Datasheet HD74ALVCH16269 Datasheet (HIT)

Page 1
HD74ALVCH16269
12-bit to 24-bit Registered Bus Transceivers
with 3-state Outputs
ADE-205-136 (Z)
Preliminary 1st. Edition
May 1996
Description
The HD74ALVCH16269 is used in applications where two separate ports must be multiplexed onto, or demultiplexed from, a single port. The device is particularly suitable as an interface between synchronous DRAMs and high speed microprocessors. Data is stored in the internal B port registers on the low to high transition of the clock (CLK) input when the appropriate clock enable (CLKENA) inputs are low. Proper control of these inputs allows two sequential 12-bit words to be presented as a 24-bit word on the B port. For data transfer in the B to A direction, a single storage register is provided. The select ( SEL) line selects 1B or 2B data for the A outputs. The register on the A output permits the fastest possible data transfer, thus extending the period that the data is valid on the bus. The control terminals are registered so that all transactions are synchronous with CLK. Data flow is controlled by the active low output enables (OEA, OEB1, OEB2). Active bus hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
Features
• VCC = 2.3 V to 3.6 V
• Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C)
• Typical VOH undershoot > 2.0 V (@VCC = 3.3 V, Ta = 25°C)
• High output current ±24 mA (@VCC = 3.0 V)
• Bus hold on data inputs eliminates the need for external pullup / pulldown resistors
Page 2
HD74ALVCH16269
Function Table
Inputs Outputs CLK OEA OEB A 1B, 2B
↑ HHZ Z ↑ H L Z Active ↑ L H Active Z ↑ L L Active Active
Output enable
Inputs Outputs CLKENA1 CLKENA2 CLK A 1B 2B
HHXX1B
*1
0
LX↑LL X LX↑HH X XL↑LX L XL↑HX H
A-to-B storage (OEB = L)
2B0
*1
Inputs Output A CLK SEL 1B 2B
XHXX A XLXX A
*1
0
*1
0
↑ HLX L ↑ HHX H ↑ LXL L ↑LXH H
B-to-A storage (OEA = L)
H : High level L : Low level X : Immaterial Z : High impedance ↑ : Low to high transition Note: 1. Output level before the indicated steady state input conditions were established.
Page 3
Pin Arrangement
HD74ALVCH16269
OEA
OEB1
2B3
GND
2B2 2B1
V
CC
A1 A2
A3
GND
A4 A5
A6 A7
A8 A9
GND
A10 A11 A12 V
CC
1B1 1B2
GND
1B3
NC
SEL
10 11
12 13 14
15 16
17 18
19
20 21 22 23 24 25 26 27 28
OEB2
1 2
3 4 5
6 7
8
9
56
CLKENA2
55 54
2B4
53
GND 2B5
52 51
2B6
50
V
2B7
49
2B8
48 47
2B9
46
GND 2B10
45
2B11
44 43
2B12
42
1B12 1B11
41
1B10
40
GND
39 38
1B9 1B8
37
1B7
36 35
V
34
1B6
33
1B5
32
GND
31
1B4
30
CLKENA1
29
CLK
CC
CC
(Top view)
Page 4
HD74ALVCH16269
Absolute Maximum Ratings
Item Symbol Ratings Unit Conditions
Supply voltage V Input voltage
Output voltage
*1, 2
*1, 2
Input clamp current I Output clamp current I Continuous output current I
Maximum power dissipation at Ta = 55°C (in still air)
*3
CC
V
I
V
O
IK
OK
O
P
T
Storage temperature Tstg –65 to 150 °C Notes: Stresses beyond those listed under “absolute maximum ratings” may cause permanent
damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
1. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
–0.5 to 4.6 V –0.5 to 4.6 V Except I/O ports –0.5 to VCC +0.5 I/O ports –0.5 to VCC +0.5 V –50 mA VI < 0
±50 mA VO < 0 or VO > V ±50 mA VO = 0 to V
CC
±100 1 W TSSOP
CC
Recommended Operating Conditions
Item Symbol Min Max Unit Conditions
Supply voltage V Input voltage V Output voltage V High level output current I
Low level output current I
CC
I
O
OH
OL
Input transition rise or fall rate ∆t / ∆v 0 10 ns / V Operating temperature Ta –40 85 °C
Note: Unused control inputs must be held high or low to prevent them from floating.
