for each bit and the resultant carry (C4) is obtained from the fourth bit.
This adder features full internal look ahead across all four bits. This provides the system designer with
partial look-ahead performance at the economy and reduced package count of a ripple-carry
implementation. The adder logic, including the carry, is implemented in its true for meaning that the endaround carry can be accomplished without the need for logic or level inversion.
Features
• High Speed Operation: tpd = 19 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Page 2
HD74HC283
Function Table
Outputs
Inputs When C
A1/A
B1/B
3
A2/A
3
B2/B
4
∑1/∑
4
LLLLLLLHLL
HLLLHLLLHL
LHLLHLLLHL
HHLL LHLHHL
LLHLLHLHHL
HL HL HHLL LH
L HHL HHLL LH
HHHLLL HHLH
LLLHLHLHHL
HLLHHHLLLH
LHLHHHLLLH
HHLHLLHHLH
LLHHLLHHLH
HL HHHL HL HH
L HHHHL HL HH
HHHHLHHHHH
H : high level
L : low level
Note: Input conditions at A
internal carry C
C
.
4
, B1, A2, B2, and C0 are used to determine outputs ∑1 and ∑2 and the value of the
1
. The values at C2, A3, B3, A4 and B4 are then used to determine outputs ∑3, ∑4 and
2
= L/When C2 = L When C0 = H/When C2 = H
0
∑2/∑
3
C2/C
4
∑1/∑
4
∑1/∑
3
C2/C
4
4
2
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Pin Arrangement
HD74HC283
∑
1
2
∑
2
B
2
2
B
B
2
3
16
15
V
CC
B
3
A
∑
A
B
C
GND
3
2
4
1
5
1
6
1
7
0
A
∑
A
B
C
A
2
1
1
1
0
3
∑
3
A
4
B
4
∑
4
C
4
8
14
13
12
11
10
A
3
∑
3
A
4
B
4
∑
4
9
C
4
(Top view)
3
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HD74HC283
Block Diagram
B
4
A
4
B
3
A
3
C
4
∑
4
∑
3
B
2
A
2
∑
2
B
1
A
1
C
0
∑
1
4
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HD74HC283
DC Characteristics
Ta = –40 to
Ta = 25°C
Item Symbol V
Input voltage V
IH
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 1.5 — — 1.5 — V
4.5 3.15 — — 3.15 —
6.0 4.2 — — 4.2 —
V
IL
2.0 — — 0.5 — 0.5 V
4.5 — — 1.35 — 1.35
6.0 — — 1.8 — 1.8
Output voltage V
OH
2.0 1.9 2.0 — 1.9 — V Vin = VIH or VILIOH = –20 µA
4.5 4.4 4.5 — 4.4 —
6.0 5.9 6.0 — 5.9 —
4.5 4.18 — — 4.13 — IOH = –4 mA
6.0 5.68 — — 5.63 — IOH = –5.2 mA
V
OL
2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VILIOL = 20 µA
4.5 — 0.0 0.1 — 0.1
6.0 — 0.0 0.1 — 0.1
4.5 — — 0.26 — 0.33 IOL = 4 mA
6.0 — — 0.26 — 0.33 IOL = 5.2 mA
Input current Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent supply
I
CC
6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA
current
+85°C
5
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HD74HC283
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
Ta = 25°C
Item Symbol V
Propagation delay t
time t
PLH
PHL
(V) Min Typ Max Min Max Unit Test Conditions
CC
2.0 — — 150 — 190 ns C0 to ∑
4.5 — 19 30 — 38
6.0 — — 26 — 33
t
PLH
t
PHL
2.0 — — 150 — 190 ns A1 or B1 to ∑
4.5 — 19 30 — 38
6.0 — — 26 — 33
t
PLH
t
PHL
2.0 — — 150 — 190 ns C0 to C
4.5 — 19 30 — 38
6.0 — — 26 — 33
t
PLH
t
PHL
2.0 — — 150 — 190 ns A1 or B1 to C
4.5 — 19 30 — 38
6.0 — — 26 — 33
Output rise/fall t
time t
TLH
THL
2.0 — — 75 — 95 ns
4.5 — 5 15 — 19
6.0 — — 13 — 16
Input capacitance Cin — — 5 10 — 10 pF
+85°C
1
1
4
4
6
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19.20
20.00 Max
16 9
1.3
Unit: mm
6.30
7.40 Max
81
1.11 Max
2.54 ± 0.25
0.48 ± 0.10
5.06 Max
2.54 Min
0.51 Min
Hitachi Code
JEDEC
EIAJ
Weight
7.62
+ 0.13
0.25
– 0.05
0° – 15°
(reference value)
DP-16
Conforms
Conforms
1.07 g
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16
Unit: mm
10.06
10.5 Max
9
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code
JEDEC
EIAJ
(reference value)
Weight
+ 0.20
– 0.30
1.15
0° – 8°
FP-16DA
—
Conforms
0.24 g
Page 9
16
Unit: mm
9.9
10.3 Max
9
1
1.27
0.635 Max
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
8
0.25
+ 0.11
– 0.04
0.14
0.15
3.95
1.75 Max
M
6.10
1.08
0.20 ± 0.03
*0.22 ± 0.03
0.60
Hitachi Code
JEDEC
EIAJ
Weight
+ 0.10
– 0.30
0° – 8°
+ 0.67
– 0.20
(reference value)
FP-16DN
Conforms
Conforms
0.15 g
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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