Datasheet HD74AC273 Datasheet (HIT)

Page 1
HD74AC273
Octal D Flip-Flop
Description
The HD74AC273 has eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered Clock (CP) and Master Reset (MR) inputs load and reset (clear) all flip-flops simultaneously.
The register is fully edge-triggered. The state of each D input, one setup time before the Low-to-High clock transition, is transferred to the corresponding flip-flops’s Q output
Features
• Ideal Buffer for MOS Microprocessor or Memory
• Eight Edge-Triggered D Flip-Flops
• Buffered Common Clock
• Buffered, Asynchronous Master Reset
• See HD74AC373 for Transparent Latch Version
• See HD74AC374 for 3-State Version
• Outputs Source/Sink 24 mA
Page 2
HD74AC273
Pin Arrangement
MR
1
20
V
CC
Logic Symbol
2
0
Q
D0
3
D1
4
Q1
5
Q2
6
7
D2
D3
8
Q3
9
10 11
Gnd
(Top view)
19
18
17
16
15
14
13
12
Q7
D7
D6
Q6
Q5
D
D4
Q4
CP
5
Pin Names
D0 – D7Data Inputs MR Master Reset CP Clock Pulse Input Q0 – Q7Data Outputs
2
D0 D1 D2 D3 D4 D5 D6 D7
CP MR
Q
0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
Page 3
Logic Diagram
D0 D1 D2 D3 D4 D5 D6 D7
CP
HD74AC273
MR
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
DQ
CP
D
R
Q7Q6Q5Q4Q3Q2Q1Q0
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
Mode Select-Truth Table
Inputs Outputs
Operating Mode MR CP D
n
Reset (Clear) L X X L Load “1” H HH Load “0” H LL
H : High Voltage Level L : Low Voltage Level X : Immaterial
: Low-to-High Clock Transition
Q
n
DC Characteristics (unless otherwise specified)
Item Symbol Max Unit Condition
Maximum quiescent supply current I
Maximum quiescent supply current I
CC
CC
80 µAV
8.0 µAV
= VCC or ground, VCC = 5.5 V,
IN
Ta = Worst case
= VCC or ground, VCC = 5.5 V,
IN
Ta = 25°C
3
Page 4
HD74AC273
AC Characteristics: HD74AC273
Item Symbol V
Maximum clock f
max
Ta = +25°C C
= 50 pF
L
(V)*1Min Typ Max Min Max Unit
CC
3.3 90 125 — 75 — MHz
Ta = –40°C to +85°C CL = 50 pF
frequency 5.0 140 175 — 125 — Propagation delay t
PLH
3.3 1.0 7.0 12.5 1.0 14.0 ns Clock to output 5.0 1.0 5.5 9.0 1.0 10.0 Propagation delay t
PHL
3.3 1.0 7.0 13.0 1.0 14.5 ns Clock to output 5.0 1.0 5.0 10.0 1.0 11.0 Propagation delay t
PHL
3.3 1.0 7.0 13.0 1.0 14.0 ns MR to output 5.0 1.0 5.0 10.0 1.0 10.5
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
AC Operating Requirements: HD74AC273
Ta = –40°C
Ta = +25°C C
= 50 pF
L
Item Symbol V
Setup time, HIGH or LOW t
su
(V)*1Typ Guaranteed Minimum Unit
CC
3.3 3.5 5.5 6.0 ns Data to CP 5.0 2.5 4.0 4.5 Hold time, HIGH or LOW t
h
3.3 –2.0 0.0 0.0 ns Data to CP 5.0 –1.0 1.0 1.0 Clock pulse width t
w
3.3 3.5 5.5 6.0 ns HIGH or LOW 5.0 2.5 4.0 4.5 MR Pulse width t
w
3.3 2.0 5.5 6.0 ns HIGH or LOW 5.0 1.5 4.0 4.5 Recovery time t
rec
3.3 1.5 3.5 4.5 ns MR to CP 5.0 1.0 2.0 3.0
Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V
Voltage Range 5.0 is 5.0 V ± 0.5 V
to +85°C CL = 50 pF
4
Page 5
HD74AC273
Capacitance
Item Symbol Typ Unit Condition
Input capacitance C Power dissipation capacitance C
IN
PD
4.5 pF VCC = 5.5 V
50.0 pF VCC = 5.0 V
5
Page 6
24.50
25.40 Max
Unit: mm
1120
6.30
1
0.89
1.27 Max
2.54 ± 0.25
1.30
10
0.48 ± 0.10
7.00 Max
0.51 Min
2.54 Min 5.08 Max
Hitachi Code JEDEC EIAJ Weight
7.62
+ 0.11
0.25
– 0.05
0° – 15°
(reference value)
DP-20N — Conforms
1.26 g
Page 7
20
Unit: mm
12.6
13 Max
11
5.5
1
0.80 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.10 ± 0.10
0.15
M
2.20 Max
7.80
0.20 ± 0.04
*0.22 ± 0.05
0.70 ± 0.20
Hitachi Code JEDEC EIAJ Weight
(reference value)
+ 0.20 – 0.30
1.15
0° – 8°
FP-20DA — Conforms
0.31 g
Page 8
20
Unit: mm
12.8
13.2 Max 11
7.50
1
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*Dimension including the plating thickness
Base material dimension
10
0.12
0.20 ± 0.10
0.15
2.65 Max
M
10.40
0.25 ± 0.04
*0.27 ± 0.05
0.70
Hitachi Code JEDEC EIAJ Weight
+ 0.25 – 0.40
1.45
+ 0.57 – 0.30
(reference value)
0° – 8°
FP-20DB Conforms —
0.52 g
Page 9
20 11
110
+0.08
*0.22
–0.07
0.20 ± 0.06
6.50
6.80 Max
0.65 Max
0.65
0.13
Unit: mm
4.40
1.0
M
6.40 ± 0.20
0.10
1.10 Max
*Dimension including the plating thickness
Base material dimension
0.15 ± 0.04
*0.17 ± 0.05
+0.03
–0.04
0.07
0° – 8°
Hitachi Code JEDEC EIAJ
(reference value)
Weight
0.50 ± 0.10
TTP-20DA — —
0.07 g
Page 10
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223
Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533
Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Loading...