2.3 3.6 V 0VCCV 0VCCV — –12 mA VCC = 2.3 V — –12 VCC = 2.7 V — –24 VCC = 3.0 V —12mAV —12 V —24 V
= 2.3 V
CC
= 2.7 V
CC
= 3.0 V
CC
Page 5
Logic Diagram
HD74ALVCH16269
CLK
OEB1
OEB2
CLKENA1
CLKENA2
SEL
OEA
A1
29
2
56
30
55
28
1
1D
C1
8
C1
1D
C1
1D
CE
C1
1D
CE
C1
1D
1 of 12 Channels
G1
C1
1D
C1
1D
23
1
1
1B1
6
2B1
Page 6
HD74ALVCH16269
Electrical Characteristics (Ta = –40 to 85°C)
Item Symbol V
Input voltage V
IH
(V) *1Min Max Unit Test Conditions
CC
2.3 to 2.7 1.7 — V
2.7 to 3.6 2.0 —
V
2.3 to 2.7 — 0.7
IL
2.7 to 3.6 — 0.8
Output voltage V
Min to Max VCC–0.2 — V IOH = –100 µA
OH
2.3 2.0 — IOH = –6 mA, VIH = 1.7 V
2.3 1.7 — IOH = –12 mA, VIH = 1.7 V
2.7 2.2 — IOH = –12 mA, VIH = 2.0 V
3.0 2.4 — IOH = –12 mA, VIH = 2.0 V
3.0 2.0 — IOH = –24 mA, VIH = 2.0 V
V
Min to Max — 0.2 IOL = 100 µA
OL
2.3 — 0.4 IOL = 6 mA, VIL = 0.7 V
2.3 — 0.7 IOL = 12 mA, VIL = 0.7 V
2.7 — 0.4 IOL = 12 mA, VIL = 0.8 V
3.0 — 0.55 IOL = 24 mA, VIL = 0.8 V
Input current I
IN
I
IN (hold)
3.6 — ±5 µAVIN = VCC or GND
2.3 45 — VIN = 0.7 V
2.3 –45 — VIN = 1.7 V
3.0 75 — VIN = 0.8 V
3.0 –75 — VIN = 2.0 V
3.6 — ±500 VIN = 0 to 3.6 V Off state output current *2I Quiescent supply current I
OZ
CC
∆I
3.6 — ±10 µAV
= VCC or GND
OUT
3.6 — 40 µAVIN = VCC or GND
3.0 to 3.6 — 750 µAVIN = one input at (VCC–0.6)
CC
V, other inputs at V
or GND
CC
Notes: 1. For conditions shown as Min or Max, use the appropriate values under recommended
operating conditions.
2. For I/O ports, the parameter I
includes the input leakage current.
OZ
Page 7
HD74ALVCH16269
Switching Characteristics (Ta = –40 to 85°C)
Item Symbol VCC (V) Min Typ Max Unit FROM
(Input)TO(Output)
Maximum clock frequency f
Propagation delay time t
Output enable time t
Output disable time t
Input capacitance C Output capacitance C
max
PLH
t
PHL
ZH
t
ZL
HZ
t
LZ
IN
IN / O
2.5±0.2 135 — — MHz
2.7 135 — —
3.3±0.3 135 — —
2.5±0.2 1.0 — 8.8 ns CLK B
2.7 — — 7.3
3.3±0.3 1.0 — 6.2
2.5±0.2 1.0 — 7.0 A
2.7 — — 5.8
3.3±0.3 1.0 — 5.0
2.5±0.2 1.0 — 8.4 ns CLK B
2.7 — — 6.7
3.3±0.3 1.0 — 6.1
2.5±0.2 1.0 — 8.1 A
2.7 — — 6.2
3.3±0.3 1.0 — 5.9
2.5±0.2 1.4 — 8.3 ns CLK B
2.7 — — 6.9
3.3±0.3 1.0 — 6.1
2.5±0.2 1.5 — 7.7 A
2.7 — — 6.8
3.3±0.3 1.0 — 5.6
3.3 — 3.5 — pF Control inputs
3.3 — 9.0 — pF A or B ports
Page 8
HD74ALVCH16269
Item Symbol VCC (V) Min Typ Max Unit FROM (Input)
Setup time t
Hold time t
Pulse width t
su
h
w
2.5±0.2 2.0 — — ns A data before CLK↑
2.7 2.0 — —
3.3±0.3 1.7 — —
2.5±0.2 2.2 — — B data before CLK↑
2.7 2.1 — —
3.3±0.3 1.8 — —
2.5±0.2 1.6 — — SEL before CLK↑
2.7 1.6 — —
3.3±0.3 1.3 — —
2.5±0.2 1.0 — — CLKENA1 or
2.7 1.2 — — CLKENA2 before CLK↑
3.3±0.3 0.9 — —
2.5±0.2 1.5 — — OE before CLK↑
2.7 1.6 — —
3.3±0.3 1.3 — —
2.5±0.2 0.7 — — ns A data after CLK↑
2.7 0.6 — —
3.3±0.3 0.6 — —
2.5±0.2 0.7 — — B data after CLK↑
2.7 0.6 — —
3.3±0.3 0.6 — —
2.5±0.2 1.1 — — SEL aftrer CLK↑
2.7 0.7 — —
3.3±0.3 0.7 — —
2.5±0.2 1.0 — — CLKENA1 or
2.7 0.8 — — CLKENA2 after CLK↑
3.3±0.3 1.1 — —
2.5±0.2 0.8 — — OE after CLK↑
2.7 0.8 — —
3.3±0.3 0.8 — —
2.5±0.2 3.3 — — ns CLK “H” or “L”
2.7 3.3 — —
3.3±0.3 3.3 — —
Page 9
• Test Circuit
500 Ω
HD74ALVCH16269
See under table
S1
OPEN
*1
L
500 ΩC = 50 pF
GND
Load Circuit for Outputs
Symbol
t / t
PLH PHL
t / t / t
su h w
t / t
ZH HZ
t / t
ZL LZ
Note: 1. C includes probe and jig capacitance.
L
Vcc=2.5±0.2V
OPEN
GND
4.6 V 6.0 V
Vcc=2.7V,
3.3±0.3V
OPEN
GND
Page 10
HD74ALVCH16269
• Waveforms – 1
Input
Output
• Waveforms – 2
Timing Input
Data Input
Input
10 %
tr
V
90 %
ref
t
PLH
90 %
V
ref
tf
V
IH
V
ref
10 %
t
PHL
V
ref
GND
V
OH
V
OL
tr
V
90 %
V
ref
10 %
t
su
V
ref
t
h
V
ref
IH
GND
V
IH
GND
t
w
V
IH
V
ref
V
ref
GND
Page 11
HD74ALVCH16269
• Waveforms – 3
trtf
Output Control
Waveform - A
Waveform - B
90 %
V
ref
10 % 10 %
t
ZL
V
ref
t
ZH
V
ref
Notes: 1. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Zo = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
2. Waveform – A is for an output with internal conditions such that the output is low except when disabled by the output control.
3. Waveform – B is for an output with internal conditions such that the output is high except when disabled by the output control.
4. The output are measured one at a time with one transition per measurement.
V
90 %
ref
t
t
HZ
LZ
TEST
V
IH
V
ref
V
OH1
V
OL1
V + 0.3 V
OL
V – 0.3 V
OH
Vcc=2.5±0.2V
2.3 V 2.7 V
1.2 V 1.5 V
2.3 V 3.0 V GND
V
GND
≈V
V V
≈V
Vcc=2.7V,
3.3±0.3V
GND
IH
OH1
OL
OH
OL1
Page 12
HD74ALVCH16269
Package Dimensions
14.00
56
128
+0.1
0.20
–0.05
+0.3 –0.1
0.50
0.08
M
29
+0.3
–0.1
6.10
Unit : mm
0.40 Max
0.10
0.05 ± 0.05
1.2 Max
8.10 ± 0.3
0.15 ± 0.05
Hitachi code
JEDEC code
0.50 ± 0.1
EIAJ code
10° Max
TTP-56D
— —
Page 13
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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